Architecture for gas cooled parallel microchannel array cooler

Patent metadata

Field	Value
Publication number	US-9455213-B2
Application number	US-87065110-A
Country	US
Kind code	B2
Filing date	Aug 27, 2010
Priority date	Aug 28, 2009
Publication date	Sep 27, 2016
Grant date	Sep 27, 2016

Abstract

Effective utilization of a parallel flow air-cooled microchannel array at the micro electro mechanical systems (MEMS) scale is prohibited by unfavorable flow patterns in simple rectangular arrays. The primary problem encountered is the inability of the flow stream to penetrate a sufficient depth into the fin core to achieve the desired fin efficiency. Embodiments of the present invention overcome this problem using a manifold with open nozzle discharge and integrated lateral exhaust along with a microchannel array cooler with micro spreading cavities for internal air distribution.

First claim

What is claimed is:

1. A gas cooling device for cooling a heat source with a gas that is cooler than the heat source, the gas cooling device comprising:
a parallel microchannel array cooler comprising:
a base for transferring heat from the heat source; and
one or more rows in a widthwise direction, a first row of the one or more rows for receiving a plurality of linearly arranged jets of the gas and comprising fins in a lengthwise direction running a length of the first row and that are separated by evenly spaced microchannels, the fins for dissipating the heat from the base, each of the fins being between two of the evenly spaced microchannels and having a bottom edge adjacent to the base, the bottom edges of the fins each having an indentation to connect the two of the evenly spaced microchannels to create a micro-plenum running the length of the first row in the lengthwise direction between the fins and the base for receiving the plurality of linearly arranged gas jets at a corresponding plurality of linearly arranged receiving points, directing the linearly arranged gas jets along the base in the lengthwise direction, and dispersing the gas to the fins via the evenly spaced microchannels in the widthwise direction, one of the evenly spaced microchannels being between two adjacent ones of the linearly arranged receiving points and for receiving the directed gas through the micro-plenum from each of two corresponding adjacent ones of the linearly arranged gas jets, the gas for transferring the heat from the fins; and

a manifold separated from the cooler by an air gap extending across an entirety of a top of the cooler, the manifold comprising:
a plurality of linearly arranged nozzles corresponding to the plurality of linearly arranged gas jets and for delivering the corresponding linearly arranged gas jets to the first row, each of the linearly arranged nozzles for delivering a corresponding one of the linearly arranged gas jets across the air gap to a corresponding one of the linearly arranged receiving points in the micro-plenum; and
openings for removing the gas delivered to the cooler.

2. The gas cooling device of claim 1 , further comprising a structural cap for protecting the fins from handling damage.

3. The gas cooling device of claim 1 , wherein the cooler is monolithic.

4. The gas cooling device of claim 1 , wherein the fins comprise notches such that adjacent rows of the one or more rows comprise V-grooves in the lengthwise direction between the adjacent rows, the V-grooves for facilitating removing of the heated gas from the cooler.

5. The gas cooling device of claim 1 , wherein the one or more rows comprise a plurality of rows.

6. A gas cooling device for cooling a heat source with a gas that is cooler than the heat source, the gas cooling device comprising:
a parallel microchannel array cooler comprising:
a base for transferring heat from the heat source; and
one or more rows in a widthwise direction, a first row of the one or more rows for receiving a plurality of linearly arranged jets of the gas and comprising fins in a lengthwise direction running a length of the first row and that are separated by evenly spaced microchannels, the fins for dissipating the heat from the base, each of the fins being between two of the evenly spaced microchannels and having a bottom edge adjacent to the base, the bottom edges of the fins each having an indentation to connect the two of the evenly spaced microchannels to create a micro-plenum running the length of the first row in the lengthwise direction between the fins and the base for receiving the plurality of linearly arranged gas jets at a corresponding plurality of linearly arranged receiving points, directing the linearly arranged gas jets along the base in the lengthwise direction, and dispersing the gas to the fins via the evenly spaced microchannels in the widthwise direction, one of the evenly spaced microchannels being between two adjacent ones of the linearly arranged receiving points and for receiving the directed gas through the micro-plenum from each of two corresponding adjacent ones of the linearly arranged gas jets, the gas for transferring the heat from the fins; and

a manifold comprising:
a plurality of linearly arranged nozzles corresponding to the plurality of linearly arranged gas jets and for delivering the corresponding linearly arranged gas jets to the first row, each of the linearly arranged nozzles for delivering a corresponding one of the linearly arranged gas jets to a corresponding one of the linearly arranged receiving points in the micro-plenum; and
openings for removing the gas delivered to the cooler,

wherein the manifold is separated and disconnected from the cooler by a fixed distance.

7. The gas cooling device of claim 6 , wherein the fixed distance is between about 25 mils and about 100 mils.

8. The gas cooling device of claim 6 , wherein the gas is air.

9. The gas cooling device of claim 6 , where the cooler further comprises a structural cap for protecting the fins from handling damage.

10. The gas cooling device of claim 6 , wherein the cooler is monolithic.

11. The gas cooling device of claim 6 , wherein the fins comprise notches such that adjacent rows of the one or more rows comprise V-grooves in the lengthwise direction between the adjacent rows, the V-grooves for facilitating the removing of the heated gas from the cooler via the openings.

12. The gas cooling device of claim 11 , wherein the V-grooves correspond to the openings.

13. The gas cooling device of claim 6 , further comprising a plurality of coolers.

14. The gas cooling device of claim 6 , wherein the one or more rows comprises a plurality of rows.

Assignees

• Johnson Scott T
• Raytheon Co

Inventors

• Johnson Scott T

Classifications

• H10W40/776

  Arrangements for jet impingement, e.g. for spraying · CPC title

• H10W40/40

  involving heat exchange by flowing fluids · CPC title

• H10W40/43 Primary

  by flowing gases, e.g. forced air cooling · CPC title

• H05K7/20136

  Forced ventilation, e.g. by fans (H05K7/202 takes precedence) · CPC title

• H01L23/46

  Electricity · mapped topic