Electronics housing assembly
US-2024397637-A1 · Nov 28, 2024 · US
Inverter device
US9474189B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9474189-B2 |
| Application number | US-201214397913-A |
| Country | US |
| Kind code | B2 |
| Filing date | May 23, 2012 |
| Priority date | May 23, 2012 |
| Publication date | Oct 18, 2016 |
| Grant date | Oct 18, 2016 |
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- Title
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- Abstract
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- First independent claim
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Abstract
Official abstract text for this publication.
An inverter device includes a heat dissipation casing having a principal surface, heat dissipation fins arranged on an opposite side to the principal surface, a first concave portion provided adjacent to a region corresponding to the heat dissipation fins on the principal surface, and a second concave portion provided adjacent to the region corresponding to the heat dissipation fins on the principal surface, a semiconductor module arranged in the region corresponding to the heat dissipation fins on the principal surface and including a diode module and an inverter module, an inrush-current suppression resistor sealed by a sealing material in the first concave portion and electrically connected between the diode module and the inverter module, and a regenerative resistor sealed by the sealing material in the second concave portion and electrically connected between the diode module and the inverter module.
First claim
Opening claim text (preview).
The invention claimed is: 1. An inverter device comprising: a heat dissipation casing including a principal surface, heat dissipation fins arranged on an opposite side of the principal surface, a first concave portion provided adjacent to a region corresponding to the heat dissipation fins on the principal surface, and a second concave portion provided adjacent to the region corresponding to the heat dissipation fins on the principal surface; a semiconductor module arranged in the region corresponding to the heat dissipation fins on the principal surface and including a diode module and an inverter module; an inrush-current suppression resistor sealed by a sealing material in the first concave portion and electrically connected between the diode module and the inverter module; and a regenerative resistor sealed by the sealing material in the second concave portion and electrically connected between the diode module and the inverter module. 2. The inverter device according to claim 1 , wherein the heat dissipation casing is integrally molded by aluminum die-casting. 3. The inverter device according to claim 1 , further comprising: a first temperature sensor sealed by the sealing material in the first concave portion to detect a temperature of the inrush-current suppression resistor; and a second temperature sensor sealed by the sealing material in the second concave portion to detect a temperature of the regenerative resistor. 4. The inverter device according to claim 1 , wherein the semiconductor module further includes a first terminal pin connected to the diode module, a second terminal pin connected to the inverter module, a third terminal pin connected to the diode module, and a fourth terminal pin connected to the inverter module, the first terminal pin and the second terminal pin extend from the semiconductor module to inside of the first concave portion, and are connected to opposite ends of the inrush-current suppression resistor, and the third terminal pin and the fourth terminal pin extend from the semiconductor module to inside of the second concave portion, and are connected to opposite ends of the regenerative resistor.
Assignees
Inventors
Classifications
- H05K7/20418Primary
the radiating structures being additional and fastened onto the housing · CPC title
Heat transfer by conduction from internal heat source to heat radiating structure (H05K7/20909 takes precedence) · CPC title
- H02M7/003Primary
Constructional details, e.g. physical layout, assembly, wiring or busbar connections · CPC title
Hermetically-sealed casings {(specially adapted for small components H05K5/0095)} · CPC title
Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing · CPC title
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Frequently asked questions
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- What does patent US9474189B2 cover?
- An inverter device includes a heat dissipation casing having a principal surface, heat dissipation fins arranged on an opposite side to the principal surface, a first concave portion provided adjacent to a region corresponding to the heat dissipation fins on the principal surface, and a second concave portion provided adjacent to the region corresponding to the heat dissipation fins on the prin…
- Who is the assignee on this patent?
- Kawauchi Yuki, Matsuda Kensaku, Mitsubishi Electric Corp
- What technology area does this patent fall under?
- Primary CPC classification H05K7/20418. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Oct 18 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).