Optical element module, optical transmission module, and method of manufacturing optical transmission module

Patent metadata

Field	Value
Publication number	US-9385249-B2
Application number	US-201314104345-A
Country	US
Kind code	B2
Filing date	Dec 12, 2013
Priority date	Jul 21, 2011
Publication date	Jul 5, 2016
Grant date	Jul 5, 2016

Abstract

An optical element module includes an optical element having a light receiving unit configured to input an optical signal or a light emitting unit configured to output an optical signal, a board on which the optical element is mounted, and a guide holding member that has a through hole into which an optical fiber is configured to be inserted for inputting and outputting the optical signal to or from the light receiving unit or the light emitting unit of the optical element, and is mounted and arranged to be aligned with the optical element in a thickness direction of the board. The through hole has a cylindrical shape and has substantially the same diameter as an outer diameter of the optical fiber. A diameter of the light receiving unit or the light emitting unit is smaller than that of the optical fiber.

First claim

What is claimed is:

1. An optical element module comprising:
an optical element having a light receiving unit configured to input an optical signal or a light emitting unit configured to output an optical signal;
a board on which the optical element is mounted; and
a guide holding member that has a through hole into which an optical fiber including a core and a cladding is configured to be inserted for inputting and outputting the optical signal to or from the light receiving unit or the light emitting unit of the optical element, and is mounted and arranged to be aligned with the optical element in a thickness direction of the board; and
an adhesive disposed between the board and the guide holding member, the guide holding member being mounted on the adhesive on the board, the adhesive being hardened to fix the guide holding member to the board;
wherein the through hole has a cylindrical shape and has substantially the same diameter as an outer diameter of the optical fiber,
a diameter of the light receiving unit or the light emitting unit is smaller than that of the core of the optical fiber;
the optical element is flip-chip mounted on the board such that the light emitting unit or the light receiving unit is opposed to the board;
the guide holding member is mounted on a surface of the board opposite to where the optical element is mounted;
the board has a hole for transmitting and receiving the optical signal between the optical element and the optical fiber positioned on different surfaces;
an inner diameter of the hole is equal to or larger than an inner diameter of the through hole; and
the through hole includes an end portion facing the board and having a tapered shape.

2. The optical element module according to claim 1 , wherein an end portion of the through hole on an insertion opening side of the optical fiber has a tapered shape.

3. The optical element module according claim 1 , further comprising a projected member that projects from a mounting surface of the board where the optical element is mounted and that is formed around the hole on the mounting surface of the board.

4. The optical element module according to claim 1 , wherein a space is provided between an end face of the through hole on a side of the optical element and the light emitting unit or the light receiving unit for adjusting a distance between an end face of the optical fiber to be inserted and the light emitting unit or the light receiving unit.

5. An optical transmission module using the optical element module according to claim 1 , further comprising an optical fiber inserted into the through hole, wherein
the optical fiber is joined to the guide holding member by optically aligning one end face of the optical fiber with the light emitting unit or the light receiving unit of the optical element.

6. The optical transmission module according to claim 5 , further comprising:
a transmission module having a light emitting unit optically aligned with the other end face of the optical fiber and configured to output an optical signal to the light receiving unit of the optical element, or
a receiving module having a light receiving unit configured to input the optical signal from the light emitting unit of the optical element.

7. A method of manufacturing the optical transmission module of claim 5 , the method comprising:
mounting the optical element on a surface of the board;
mounting the guide holding member having the through hole which has a cylindrical shape and has substantially the same diameter as an outer diameter of the optical fiber, on the board after mounting the optical element on the board, by aligning a center of the light receiving unit or the light emitting unit with a center of the through hole and by arranging the guide holding member to be aligned with the optical element in a thickness direction of the board;
inserting the optical fiber into the through hole;
adjusting a distance between the one end face of the optical fiber and the light receiving unit or the light emitting unit and optically aligning the one end face of the optical fiber with the light emitting unit or the light receiving unit; and
joining the optical fiber to the guide holding member.

8. An optical element module comprising:
an optical element having a light receiving unit configured to input an optical signal or a light emitting unit configured to output an optical signal;
a board on which the optical element is mounted;
a guide holding member that has a through hole into which an optical fiber including a core and a cladding is configured to be inserted for inputting and outputting the optical signal to or from the light receiving unit or the light emitting unit of the optical element, and is mounted and arranged to be aligned with the optical element in a thickness direction of the board; and
an adhesive disposed between the board and the guide holding member to fix the guide holding member to the board,
wherein the through hole has a cylindrical shape and has substantially the same diameter as an outer diameter of the optical fiber;
a diameter of the light receiving unit or the light emitting unit is smaller than that of the core of the optical fiber;
the optical element is flip-chip mounted on the board such that the light emitting unit or the light receiving unit is opposed to the board;
the guide holding member is mounted on a surface of the board opposite to where the optical element is mounted;
the board has a hole for transmitting and receiving the optical signal between the optical element and the optical fiber positioned on different surfaces; and
the optical element module further comprising a projected member disposed between the adhesive and the hole, the projecting member projecting from a mounting surface of the board where the guide holding member is mounted to prevent the adhesive from protruding into the hole.

9. The optical element module according to claim 8 , wherein the projected member has an inner diameter and an outer diameter, the inner diameter of the projected member being at least a same diameter as a diameter of the hole.

Assignees

• Olympus Corp

Inventors

• Motohara Hiroyuki

Classifications

• H10W72/5522

  comprising gold [Au] · CPC title

• H10W72/5363

  the connected ends being wedge-shaped · CPC title

• H10W72/884

  Die-attach connectors and bond wires · CPC title

• H10W72/536

  the connected ends being ball-shaped · CPC title

• H10W72/20

  Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps · CPC title