Cu-Co-Si-based copper alloy for electronic materials, and method of manufacturing same

Patent metadata

Field	Value
Publication number	US-9460825-B2
Application number	US-201113701267-A
Country	US
Kind code	B2
Filing date	Apr 8, 2011
Priority date	May 31, 2010
Publication date	Oct 4, 2016
Grant date	Oct 4, 2016

Abstract

Disclosed is a Cu—Co—Si-based copper alloy for electronic materials, which is capable of achieving high levels of strength, electrical conductivity, and also anti-setting property; and contains 0.5 to 3.0% by mass of Co, 0.1 to 1.0% by mass of Si, and the balance of Cu and inevitable impurities; wherein out of second phase particles precipitated in the matrix a number density of the particles having particle size of 5 nm or larger and 50 nm or smaller is 1×10 12 to 1×10 14 particles/mm 3 , and a ratio of the number density of particles having particle size of 5 nm or larger and smaller than 10 nm relative to the number density of particles having particle size of 10 nm or larger and 50 nm or smaller is 3 to 6.

First claim

The invention claimed is:

1. A copper alloy for electronic materials which consists of 0.5 to 3.0% by mass of Co, 0.1 to 1.0% by mass of Si, optionally a maximum of 2.5% by mass of Ni, optionally a maximum of 0.5% by mass of Cr, optionally a maximum of 2.0% by mass in total of one or more selected from the group consisting of Mg, P, As, Sb, Be, B, Mn, Sn, Zr, Al, Fe, Zn and Ag, and the balance of Cu and inevitable impurities wherein out of second phase particles precipitated in the matrix of the alloy a number density of the particles having particle size of 5 nm or larger and 50 nm or smaller is 1×10 12 to 1×10 14 particles/mm 3 , and a ratio of the number density of particles having particle size of 5 nm or larger and smaller than 10 nm relative to the number density of particles having particle size of 10 nm or larger and 50 nm or smaller is 3 to 6.

2. The copper alloy for electronic materials according to claim 1 ,
wherein the number density of second phase particles having particle sizes of 5 nm or larger and smaller than 10 nm is 2×10 12 to 7×10 13 , and the number density of second phase particles having particle sizes of 10 nm or larger and 50 nm or smaller is 3×10 11 to 2×10 13 .

3. The copper alloy for electronic materials according to claim 1 , having an MBR/t value of 2.0 or smaller, the value being defined by a ratio of minimum bend radius (MBR) not causative of crack to thickness of specimen (t) when tested by a W-bend test in the bad-way direction, in accordance with JIS H3130.

4. The copper alloy for electronic materials according to claim 1 , further containing a maximum of 2.5% by mass of Ni.

5. The copper alloy for electronic materials according to claim 1 , further containing a maximum of 0.5% by mass of Cr.

6. The copper alloy for electronic materials according to claim 1 , further containing a maximum of 2.0% by mass in total of one or more selected from the group consisting of Mg, P, As, Sb, Be, B, Mn, Sn, Zr, Al, Fe, Zn and Ag.

7. A method of manufacturing a copper alloy for electronic materials according to claim 1 , comprising the sequential steps of:
(1) melting and casting of an ingot represented by any one composition according to claim 1 ;
(2) heating the material from step (1) at 950° C. or above and 1050° C. or below for one hour or more, followed by hot rolling;
(3) optionally cold rolling the material from step (2);
(4) performing solution treatment while heating the material from step (3) at 850° C. or above and 1050° C. or below;
(5) first ageing while heating the material from step (4) at 400° C. or above and 600° C. or below for 1 to 12 hours, where the temperature is adjusted to 400° C. or above and 500° C. or below for an ingot containing 1.0 to 2.5% by mass of Ni;
(6) cold rolling the material from step (5) at a rolling reduction of 10% or more; and
(7) second ageing while heating the material from step (6) at 300° C. or above and 400° C. or below for 3 to 36 hours, the time of heating being 3 to 10 times as long as that in the first ageing;
wherein all steps of said method take place in the order indicated.

8. The method of manufacturing a copper alloy for electronic materials according to claim 7 ,
wherein the rolling reduction in cold rolling step (6) is 10 to 50%.

9. A wrought copper product made of a copper alloy for electronic materials according to claim 1 .

10. An electronic component comprising a copper alloy for electronic materials according to claim 1 .

Assignees

• Kuwagaki Hiroshi
• Jx Nippon Mining & Metals Corp

Inventors

• Kuwagaki Hiroshi

Classifications

• H01B1/026 Primary

  Alloys based on copper · CPC title

• C22C9/06

  with nickel or cobalt as the next major constituent · CPC title

• C22C9/05

  with manganese as the next major constituent · CPC title

• C22C9/01

  with aluminium as the next major constituent · CPC title

• C22F1/00

  Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working (apparatus for mechanical working of metal B21, B23, B24) · CPC title