Processing systems and methods for halide scavenging

Patent metadata

Field	Value
Publication number	US-9449850-B2
Application number	US-201514703299-A
Country	US
Kind code	B2
Filing date	May 4, 2015
Priority date	Mar 15, 2013
Publication date	Sep 20, 2016
Grant date	Sep 20, 2016

Abstract

Systems, chambers, and processes are provided for controlling process defects caused by moisture contamination. The systems may provide configurations for chambers to perform multiple operations in a vacuum or controlled environment. The chambers may include configurations to provide additional processing capabilities in combination chamber designs. The methods may provide for the limiting, prevention, and correction of aging defects that may be caused as a result of etching processes performed by system tools.

First claim

What is claimed is:

1. A method of etching a substrate, the method comprising:
providing a substrate comprising silicon and having a silicon oxide layer overlying the silicon;
etching the substrate in a first etching process, wherein the first etching process is selective to silicon oxide over silicon;
etching the substrate in a second etching process, wherein the second etching process is selective to silicon over silicon oxide; and
treating the substrate with a third process, wherein the third process comprises directing plasma effluents at the surface of the substrate, wherein the plasma effluents are produced from a nitrogen-containing precursor and a fluorine-containing precursor, and wherein the plasma effluents remove up to about 12 angstrom of the silicon oxide layer across an entire exposed surface of the silicon oxide layer but maintains at least a portion of the silicon oxide layer.

2. The method of claim 1 , wherein the third process further comprises a wet etching process, wherein the wet etch comprises hydrofluoric acid, and wherein the wet etch removes up to about 12 Å of the silicon oxide layer.

3. The method of claim 2 , wherein each of the first, second, and third processes are performed in different process chambers.

4. The method of claim 1 , wherein the silicon oxide layer is exposed to the second etching process, wherein the second etching process produces radical fluorine species, and wherein residual fluorine species are incorporated with the silicon oxide layer.

5. The method of claim 4 , wherein the third process further comprises exposing the silicon oxide layer to deionized water.

6. The method of claim 5 , wherein the deionized water removes at least a portion of the residual fluorine species from the silicon oxide layer without etching the silicon oxide layer.

7. A method of preventing surface reactions on a treated substrate, the method comprising:
etching the substrate in a first etching process, wherein the first etching process is selective to silicon oxide over silicon;
etching the substrate in a second etching process, wherein the second etching process is selective to silicon over silicon oxide;
heating the substrate to a first treatment temperature;
maintaining the substrate at the first treatment temperature for a first period of time greater than or about 1 minute; and transferring the substrate to a moisture-free environment, and
treating the substrate with a third process, wherein the third process comprises directing plasma effluents at the surface of the substrate, wherein the plasma effluents are produced from a nitrogen-containing precursor and a fluorine-containing precursor, and wherein the plasma effluents remove up to about 12 angstrom of the silicon oxide layer across an entire exposed surface of the silicon oxide layer but maintains at least a portion of the silicon oxide layer.

8. The method of claim 7 , wherein the substrate is transferred to a chamber after heating the substrate, and a fluid is continuously flowed through the chamber to maintain the moisture-free environment.

9. The method of claim 7 , wherein the second etching process utilizes a fluorine-containing precursor and an oxygen-containing precursor.

10. The method of claim 7 , wherein the first etching process utilizes a fluorine-containing precursor and a hydrogen-containing precursor.

11. The method of claim 7 , wherein a region of silicon oxide is exposed to the second etching process, wherein the second etching process produces radical fluorine species, and wherein residual fluorine species are incorporated with the silicon oxide.

12. The method of claim 7 , wherein the first temperature is greater than or about 150° C., and wherein the first period of time is greater than or about 2 minutes.

13. A method of etching a substrate, the method comprising:
providing a substrate comprising silicon and having a silicon oxide layer overlying the silicon;
etching the substrate in a first etching process, wherein the first etching process is selective to silicon oxide over silicon;
etching the substrate in a second etching process, wherein the second etching process is selective to silicon over silicon oxide; and
etching the substrate in a third etching process wherein the third etching process is selective to silicon oxide over silicon, wherein the third etching process comprises exposing the substrate to a nitrogen-containing precursor and a fluorine-containing precursor, wherein the fluorine-containing precursor has been flowed through a plasma to produce plasma effluents, wherein the third etching operation removes up to about 12 Å of the silicon oxide layer across an entire exposed surface of the silicon oxide layer but maintains at least a portion of the silicon oxide layer.

14. The method of claim 13 , wherein the first and third etching processes are similar etching processes.

15. The method of claim 13 , wherein the first and third etching processes are performed in a first process chamber, and the second etching process is performed in a second process chamber.

16. The method of claim 13 , wherein the third etching process etches the silicon oxide layer to remove a depth of at least about 5 Å of material.

17. The method of claim 13 , wherein the second etching process comprises exposing the substrate to a fluorine-containing precursor and an oxygen-containing precursor, wherein the fluorine-containing precursor has been flowed through a plasma to produce plasma effluents.

18. The method of claim 17 , wherein the silicon oxide layer is exposed to the second etching process, and wherein residual fluorine species are incorporated with the silicon oxide layer.

Assignees

• Applied Materials Inc

Inventors

• Wang Anchuan
• Chen Xinglong
• Li Zihui
• Hamana Hiroshi
• Chen Zhijun
• Hsu Ching-Mei
• Huang Jiayin
• Ingle Nitin K
• Lubomirsky Dmitry
• Venkataraman Shankar
• Thakur Randhir

Classifications

• H10P70/20

  Cleaning during device manufacture · CPC title

• H10P50/268

  of silicon-containing layers · CPC title

• H10P50/73

  using masks for insulating materials · CPC title

• H10P95/00

  Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass · CPC title

• H10P72/3302

  Mechanical parts of transfer devices · CPC title