Laser systems and methods for internally marking thin layers, and articles produced thereby

Patent metadata

Field	Value
Publication number	US-9463528-B2
Application number	US-201414461171-A
Country	US
Kind code	B2
Filing date	Aug 15, 2014
Priority date	Aug 16, 2013
Publication date	Oct 11, 2016
Grant date	Oct 11, 2016

Abstract

Laser output ( 114 ) is employed to mark an article ( 100 ) including a layer ( 104 ) supported by a substrate ( 102 ), wherein the layer ( 104 ) has a thickness (t) that is less than or equal to 50 microns. The laser output ( 114 ) is focused to a numerical aperture diffraction-limited spot size ( 32 ) of less than or equal to 5 microns at a focal point ( 80 ) of the beam waist ( 90 ) and directed into the layer ( 104 ) to form a plurality of structures comprising a plurality of laser-induced cracks within the layer ( 104 ) and within a region of the article ( 100 ), wherein the laser-induced cracks terminate within the layer ( 104 ) without extending to the substrate ( 102 ) or an outer surface ( 108 ) of the layer ( 104 ), and wherein the plurality of structures are configured to scatter light incident upon the article ( 100 ).

First claim

The invention claimed is:

1. A method for marking an article including a substrate and a layer supported by the substrate, wherein the layer has an inner surface and an outer surface, and wherein the outer surface has a farther distance to the substrate and the inner surface has a closer distance to the substrate, the method comprising:
generating a beam of laser output having a beam waist;
directing a focal point of the laser output between the inner surface and outer surface of the layer with an energy density at the focal point sufficient to form a plurality of structures within a region of the article, within the layer, and spaced apart from an article outer surface of the article, wherein the layer has a thickness between the inner surface and the outer surface that is less than or equal to 100 microns, and wherein the plurality of structures are configured to scatter light incident upon the outer surface of the layer.

2. The method of claim 1 , wherein the thickness between the inner surface and the outer surface is less than or equal to 50 microns.

3. The method of claim 1 , wherein the plurality of structures constitute a mark having an optical density with an L* value that is greater than or equal to about 60.

4. The method of claim 3 , wherein the plurality of structures constitute a mark having an optical density with an L* value that is greater than or equal to about 80.

5. The method of claim 1 , wherein the substrate comprises a metal, wherein the layer comprises an oxide, wherein the plurality of structures comprise a plurality of features that scatter light within the region of the article.

6. The method of claim 1 , wherein the focal spot is positioned greater than 2 microns away from both the inner surface and the outer surface.

7. The method of claim 1 , wherein the laser pulses impinge upon the article with a positional separation in a range from about 0.2 μm to about 2.5 μm.

8. The method of claim 1 , wherein the beam of laser output is directed at the substrate at an angle of incidence that is greater than or equal to 30 degrees.

9. The method of claim 1 , wherein the layer is undyed.

10. The method of claim 1 , wherein the spot size is numerical aperture diffraction-limited.

11. The method of claim 1 , wherein the beam waist of the laser output exhibits divergence away from the focal point that is so rapid that the energy density at the outer surface and the inner surface is sufficiently smaller than at the focal point such that the energy density at the outer surface and the inner surface is insufficient to permanently change the outer surface and the inner surface.

12. A laser system for marking an article including a substrate and a layer supported by the substrate, wherein the layer has an inner surface and an outer surface, and wherein the outer surface has a farther distance to the substrate and the inner surface has a closer distance to the substrate, the laser system comprising:
a laser configured to generate laser light;
a beam modification system configured to modify the laser light;
a lens configured to focus the laser light to a numerical aperture diffraction-limited spot size of less than or equal to 5 microns at a focal point;
a height control mechanism to adjust the height of the focal point with respect to the inner surface, the outer surface, or the substrate; and
a controller configured to control an operation of at least one of the laser, the height control mechanism, and the beam modification system such that the focal point of the laser light is directed between the inner surface and outer surface of the layer, which has a thickness between the inner surface and the outer surface that is less than or equal to 50 microns, to form a plurality of structures within a region of the article, within the layer, and spaced apart from an article outer surface of the article and such that the plurality of structures are configured to scatter light incident upon the region of the article.

13. The laser system of claim 11 , wherein the thickness between the inner surface and the outer surface is less than or equal to 30 microns.

14. The laser system of claim 11 , wherein the plurality of structures constitute a mark having an optical density with an L* value that is greater than or equal to about 70.

15. The laser system of claim 14 , wherein the plurality of structures constitute a mark having an optical density with an L* value that is greater than or equal to about 80.

16. The laser system of claim 11 , wherein the substrate comprises a metal, wherein the layer comprises an oxide, wherein the plurality of structures comprise a plurality of cracks within the region of the article.

17. The laser system of claim 11 , wherein the focal spot is controlled within a height accuracy of 2 microns within the layer.

18. The laser system of claim 11 , wherein the scan lens has a numerical aperture in a range from 0.3 to 0.8.

19. The laser system of claim 11 , wherein the beam of laser output is directed at the substrate at an angle of incidence that is greater than or equal to 30 degrees.

20. The laser system of claim 11 , wherein the layer is undyed.

21. The laser system of claim 11 , wherein the spot size is numerical aperture diffraction-limited.

22. An article having a mark made with a laser, comprising:
a substrate comprising a metal;
a layer supported by the substrate and comprising an oxide, wherein the layer is undyed, wherein the layer has an inner surface and an outer surface, wherein the outer surface has a farther distance to the substrate and the inner surface has a closer distance to the substrate, and wherein the layer has a thickness between the inner surface and the outer surface that is less than or equal to 50 microns; and
a plurality of structures comprising a plurality of laser-induced features between the inner surface and outer surface of the layer and within the region of the article and within the layer, wherein the feature include one or more of laser-induced cracks, laser induced changes in index in refraction, and laser-induced voids, wherein the features terminate within the layer without extending to the outer surface or the substrate, and wherein the plurality of structures are configured to scatter light incident upon the region of the layer.

23. The article of claim 22 , wherein the plurality of structures constitute a mark having an optical density with an L* value that is greater than or equal to about 70.

24. The method of claim 1 , wherein the focal spot is positioned greater than 5 microns away from both the inner surface and the outer surface.

25. The method of claim 1 , wherein height control feed back is employed to control the height of the focal spot within the layer.

26. The method of claim 1 , wherein a major spatial axis the beam waist is greater than a factor of 110% per micron distance along the beam axis from the focal spot.

27. The method of claim 1 , wherein the laser output is focused though a lens having a numerical aperture in a range from 0.3 to 0.8.

Assignees

• Electro Scient Ind Inc

Inventors

• Reichenbach Robert
• Yang Chuan
• Shan Fang

Classifications

• B23K26/0624 Primary

  using ultrashort pulses, i.e. pulses of 1 ns or less · CPC title

• B23K2203/56

  Operations & Transport · mapped topic

• B23K26/083

  Devices involving movement of the workpiece in at least one axial direction · CPC title

• B23K2203/08

  Operations & Transport · mapped topic

• B23K26/0006

  taking account of the properties of the material involved (B23K26/32, B23K26/40 take precedence) · CPC title