Power module substrate, heat-sink-attached power module substrate, and heat-sink-attached power module
US-2015366048-A1 · Dec 17, 2015 · US
Ceramic circuit board and electronic device
US9439279B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9439279-B2 |
| Application number | US-201414457429-A |
| Country | US |
| Kind code | B2 |
| Filing date | Aug 12, 2014 |
| Priority date | Aug 16, 2013 |
| Publication date | Sep 6, 2016 |
| Grant date | Sep 6, 2016 |
How to read this patent
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
- Title
What the patent document calls the invention.
- Abstract
A short plain-language summary of the technical disclosure.
- Assignees and inventors
Who owns or filed the patent and who is credited as inventor.
- Key dates
Filing, priority, publication, and grant dates set the timeline.
- First independent claim
The legal scope of protection — read this for what is actually claimed.
- CPC / IPC classifications
Technology tags used to group this patent with similar filings.
- Citations and related patents
Prior art links and similar publications in this corpus.
Abstract
Official abstract text for this publication.
A ceramic circuit board includes a ceramic substrate, and a first metal plate bonded to a front surface of the ceramic substrate. A size of the front surface of the ceramic substrate is smaller than a size of a surface, i.e., a first facing surface, on a side of the first metal plate that faces the ceramic substrate.
First claim
Opening claim text (preview).
What is claimed is: 1. A ceramic circuit board comprising: a ceramic substrate; and a metal plate bonded to a front surface of the ceramic substrate, wherein a size of the front surface of the ceramic substrate is smaller than a size of a surface on a side of the metal plate that faces the ceramic substrate, wherein: a second metal plate is bonded to a rear surface of the ceramic substrate; and a size of the rear surface of the ceramic substrate is larger than a size of a surface on a side of the second metal plate that faces the ceramic substrate, and wherein the inequality t2<ta <t1 is satisfied, where ta represents a thickness of the ceramic substrate, t1 represents a thickness of the metal plate, and t2 represents a thickness of the second metal plate. 2. The ceramic circuit board according to claim 1 , wherein the ceramic substrate and the metal plate are bonded together, such that an entirety of the front surface of the ceramic substrate is included within the surface on the side of the metal plate that faces the ceramic substrate. 3. The ceramic substrate according to claim 1 , wherein the second metal plate is bonded within the rear surface of the ceramic substrate at a position where the entire surface of the second metal plate that faces the ceramic substrate is included. 4. An electronic device comprising: the ceramic circuit board according to claim 1 ; and a power semiconductor, which is mounted on a surface of the metal plate of the ceramic circuit board.
Assignees
Inventors
Classifications
having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates · CPC title
- H10W40/22Primary
characterised by their shape, e.g. having conical or cylindrical projections · CPC title
consisting of metals or metal salts · CPC title
of one or more of the ceramic layers or articles · CPC title
based on copper · CPC title
Patent family
Related publications grouped by family.
External sources
Frequently asked questions
Answers are generated from the same data shown on this page.
- What does patent US9439279B2 cover?
- A ceramic circuit board includes a ceramic substrate, and a first metal plate bonded to a front surface of the ceramic substrate. A size of the front surface of the ceramic substrate is smaller than a size of a surface, i.e., a first facing surface, on a side of the first metal plate that faces the ceramic substrate.
- Who is the assignee on this patent?
- Ngk Insulators Ltd
- What technology area does this patent fall under?
- Primary CPC classification H10W40/22. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Sep 06 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 4 related publications on this page (citations in our corpus or others sharing the same primary CPC).