Water removing method, optical fiber soldering method, and semiconductor laser module manufacturing method

Patent metadata

Field	Value
Publication number	US-9457415-B2
Application number	US-201414478383-A
Country	US
Kind code	B2
Filing date	Sep 5, 2014
Priority date	Mar 9, 2012
Publication date	Oct 4, 2016
Grant date	Oct 4, 2016

Abstract

A moisture removing method disclosed removes moisture contained in a dielectric film provided on one end surface of an optical fiber. This moisture removing method causes near infrared light to enter the optical fiber through the other end surface to heat moisture in the dielectric film with use of the near infrared light.

First claim

The invention claimed is:

1. A moisture removing method for removing moisture contained in a dielectric film provided on a first end surface of an optical fiber,
the moisture removing method comprising:
a heating step of causing near infrared light to enter the optical fiber through a second end surface disposed opposite to the first end surface to heat the moisture in the dielectric film with use of the near infrared light to remove the moisture in the dielectric film.

2. The moisture removing method according to claim 1 ,
wherein
the heating step is performed in an atmosphere that has a dew point lower than a dew point of the surrounding atmosphere.

3. The moisture removing method according to claim 2 ,
wherein
the heating step is performed in an atmosphere that has the dew point lower than the dew point of the surrounding atmosphere and that has an oxygen concentration lower than an oxygen concentration of the surrounding atmosphere.

4. The moisture removing method according to claim 1 ,
wherein
the heating step is a step of causing the near infrared light to enter a core of the optical fiber through the second end surface to heat the moisture in the dielectric film with use of the near infrared light having propagated through the core.

5. An optical fiber soldering method for soldering an optical fiber having a first end surface provided with a dielectric film to another member,
the optical fiber soldering method comprising:
a removing step of removing moisture in the dielectric film through the moisture removing method according to claim 1 ; and
a soldering step of soldering the optical fiber to the other member after the removing step.

6. A method for producing a semiconductor laser module including a semiconductor laser element and an optical fiber having a light entry end surface facing a light emission end surface of the semiconductor laser element, the light entry end surface being provided with a dielectric film,
the method comprising:
a removing step of removing moisture in the dielectric film through the moisture removing method according to claim 1 ; and
a soldering step of soldering the optical fiber to a housing of the semiconductor laser module after the removing step.

Assignees

• Fujikura Ltd

Inventors

• Sakamoto Akira

Classifications

• G02B6/4238 Primary

  Soldering · CPC title

• F26B3/28

  by radiation, e.g. from the sun · CPC title

• F26B3/30

  from infrared-emitting elements {(by radiation emanating from passages containing heated fluids other than combustion gases F26B23/10)} · CPC title

• B23K1/20 Primary

  Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating · CPC title

• B23K1/0016

  Soldering of electronic components · CPC title