Channel member, and heat exchanger, semiconductor unit, and semiconductor manufacturing apparatus including the same

Patent metadata

Field	Value
Publication number	US-9448014-B2
Application number	US-201214353514-A
Country	US
Kind code	B2
Filing date	Oct 29, 2012
Priority date	Oct 28, 2011
Publication date	Sep 20, 2016
Grant date	Sep 20, 2016

Abstract

Channel members 100 to 107 according to the present invention have an inner spiral channel 9 through which a fluid 23 flows. The channel 9 is formed by a lid part 1 , a bottom plate part 3 , and a wall part 2 connected to the lid part 1 and the bottom plate part 3 . The wall part 2 is made of a ceramic laminate. Even if the wall part 2 of the channel members 100 to 107 is narrow between channel segments 9 , its good corrosion resistance allows the channel 9 to be resistant to collapse when the fluid 23 is supplied at high pressure. A heat exchanger 200 , a semiconductor unit 300 , and a semiconductor manufacturing apparatus 400 including any of the channel members 100 to 107 have improved heat exchange efficiency between the channel members 100 to 107 and the fluid 23.

First claim

The invention claimed is:

1. A channel member having an inner spiral channel through which a fluid flows, the channel being formed by a lid part, a bottom plate part, and a wall part connected to the lid part and the bottom plate part, the wall part comprising a ceramic laminate of a plurality of sheet-shaped bodies, wherein the wall part has a protrusion and a recess inside a cross section of the channel perpendicular to a direction in which fluid flows which is defined by differences in the adjacent sheet-shaped bodies.

2. The channel member according to claim 1 , wherein the width of the channel increases from one end toward another end in a height direction of the channel.

3. The channel member according to claim 1 , wherein the width of the channel increases from the bottom plate part toward the lid part.

4. The channel member according to claim 1 , wherein the width of the channel is smaller in the center of the channel than near the lid part and the bottom plate part in a height direction of the channel.

5. The channel member according to claim 1 , wherein the channel comprises an inlet, an outlet, and a turnaround portion between the inlet and the outlet, a portion of the channel between the inlet and the turnaround portion being adjacent to a portion of the channel between the turnaround portion and the outlet.

6. The channel member according to claim 1 , wherein the maximum difference between the protrusion and recess of the wall part that forms the channel in the center of the channel member is larger than the maximum difference between the protrusion and recess of the wall part that forms the channel in the periphery of the channel member.

7. The channel member according to claim 1 , wherein the maximum difference between the protrusion and recess of the wall part that forms the channel in the outermost periphery of the channel is larger than the maximum difference between the protrusion and recess of the wall part that forms the channel in a region other than the outermost periphery of the channel.

8. The channel member according to claim 1 , wherein the channel member has at least one of a gap leading to the channel between the lid part and the wall part and a gap leading to the channel between the wall part and the bottom plate part.

9. The channel member according to claim 1 , wherein the laminate has a gap leading to the channel between the plurality of sheet-shaped bodies.

10. The channel member according to claim 1 , wherein the channel member includes barriers that change a flow of the fluid in the channel.

11. The channel member according to claim 10 , wherein the barriers are arranged so as to be sequentially shifted in a direction in which the fluid flows and in a height direction of the channel.

12. A heat exchanger comprising the channel member according to claim 1 and a metal member on or in the lid part.

13. A semiconductor unit comprising the heat exchanger according to claim 12 , with the metal member on the lid part, and a semiconductor device on the metal member.

14. A semiconductor manufacturing apparatus comprising the heat exchanger according to claim 12 , the metal member being an electrode that attracts a semiconductor wafer.

Assignees

• Kyocera Corp

Inventors

• Tsubokawa Kenji
• Fujio Kazuhiko
• Maeda Kenjiro
• Abe Hiroyuki

Classifications

• H10P72/0434

  mainly by convection · CPC title

• H10W40/259

  Ceramics or glasses (H10W40/254, H10W40/257, H10W40/255, H10W40/251, H10W40/253 take precedence) · CPC title

• H10W40/255

  having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates · CPC title

• H10W40/47 Primary

  by flowing liquids, e.g. forced water cooling · CPC title

• H10W40/037

  Assembling together parts thereof · CPC title