Ruggedized photonic crystal sensor packaging

Patent metadata

Field	Value
Publication number	US-9500808-B2
Application number	US-201213467358-A
Country	US
Kind code	B2
Filing date	May 9, 2012
Priority date	May 9, 2012
Publication date	Nov 22, 2016
Grant date	Nov 22, 2016

Abstract

A method, system, and apparatus are disclosed for a ruggedized photonic crystal (PC) sensor packaging. In particular, the present disclosure teaches a ruggedized packaging for a photonic crystal sensor that includes of a hermetic-seal high-temperature jacket and a ferrule that eliminate the exposure of the optical fiber as well as the critical part of the photonic crystal sensor to harsh environments. The disclosed packaging methods enable photonic crystal based sensors to operate in challenging environments where adverse environmental conditions, such as electromagnetic interference (EMI), corrosive fluids, large temperature variations, and strong mechanical vibrations, currently exclude the use of traditional sensor technologies.

First claim

We claim:

1. A method for hermetically sealing a photonic crystal (PC) sensor chip, the method comprising:
metalizing the (PC) sensor chip with a donut pattern, wherein the donut pattern matches a diameter and a wall thickness of a kovar tube;
centering the (PC) sensor chip to a center axis of an end of the kovar tube;
soldering the (PC) sensor chip to the end of the kovar tube to form a sensor chip assembly;
metalizing a fiber;
assembling a metal ferrule with the metalized fiber by soldering the metalized fiber inside the metal ferrule;
inserting the metal ferrule inside the kovar tube of the sensor chip assembly,
wherein the (PC) sensor chip is not in direct contact with the metal ferrule and the metalized fiber, and the (PC) sensor chip is separated from the metal ferrule and the metalized fiber by a cavity of the sensor chip assembly,
wherein the metalized fiber is inside of the metal ferrule, and the metal ferrule is inside of the kovar tube;
aligning an end of the metalized fiber to the (PC) sensor chip of the sensor chip assembly; and
soldering an outer surface of the metal ferrule to an inner surface of the kovar tube of the sensor chip assembly, thereby protecting the cavity of the sensor chip assembly by hermetically sealing the kovar tube, wherein the cavity of the sensor chip assembly is formed within the kovar tube.

2. The method of claim 1 , wherein a three-axis stage tool is used to center the PC sensor chip to the center axis of the kovar tube.

3. The method of claim 1 , wherein a three-axis stage tool is used to align the end of the metalized fiber to the PC sensor chip.

4. The method of claim 1 , wherein radio frequency (RF) induction heating is used for the soldering of the PC sensor chip to the end of the kovar tube.

5. The method of claim 1 , wherein RF induction heating and a donut shaped solder preform are used for the soldering of the outer surface of the metal ferrule to the inner surface of the kovar tube.

Assignees

• Carralero Michael A
• Chan Eric Y
• Koshinz Dennis G
• Boeing Co

Inventors

• Carralero Michael A
• Chan Eric Y
• Koshinz Dennis G

Classifications

• G02B6/241 Primary

  Light guide terminations · CPC title

• G02B6/366

  the additional structures allowing for adjustment or alignment in all dimensions, i.e. 3D microoptics arrangements, e.g. free space optics on the microbench, microhinges or spring latches, with associated microactuating elements for fine adjustment or alignment · CPC title

• Y10T29/49117

  Conductor or circuit manufacturing · CPC title

• G02B6/1225

  comprising photonic band-gap structures or photonic lattices · CPC title

• G02B6/4248 Primary

  Feed-through connections for the hermetical passage of fibres through a package wall (see provisionally also G02B6/4428) · CPC title