by means of an interlayer consisting of an organic adhesive, e.g. phenol resin or pitch

by means of an interlayer consisting of an organic adhesive, e.g. phenol resin or pitch · Cooperative Patent Classification (CPC)

Chemical and metallurgical processes, compounds, and materials.

Related technology areas

Mapped technology topics for this CPC code.

CPC classification statistics
MetricValue
CPC codeC04B37/008
Official title{by means of an interlayer consisting of an organic adhesive, e.g. phenol resin or pitch}
Display labelby means of an interlayer consisting of an organic adhesive, e.g. phenol resin or pitch
Total patents163

Filing trend

Year-over-year patent counts classified under this CPC code.

Filing activity over the last five years is stable.

Patents filed per year
YearPatents
201518
201619
201718
201815
20198
202021
202111
202210
202312
202418
202511
20262

Representative patents

Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.

Frequently asked questions

Answers are generated from the same data shown on this page.

What is CPC C04B37/008?
CPC C04B37/008 is the Cooperative Patent Classification code for “by means of an interlayer consisting of an organic adhesive, e.g. phenol resin or pitch.”
How many patents are filed under CPC C04B37/008 (by means of an interlayer consisting of an organic adhesive, e.g. phenol resin or pitch)?
Our database includes 163 publications tagged with this CPC code.
Is patent activity under CPC C04B37/008 growing?
Publication counts under this code: 18 in 2024 vs 11 in 2025 (latest complete years).