Optical device sealing structure and optical device manufacturing method

Patent metadata

Field	Value
Publication number	US-9459410-B2
Application number	US-201213433474-A
Country	US
Kind code	B2
Filing date	Mar 29, 2012
Priority date	Mar 31, 2011
Publication date	Oct 4, 2016
Grant date	Oct 4, 2016

Abstract

To provide an optical device sealing structure capable of simply sealing an optical fiber inserting portion. Provided is a structure that seals an optical device including a metallic case having an optical element disposed therein and an optical fiber inserted through a through hole of the case, wherein a Zn-containing surface is formed on a surface of a bare fiber portion that is formed by partly removing a coating of the optical fiber so as to expose a bare fiber, and wherein an Sn-containing sealing material is charged between the Zn-containing surface and an inner wall of the through hole.

First claim

What is claimed is:

1. A structure that seals an optical device including
a metallic case having an optical element disposed therein,
an optical fiber which comprises a bare fiber and a coating which covers the surface of the bare fiber, wherein the optical fiber has a bare fiber portion having a terminal end, the bare fiber portion is formed by partly removing a coating of the optical fiber so as to expose a bare fiber, and the bare fiber portion is inserted in the metallic case through a through hole of the case, and
a fiber fixture which is disposed in the case, has a connection hole, and connects a bare fiber of the optical fiber and the optical element,
wherein a Zn-containing surface is formed on a surface of the bare fiber portion, the Zn-containing surface comprising a Zn-containing solder, wherein the Zn-containing solder comprises Sn-Zn-Bi based solder or Sn-Zn-Al based solder.
wherein an Sn-containing sealing material is charged between the Zn-containing solder surface and an inner wall of the through hole such that the Sn-containing sealing material directly contacts the Zn-containing solder and the inner wall of the through hole, and
wherein the terminal end of the bare fiber portion is inserted and fixed in the connection hole.

2. The structure that seals an optical device according to claim 1 , wherein the through hole of the case is a hole which is provided in a side wall of the case.

3. The structure that seals an optical device according to claim 1 ,
wherein the structure is formed by a method comprising:
forming a bare fiber portion that is formed by partly removing a coating of the optical fiber so as to expose a bare fiber;
applying Zn-containing solder to the bare fiber portion; and
forming a Zn-containing surface on a surface of the bare fiber portion by removing the Zn-containing solder.

4. The structure that seals an optical device according to claim 3 , wherein the step of applying Zn-containing solder to the bare fiber portion includes sub steps of
dipping the bare fiber portion into a Zn-containing solder bath,
raising the bare fiber portion from the Zn-containing solder bath to attach Zn-containing solder to the bare fiber portion, and
solidifying the Zn-containing solder portion attached to the bare fiber portion, and the step of forming a Zn-containing surface on a surface of the bare fiber portion by removing the Zn-containing solder includes sub steps of:
dipping the Zn-containing solder portion attached to the bare fiber portion in a dissolution bath which includes a solution that melts the Zn-containing solder, and
raising the bare fiber portion from the dissolution bath to form a Zn film which has the Zn-containing surface.

5. The structure that seals an optical device according to claim 1 , wherein the Zn-containing surface which is formed on a surface of the bare fiber portion is a Zn-containing surface of a Zn film.

6. The structure that seals an optical device according to claim 1 , wherein the Sn-containing sealing material comprises an Sn-containing solder selected from the group consisting of: Sn—Ag-based solder, Sn—In-based solder, Sn—Ag—Cu-based solder, Sn—Cu-based solder, Sn—Ag—In-based solder and Sn—Bi-based solder.

Assignees

• Kondou Katsutoshi
• Shiroishi Masaru
• Ooto Kazuhiro
• Sumitomo Osaka Cement Co Ltd

Inventors

• Kondou Katsutoshi
• Shiroishi Masaru
• Ooto Kazuhiro

Classifications

• G02B6/245

  Removing protective coverings of light guides before coupling · CPC title

• G02B6/4248

  Feed-through connections for the hermetical passage of fibres through a package wall (see provisionally also G02B6/4428) · CPC title

• Y10T428/24273

  including aperture · CPC title

• G02B6/3644 Primary

  the coupling means being through-holes or wall apertures · CPC title