3-D integrated package

Patent metadata

Field	Value
Publication number	US-9437912-B2
Application number	US-201514691552-A
Country	US
Kind code	B2
Filing date	Apr 20, 2015
Priority date	Mar 9, 2012
Publication date	Sep 6, 2016
Grant date	Sep 6, 2016

Abstract

In an example embodiment, an electronics package includes one or more insulating layers and an electrically conductive transmission line. The electrically conductive transmission line includes a signal trace disposed substantially parallel to the one or more insulating layers. The electrically conductive transmission line further includes one or more signal vias electrically coupled to the signal trace. The one or more signal vias are configured to pass through at least a portion of the one or more insulating layers. The electronics package further includes one or more electrically conductive ground planes substantially parallel to the one or more insulating layers. The ground planes include one or more signal via ground cuts. The one or more signal via ground cuts provide clearance between the one or more signal vias and the one or more ground planes.

First claim

What is claimed is:

1. An electronics package comprising:
a plurality of transition layers, each transition layer including:
an insulating layer;
a signal via configured to pass through the insulating layer and that is electrically coupled with the signal via of an adjacent transition layer;
a ground plane having a signal cut configured to provide clearance between the ground plane and the signal via; and
a plurality of ground vias each configured to electrically couple the ground plane of the transition layer with the ground plane of an adjacent transition layer; and

an electrically conductive transmission line including:
a coplanar waveguide portion electrically coupled to a microstrip portion;
the signal vias of the plurality of transition layers; and
a signal pin electrically coupled to the signal vias, wherein the signal pin is configured to be electrically coupled to a printed circuit board (PCB) via a PCB signal trace deposited on the PCB.

2. The electronics package of claim 1 , wherein the signal via of the insulating layer and the signal via of the adjacent transition layer are staggered.

3. The electronics package of claim 1 , wherein the signal via of the insulating layer and the signal via of the adjacent transition layer are axially aligned.

4. The electronics package of claim 1 , further comprising a capacitor electrically coupled to the microstrip portion.

5. The electronics package of claim 4 , further comprising a ground plane adjacent to the capacitor, the adjacent ground plane including a capacitor ground cut adjacent to the capacitor.

6. The electronics package of claim 1 , wherein the ground plane is located at a face of the insulating layer.

7. The electronics package of claim 1 , further comprising a ground plane adjacent to a package-PCB interface, the adjacent ground plane including a transition ground cut configured to provide clearance between the adjacent ground plane and the signal pin.

8. The electronics package of claim 7 , wherein the transition ground cut is located at an edge of the adjacent ground plane.

9. The electronics package of claim 7 , wherein the transition ground cut is substantially rectangular.

10. The electronics package of claim 1 , wherein the signal cuts are substantially circular.

11. The electronics package of claim 1 , wherein the electronics package includes a ceramic material.

12. A high-speed transponder comprising a printed circuit board (PCB) electrically coupled to the electronics package of claim 1 and an optoelectronic circuit package.

13. Multiple component circuitry comprising:
a printed circuit board (PCB);
a PCB signal trace deposited on the PCB; and
an electronics package including:
a plurality of transition layers, each transition layer including:
an insulating layer;
a signal via configured to pass through the insulating layer and that is electrically coupled with the signal via of an adjacent transition layer;
a ground plane having a signal cut configured to provide clearance between the ground plane and the signal via; and
a plurality of ground vias each configured to electrically couple the ground plane of the transition layer with the ground plane of an adjacent transition layer; and

an electrically conductive transmission line including:
a coplanar waveguide portion electrically coupled to a microstrip portion;
the signal vias of the plurality of transition layers; and
a signal pin electrically coupled to the signal vias and electrically coupled to the PCB via the PCB signal trace.

14. The multiple component circuitry of claim 13 , further comprising an optoelectronic circuit package electrically coupled to the PCB via the PCB signal trace.

15. The multiple component circuitry of claim 14 , wherein the signal via of the insulating layer and the signal via of the adjacent transition layer are staggered.

16. The multiple component circuitry of claim 14 , wherein the signal via of the insulating layer and the signal via of the adjacent transition layer are axially aligned.

17. The multiple component circuitry of claim 14 , the electronics package further including a capacitor electrically coupled to the microstrip portion.

18. The multiple component circuitry of claim 17 , the electronics package further including a ground plane adjacent to the capacitor, the adjacent ground plane including a capacitor ground cut adjacent to the capacitor.

19. The multiple component circuitry of claim 14 , the electronics package further including a ground plane adjacent to a package-PCB interface, the adjacent ground plane including a transition ground cut configured to provide clearance between the adjacent ground plane and the signal pin.

20. The multiple component circuitry of claim 14 , wherein the signal cuts are substantially circular.

Assignees

• Finisar Corp

Inventors

• Song Yunpeng
• Liu Yongsheng
• Deng Hongyu

Classifications

• H05K1/0243

  Printed circuits associated with mounted high frequency components · CPC title

• H05K1/0227

  Split or nearly split shielding or ground planes · CPC title

• H05K1/112

  directly combined with via connections · CPC title

• H05K2201/09236

  Parallel layout · CPC title

• H01P3/003

  Coplanar lines · CPC title