Resin composition and dielectric layer and capacitor produced therefrom

Patent metadata

Field	Value
Publication number	US-9455088-B2
Application number	US-201114361730-A
Country	US
Kind code	B2
Filing date	Dec 21, 2011
Priority date	Dec 21, 2011
Publication date	Sep 27, 2016
Grant date	Sep 27, 2016

Abstract

The present invention provides a resin composition comprising: 1 to 20 parts by weight of a reinforcing fiber; 0.2 to 5 parts by weight of an anti-settling agent; 20 to 40 parts by weight of an epoxy resin; 0.1 to 3 parts by weight of a curing agent; and 50 to 75 parts by weight of a high dielectric constant filler. The present invention further provides a dielectric layer produced from the resin composition and a capacitor comprising the dielectric layer. In the dielectric layer made from the resin composition provided by the present invention, the fibers can be evenly dispersed and can enhance the mechanical strength of the resin composition, and cooperate with the epoxy resin to bring excellent toughness. Therefore, the mechanical strength of the produced dielectric layer can be remarkably improved, and its fragility can be effectively overcome when the dielectric layer is used in the PCB double-side etching process.

First claim

What is claimed is:

1. A resin composition comprising:
1 to 20 parts by weight of a reinforcing fiber;
0. 2 to 5 parts by weight of an anti-settling agent;
20 to 40 parts by weight of an epoxy resin;
0. 1 to 3 parts by weight of a curing agent; and
50 to 75 parts by weight of a high dielectric constant filler,

wherein the reinforcing fiber, the anti-settling agent, the epoxy resin, the curing agent, and the high dielectric constant filler are provided in a combined amount of 100 parts by weight.

2. The resin composition according to claim 1 , wherein the reinforcing fiber is selected from one or more of glass fibers, carbon fibers, organic polymer short cut fibers and inorganic whiskers.

3. The resin composition according to claim 1 , wherein the reinforcing fiber has a diameter of 0.1 to 10 μm and a length of 5 μm to 3 mm.

4. The resin composition according to claim 1 , wherein the reinforcing fiber is one or more of alkali-free glass fiber powders and potassium titanate whiskers and has a diameter of 0.1 to 10 μm and a length of 10 to 400 μm.

5. The resin composition according to claim 1 , wherein the anti-settling agent comprises fumed silica.

6. The resin composition according to claim 5 , wherein the fumed silica has a specific surface density of 120 to 250 g/m 2 and has been surface-treated with a hydrophobic agent.

7. The resin composition according to claim 1 , wherein the epoxy resin is selected from one or more of bisphenol-A epoxy resin, bisphenol-F epoxy resin, bisphenol-S epoxy resin, phenolic novolac epoxy resin and o-cresol novolac epoxy resin.

8. The resin composition according to claim 1 , wherein the curing agent comprises a latent amine type curing agent.

9. The resin composition according to claim 8 , wherein the latent amine type curing agent is selected from one or more of dicyandiamide, 4, 4′-diaminodiphenylsulfone, 4, 4′-diaminodiphenylether, 4, 4′-diaminodiphenylmethane, 2-methylimidazole, 2-ethyl-4-methyl-imidazole, 2-phenylimidazole and a terminal tertiary amine group-containing hyperbranched polyester.

10. The resin composition according to claim 1 , wherein the high dielectric constant filler is selected from one or more of barium titanate, strontium titanate, barium strontium titanate, calcium barium titanate, calcium lead titanate ceramic, lead titanate-lead magnesium niobate, carbon black, carbon nanotubes, metals and metal oxides.

11. The resin composition according to claim 10 , wherein the high dielectric constant filler is barium titanate having a diameter in a range of 0.1 to 2 μm.

12. The resin composition according to claim 1 , further comprising 30 to 70 parts by weight of an organic solvent.

13. The resin composition according to claim 12 , wherein the organic solvent is selected from one or more of Methyl ethyl ketone, methyl isobutyl ketone and ethylene glycol monomethyl ether.

14. A dielectric layer comprising the resin composition according to claim 1 .

15. The dielectric layer according to claim 14 , wherein the dielectric layer is obtained by coating the resin composition on a conductive substrate and curing it.

16. The dielectric layer according to claim 14 , wherein the dielectric layer has a thickness of 1 to 50 μm.

17. A method of producing a dielectric layer, comprising the steps of:
providing a conductive substrate;
coating the resin composition according to claim 12 on the conductive substrate and curing it.

18. A capacitor including a first conductive substrate and a second conductive substrate, wherein at least one of the first conductive substrate and the second conductive substrate have the dielectric layer according to claim 14 on one surface thereof and said two conductive substrates are bound to each other via the dielectric layer.

19. The capacitor according to claim 18 , wherein the first conductive substrate and the second conductive substrate are electrolytic copper foils having a roughness Rz less than 5 μm.

20. The capacitor according to claim 18 , wherein the dielectric layer has a total thickness of 1 to 50 μm.

Assignees

• Cheng Tao
• Chen Qilin
• Jin Zhou
• 3M Innovative Properties Co

Inventors

• Cheng Tao
• Chen Qilin
• Jin Zhou

Classifications

• H01G4/203 Primary

  Fibrous material or synthetic material · CPC title

• H05K2201/0293

  Non-woven fibrous reinforcement · CPC title

• H05K1/0366 Primary

  reinforced, e.g. by fibres, fabrics (H05K1/036 takes precedence) · CPC title

• C08K7/08

  Oxygen-containing compounds · CPC title

• H01G9/15

  Solid electrolytic capacitors (H01G11/00 takes precedence) · CPC title