Circuit module and method of producing the same

Patent metadata

Field	Value
Publication number	US-9101044-B2
Application number	US-201314086407-A
Country	US
Kind code	B2
Filing date	Nov 21, 2013
Priority date	Aug 9, 2013
Publication date	Aug 4, 2015
Grant date	Aug 4, 2015

Abstract

A circuit module includes a substrate, a mount component, a sealing body, a trench and a shield. The substrate has a mount surface. The mount component is mounted on the mount surface. The sealing body has a main surface and an outer peripheral surface, the sealing body sealing the mount component, the main surface sandwiching the mount component between the main surface and the mount surface, the outer peripheral surface covering the mount component on the mount surface. The trench has a groove-like shape, the trench being recessed from the main surface of the sealing body to the mount surface, the trench being formed to leave a space between the trench and the outer peripheral surface. The shield covers the main surface and the outer peripheral surface of the sealing body, the shield being filled in the trench.

First claim

What is claimed is:

1. A circuit module, comprising:
a substrate having a mount surface;
a mount component mounted on the mount surface;
a sealing body having a main surface and an outer peripheral surface, the sealing body sealing the mount component, the main surface sandwiching the mount component between the main surface and the mount surface, the outer peripheral surface covering the mount component on the mount surface;
a trench having a groove-like shape, the trench b…

Assignees

• Taiyo Yuden Kk
• Taiyo Yuden Kk

Inventors

• Shimamura Masaya
• Kitazaki Kenzo
• Nagai Yutaka
• Nakamura Hiroshi
• Saji Tetsuo
• Mugiya Eiji

Classifications

• H10W42/276

  Electricity · mapped topic

• H10W74/00

  Electricity · mapped topic

• H10W72/0198

  Electricity · mapped topic

• H10W90/724

  Electricity · mapped topic

• H10W74/014

  Electricity · mapped topic