Galvanic process for filling through-holes with metals, in particular of printed circuit boards with copper

Patent metadata

Field	Value
Publication number	US-9445510-B2
Application number	US-66170405-A
Country	US
Kind code	B2
Filing date	Aug 30, 2005
Priority date	Sep 20, 2004
Publication date	Sep 13, 2016
Grant date	Sep 13, 2016

Abstract

The present invention relates to a galvanic process for filling through-holes with metals. The process is particularly suitable for filling through-holes of printed circuit boards with copper. The process comprises the following steps: (i) formation of a narrow part in the center of a through-hole by electroplating; and (ii) filling the through-hole obtained in step (i) with metal by electroplating.

First claim

The invention claim is:

1. Galvanic process for filling through-holes of a workpiece with metals comprising the following steps:
(i) bringing in contact the workpiece containing through-holes with a first metal deposition electrolyte and applying a voltage between the workpiece and at least one anode so that a current flow is supplied to the workpiece, wherein the current flow is chosen such that a deposition occurs in the center of the through-holes and, consequently, the through-holes grow together, until the through-holes are divided into two halves forming two holes which are each closed at one end close to the through-hole center, one hole on each side of the workpiece;
(ii) further bringing in contact the workpiece with a second metal-deposition electrolyte and applying a voltage between the workpiece and at least one anode so that a current flow is supplied to the workpiece, wherein the through-holes obtained in step (i) which are divided into two halves are filled by the metal,
wherein the current flow in accordance with step (i) is a pulse reverse current and in every cycle of the current at least one forward current pulse and at least one reverse current pulse occurs and that the current flow in accordance with step (ii) is either a pulse reverse current, a direct current or an alternating current, and
wherein, in the pulse reverse current of step (i) and in the pulse reverse current of step (ii) when present, the ratio of the duration of the at least one forward current pulse to the duration of the at least one reverse current pulse is adjusted to 5-75,
wherein the electrolyte comprises a wetting agent, and
wherein the through-holes have a diameter of 30 μm-300 μm and a maximum height of 0.025-1 mm.

2. Process according to claim 1 , characterized in that the first metal deposition electrolyte and the second metal deposition electrolyte are different electrolytes.

3. Process according to claim 1 , characterized in that the first metal deposition electrolyte and the second metal deposition electrolyte are the same electrolyte.

4. Process according to claim 1 , characterized in that the duration of the at least one forward current pulse is adjusted to 5-250 ms.

5. Process according to claim 1 , characterized in that the duration of the at least one reverse current pulse is adjusted to 20 ms at most.

6. Process according to claim 1 , characterized in that the peak current density of the at least one forward current pulse at the workpiece is adjusted to 15 A/dm 2 at most in horizontal processes and to 2 A/dm 2 in vertical processes.

7. Process according to claim 1 , characterized in that the peak current density of the at least one reverse current pulse at the workpiece is adjusted to 60 A/dm 2 at most in horizontal processes and to 3-10 A/dm 2 in vertical processes.

8. Process according to claim 1 , characterized in that a first voltage is applied between a first side of the workpiece and at least a first anode so that a first pulse reverse current is supplied to the first side of the workpiece, wherein in every cycle of this first pulse reverse current at least a first forward current pulse and at least a first reverse current pulse flow, a second voltage is applied between a second side of the workpiece and at least a second anode so that a second pulse reverse current is supplied to the second side of the workpiece, wherein in every cycle of this second pulse reverse current at least a second forward current pulse and at least a second reverse current pulse flow.

9. Process according to claim 8 , characterized in that the first current pulses are offset relative to the second current pulses by 180°.

10. Process according to claim 1 , characterized in that an acid copper electrolyte is used as each of the first electrolyte and the second electrolyte.

11. Process according to claim 1 , characterized in that each of the first electrolyte and the second electrolyte comprises an inorganic matrix comprising 15-75 g/l copper, 20-400 g/l sulphuric acid, and 20 -200 mg/l chloride.

12. Process according to claim 11 , characterized in that each of the first electrolyte and the second electrolyte also comprises an organic additive selected from brightening agents and leveling agents.

13. Process according to claim 1 , characterized in that each of the first electrolyte and the second electrolyte is operated with inert anodes with a redox system.

14. Process according to claim 1 , characterized in that as each of the first electrolyte and the second electrolyte an acid copper electrolyte and as anodes soluble anodes are used.

15. Process according to claim 1 , characterized in that the through-holes have a maximum height of 0.05-0.5 mm.

16. Process according to claim 1 , characterized in that the through-holes have a diameter of 60 μm-150 μm.

17. Process according to claim 1 , characterized in that the workpiece is board-shaped and has through-holes.

18. Process according claim 1 , characterized in that the workpiece is a printed circuit board or any other board-shaped electric circuit carrier.

19. Process according to claim 1 , wherein each of the first electrolyte and the second electrolyte comprises an inorganic matrix comprising 15-75 g/l copper, 20-400 g/l sulphuric acid, and 20-200 mg/l chloride, wherein the electrolyte comprises organic additives selected from brightening agents and leveling agents, and wherein each electrolyte is operated with inert anodes with a redox system.

20. Process according to claim 1 , wherein the through-holes have a diameter of 60 μm-150 μm and a maximum height of 0.05-0.5 mm, and wherein the workpiece is a printed circuit board or any other board-shaped electric circuit carrier.

21. Process according to claim 1 , wherein in (ii) the through-holes filled by the metal have no inclusions.

22. Process according to claim 8 , wherein in (ii) the through-holes filled by the metal have no inclusions.

Assignees

• Reents Bert
• Pliet Thomas
• Roelfs Bernd
• Fujiwara Toshiya
• Wenzel Rene
• Youkhanis Markus
• Kim Soungsoo
• Atotech Deutschland Gmbh

Inventors

• Reents Bert
• Pliet Thomas
• Roelfs Bernd
• Fujiwara Toshiya
• Wenzel Rene
• Youkhanis Markus
• Kim Soungsoo

Classifications

• C25D5/18 Primary

  Electroplating using modulated, pulsed or reversing current · CPC title

• C25D3/38

  of copper · CPC title

• C25D7/12

  Semiconductors · CPC title

• H05K3/427

  initial plating of through-holes in metal-clad substrates · CPC title

• H05K2201/09563

  Metal filled via · CPC title