Mechanically produced alignment fiducial method and device

Patent metadata

Field	Value
Publication number	US-9459540-B2
Application number	US-201414207467-A
Country	US
Kind code	B2
Filing date	Mar 12, 2014
Priority date	Mar 12, 2013
Publication date	Oct 4, 2016
Grant date	Oct 4, 2016

Abstract

The technology disclosed relates to methods and systems that can be used to reduce visible artifacts know as mura. In particular, it relates to producing alignment marks by physically modifying appearance of a layer of exposure or radiation sensitive material on a workpiece, then using those alignment marks or transferred direct or inverted images of those marks to realign a writing coordinate system between exposure writing passes, following physical movement of the workpiece within the writing system. The physical modifications described include mechanically pressing a mark into the layer, using a laser to ash or ablate the layer, or applying an ink or other substance to the surface of the laser.

First claim

I claim as follows:

1. A method of aligning a workpiece between two exposure patterning operations, the method including:
forming fiducials by mechanical indentation using a point and a ram in an exposure sensitive layer on a workpiece to expose a first patterning layer underlying the exposure sensitive layer on the workpiece;
measuring and recording first position information of the fiducials relative to a pattern of a first exposure in a first coordinate system, wherein the first coordinate system is used by a writing system to apply the first exposure to the workpiece;
physically moving the workpiece and repositioning it in the writing system;
measuring and recording second position information of the fiducials or of a transfer from the fiducials onto another layer of the workpiece;
using the second position information to align a second coordinate system relative to the first coordinate system; and
applying a second exposure to the workpiece using the second coordinate system.

2. The method of claim 1 , wherein the mechanical indentation forms the fiducials in a polymer layer of photoresist.

3. The method of claim 1 , wherein the mechanical indentation at least partially penetrates the first patterning layer.

4. The method of claim 1 , wherein the workpiece is physically removed from the writing system and subject to processing steps between writing of exposures on two pattern layers.

5. The method of claim 1 , wherein the workpiece is physically removed from the writing system between the writing of two exposures of the exposure sensitive layer and etched, wherein the etching transfers the fiducials or an inverted pattern from the fiducials onto a patterning layer underlying the exposure sensitive layer.

6. The method of claim 1 , wherein the workpiece is physically removed from the writing system and rotated between the writing of two exposures of the exposure sensitive layer.

7. The method of claim 1 , wherein the measuring and recording position information shares optical components with the writing of the exposures to the exposure sensitive layer(s).

8. The method of claim 1 , wherein the workpiece is a photomask, further including patterning two patterning layers and producing at least three types of transmissiveness through the workpiece and patterning layers.

9. The method of claim 1 , further including processing exposed patterns on the workpiece to produce electronic structures of a flat-panel display.

10. The method of claim 9 , wherein the electronic structures produced are transistors, light emitting diodes, plasma cells, liquid crystal shutters, or filters.

11. The method of claim 1 , further including using the second position information to compensate for distortion of the workpiece when aligning the second coordinate system relative to the first coordinate system.

12. The method of claim 1 , wherein using the second position information to align a second coordinate system relative to the first coordinate system further includes adjusting the second coordinate system for scale, orthogonality or keystone distortions of the workpiece using the second position information.

13. A system that aligns a workpiece between two exposure patterning operations, the system including:
a mechanical indentation fiducial forming station including a point and a ram that physically modifies an exposure sensitive layer to expose a first patterning layer underlying the exposure sensitive layer on the workpiece;
a stage that receives the workpiece for exposure using a writing system;
optics, a detector and a location processor that measure and record first position information of the fiducials relative to a pattern of a first exposure in a first coordinate system, wherein the first coordinate system is used by the writing system to apply the first exposure to the workpiece;
wherein the optics, detector and location processor further measure and record second position information of the fiducials or of a transfer from the fiducials onto another layer of the workpiece after repositioning of the workpiece on the stage; and
an exposure controller that uses the second position information to align a second coordinate system relative to the first coordinate system and to apply a second exposure to the workpiece using the second coordinate system.

14. The system of claim 13 , wherein the mechanical indentation fiducial forming station physically modifies a polymer layer of photoresist.

15. The system of claim 13 , wherein the mechanical indentation at least partially penetrates the first patterning layer on the workpiece underlying the exposure sensitive layer.

16. The system of claim 13 , wherein the optics, a detector and a location processor further estimate a rotation of the workpiece between the writing of two exposures of the exposure sensitive layer.

17. The system of claim 13 , wherein the optics, a detector and a location processor further estimate a rotation of the workpiece between the writing of exposures to two different exposure sensitive layers on the workpiece.

18. The system of claim 13 , wherein the optics used with the detector and the location processor are also used by writing system to apply the exposures to the exposure sensitive layer(s).

19. The system of claim 13 , wherein the workpiece is a photomask, further including patterning two patterning layers using the system produces at least three types of transmissiveness through the workpiece and patterning layers.

Assignees

• Micronic Mydata AB
• Mycronic AB

Inventors

• Sandström Torbjörn

Classifications

• G03F7/70775 Primary

  Position control, e.g. interferometers or encoders for determining the stage position · CPC title

• G03F1/42

  Alignment or registration features, e.g. alignment marks on the mask substrates · CPC title

• G03F9/7088

  Alignment mark detection, e.g. TTR, TTL, off-axis detection, array detector, video detection · CPC title

• G03F9/708 Primary

  Mark formation · CPC title