Method of severing a semiconductor device composite

Patent metadata

Field	Value
Publication number	US-9449879-B2
Application number	US-201614987910-A
Country	US
Kind code	B2
Filing date	Jan 5, 2016
Priority date	Oct 28, 2011
Publication date	Sep 20, 2016
Grant date	Sep 20, 2016

Abstract

A method of severing a semiconductor device composite includes a carrier having a main surface and a semiconductor layer sequence arranged on the main surface including forming a separating trench in the semiconductor device composite by a first laser cut such that the separating trench only partially severs the semiconductor device composite in a vertical direction running perpendicular to the main surface, and severing the semiconductor device composite completely along the separating trench with a severing cut with a laser.

First claim

The invention claimed is:

1. A method of severing a semiconductor device composite comprising a carrier having a main surface and a semiconductor layer sequence arranged on the main surface,
wherein
the carrier comprises a semiconductor material or a ceramics material;
a metal layer is arranged on a side of the carrier remote from the semiconductor layer sequence;
the semiconductor layer sequence is fixed to the carrier by a bonding layer;
a separating trench is formed in the semiconductor device composite by a first laser cut such that the separating trench only partially severs the semiconductor device composite in a vertical direction running perpendicular to the main surface;
the semiconductor device composite is severed completely along the separating trench with a severing cut with a laser;
a second laser cut is made along the separating trench between the first laser cut and the severing cut, the second laser cut only removing material of the carrier; and
side faces of the separating trench are covered with waste formed in the second laser cut.

2. The method according to claim 1 , wherein the metal layer completely covers the carrier.

3. The method according to claim 2 , wherein the metal layer is only treated with the severing cut.

4. The method according to claim 1 , wherein a bottom surface of the separating trench is arranged in the vertical direction between the metal layer and the main surface prior to the severing cut.

5. The method according to claim 1 , wherein the first laser cut completely severs the bonding layer.

6. The method according to claim 1 , wherein the first laser cut reaches into the carrier.

7. The method according to claim 1 , wherein a third laser cut, which only partially severs the carrier, is made along the separating trench between the second laser cut and the severing cut.

8. The method according to claim 1 , wherein the semiconductor layer sequence is structured into device regions prior to the first laser cut.

9. The method according to claim 8 , wherein the separating trench runs between adjacent device regions.

10. The method according to claim 8 , wherein the semiconductor layer sequence is epitaxially deposited on a growth substrate, the growth substrate is removed, and the device regions are formed after the growth substrate has been removed.

11. The method according to claim 1 , wherein the semiconductor layer sequence is epitaxially deposited on a growth substrate and the growth substrate is removed.

12. The method according to claim 1 , wherein the carrier is based on a semiconductor material.

13. The method according to claim 1 , wherein the carrier has a thickness of at most 200 μm.

14. The method according to claim 1 , wherein a cut width of the second layer cut is smaller than a cut width of the first laser cut.

15. The method according to claim 1 , wherein the waste consists essentially of material of the carrier.

Assignees

• Osram Opto Semiconductors Gmbh

Inventors

• Weiss Guido
• Perchtaler Albert

Classifications

• H10P72/7416

  used during dicing or grinding · CPC title

• H10P72/74

  using temporarily an auxiliary support · CPC title

• H10P52/00

  Grinding, lapping or polishing of wafers, substrates or parts of devices · CPC title

• H10P54/00 Primary

  Cutting or separating of wafers, substrates or parts of devices · CPC title

• B23K26/40

  taking account of the properties of the material involved · CPC title