Element mounting substrate and semiconductor module
US-9024446-B2 · May 5, 2015 · US
US9452570B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9452570-B2 |
| Application number | US-201213671263-A |
| Country | US |
| Kind code | B2 |
| Filing date | Nov 7, 2012 |
| Priority date | Nov 7, 2012 |
| Publication date | Sep 27, 2016 |
| Grant date | Sep 27, 2016 |
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
What the patent document calls the invention.
A short plain-language summary of the technical disclosure.
Who owns or filed the patent and who is credited as inventor.
Filing, priority, publication, and grant dates set the timeline.
The legal scope of protection — read this for what is actually claimed.
Technology tags used to group this patent with similar filings.
Prior art links and similar publications in this corpus.
Official abstract text for this publication.
An information handling system chassis is built at least in part from ceramic elements. For example, a transparent aluminum oxide ceramic portion covers a touchscreen to provide a rigid outer surface for accepting end user inputs. As another example, a ceramic chassis element has a ceramic material formed around a metal material of similar substance with bonding of the ceramic to the underlying material enhanced with oxidation of the outer surface of the metal material.
Opening claim text (preview).
What is claimed is: 1. A method for forming an information handling system chassis element, the method comprising: mixing a ceramic material, polymer and a clay into a viscous material; forming the viscous material into a chassis element shape around a metal portion by injection molding the viscous material into a mold having the chassis element shape and the metal portion; sintering the injected molded viscous material and metal portion for a predetermined time at a predetermined temperature to densify the viscous material into a multi-layer ceramic chassis element having a metal insert; and assembling an information handling system with the ceramic chassis element; wherein the metal portion comprises a hinge portion to couple the chassis element to a separate chassis element. 2. A method for forming an information handling system chassis element, the method comprising: mixing a ceramic material, polymer and a clay into a viscous material; forming the viscous material into a chassis element shape around a metal portion by injection molding the viscous material into a mold having the chassis element shape and the metal portion; sintering the injected molded viscous material and metal portion for a predetermined time at a predetermined temperature to densify the viscous material into a multi-layer ceramic chassis element having the metal portion as a metal insert; and assembling an information handling system with the ceramic chassis element; wherein the metal portion comprises a titanium plate and the viscous material comprises aluminum titanate disposed on an upper and lower surface of the titanium plate. 3. The method of claim 2 wherein the titanium plate has a thickness of less than the thickness of each of the upper and lower surface aluminum titanate injection molded viscous material. 4. The method of claim 2 wherein the titanium plate is disposed in a diagonal orientation relative to the injection mold.
partly or totally electrically conductive, e.g. for EMI shielding (conductive floors or floor coverings H05F3/025; EMI shielding in general H05K9/00) · CPC title
Annealing · CPC title
Thermal after-treatment {(B29C71/0063 and B29C71/0072 take precedence)} · CPC title
by incorporating or moulding on preformed parts, e.g. inserts or layers {, e.g. foam blocks (mould constructions therefor B29C33/12; joining preformed parts by moulding B29C65/70)} · CPC title
with molding of insulated base · CPC title
Related publications grouped by family.
Answers are generated from the same data shown on this page.