Copper plating bath composition
US-9551080-B2 · Jan 24, 2017 · US
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Roelfs Bernd patents
Roelfs Bernd is listed as an inventor on 7 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Roelfs Bernd |
| Total patents | 7 |
| First publication | Jan 15, 2015 |
| Latest publication | Jan 24, 2017 |
Notable patents
Publications ranked by popularity score, then publication date.
Galvanic process for filling through-holes with metals, in particular of printed circuit boards with copper
US-9526183-B2 · Dec 20, 2016 · US
Method for copper plating
US-9506158-B2 · Nov 29, 2016 · US
Galvanic process for filling through-holes with metals, in particular of printed circuit boards with copper
US-2016270241-A1 · Sep 15, 2016 · US
Galvanic process for filling through-holes with metals, in particular of printed circuit boards with copper
US-9445510-B2 · Sep 13, 2016 · US
Copper plating bath composition
US-2015299883-A1 · Oct 22, 2015 · US
Method for producing matt copper deposits
US-2015014177-A1 · Jan 15, 2015 · US
Recent patents
Latest publications not already listed above.
No data yet.
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Atotech Deutschland Gmbh | 7 |
| Roelfs Bernd | 2 |
| Rohde Dirk | 1 |
| Higuchi Jun | 1 |
| Reents Bert | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| C25D3/38 | 7 |
| H05K3/423 | 4 |
| H05K3/427 | 3 |
| H05K2201/09563 | 3 |
| H05K1/115 | 3 |