Circuit module and method of producing circuit module

Patent metadata

Field	Value
Publication number	US-9456488-B2
Application number	US-201314090445-A
Country	US
Kind code	B2
Filing date	Nov 26, 2013
Priority date	Sep 12, 2013
Publication date	Sep 27, 2016
Grant date	Sep 27, 2016

Abstract

There is provided a circuit module including a circuit substrate having a mount surface; a mount component mounted on the mount surface; a sealing body formed on the mount surface, the sealing body covering the mount component and having a trench formed from a main surface of the sealing body to the mount surface; and a shield having an inner shield section formed within the trench and an outer shield section that covers the sealing body and the inner shield section, the outer shield section including a first section having a flat surface formed on the main surface of the shielding body and a second section formed on the inner shield section and protruded or sagged from the first section.

First claim

What is claimed is:

1. A circuit module, comprising:
a circuit substrate having a mount surface and a superficial conductor being formed on the mount surface;
a mount component mounted on the mount surface;
a sealing body formed on the mount surface, the sealing body covering the mount component and having a trench formed from a main surface of the sealing body to the mount surface, the trench having two end portions being formed at two ends of the trench in a plane parallel with the mount surface; and
a shield having an inner shield section formed within the trench and an outer shield section that covers the sealing body and the inner shield section, the outer shield section including a first section having a flat surface as an external surface, the first section formed on the main surface of the sealing body and a second section formed on the inner shield section and protruded outwardly away from the mount surface and from the flat surface of the first section, wherein
the inner shield section and the outer shield section are formed integrally,
a bottom of the trench is configured of a surface of the superficial conductor, and
the two end portions of the trench reach an outer peripheral surface of the sealing body in the plane in parallel with the mount surface.

2. The circuit module according to claim 1 , wherein
the sealing body is formed of an insulating sealing material including a thermosetting resin, and
the shield is a conductive shielding material including a thermosetting resin having a thermal expansion property different from the sealing material.

3. The circuit module according to claim 2 , wherein
the shielding material has a thermal expansion coefficient different from the sealing material.

4. The circuit module according to claim 2 , wherein
the shielding material has a volume expansion rate different from the sealing material.

5. The circuit module according to claim 1 , wherein
a thermal expansion property of the sealing material is greater than that of the circuit substrate.

Assignees

• Taiyo Yuden Kk

Inventors

• Shimamura Masaya
• Kai Takehiko
• Mugiya Eiji
• Saji Tetsuo
• Nakamura Hiroshi

Classifications

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W74/10

  characterised by their shape or disposition · CPC title

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W72/0198

  batch processes · CPC title

• H10W74/121

  by multiple encapsulations, e.g. by a thin protective coating and a thick encapsulation · CPC title