Lens device attachment to printed circuit board

Patent metadata

Field	Value
Publication number	US-9435966-B2
Application number	US-201514714672-A
Country	US
Kind code	B2
Filing date	May 18, 2015
Priority date	Feb 28, 2011
Publication date	Sep 6, 2016
Grant date	Sep 6, 2016

Abstract

An optical assembly can be formed by providing a frame made of a plastic material on a surface of a printed circuit board (PCB), mounting at least one opto-electronic element on the surface of the PCB within the frame, and laser-welding a lens device onto the frame.

First claim

What is claimed is:

1. An optical assembly, comprising:
a printed circuit board (PCB);
a frame made of a plastic material disposed on a surface of the PCB, the frame having a generally planar shape, an interior region, and a continuous perimeter with a flat surface extending in a plane around the interior region;
at least one opto-electronic device mounted on the surface of the PCB within the interior region of the frame; and
a lens device made of a plastic material, the lens device having a body portion and a fiber port portion, the fiber port portion being adapted to couple with an end of an optical fiber, the body portion being fused to the frame in alignment with the opto-electronic device, the body portion having an optics system disposed therein for coupling light between the end of the optical fiber and the opto-electronic device, the optic system comprising a reflector and a lens, a weld seam existing between the flat surface of the frame and a flat base of the body portion where the plastic material of the flat base of the body portion and the plastic material of the frame are fused together, the flat base of the body portion of the lens device contacting the flat surface of the frame, wherein contact between the flat base of the body portion of the lens device and the flat surface of the frame does not restrict planar movement of the lens device with respect to the frame absent the weld seam.

2. The optical assembly of claim 1 , wherein the frame is mounted to the surface of the PCB.

3. The optical assembly of claim 1 , wherein the frame is overmolded on the surface of the PCB.

4. The optical assembly of claim wherein the reflector defines a first optical path extending between the opto-electronic device and the reflector, and a second optical path extending between the reflector and the fiber port, the fiber port having an optical axis parallel to the surface of the PCB.

5. The optical assembly of claim 1 , wherein:
a portion of the lens device extending from an exterior surface of the lens device to the flat base portion of the lens device is substantially transparent to laser-welding radiation; and
the flat surface of the frame is substantially opaque to laser-welding radiation.

6. The optical assembly of claim 1 , wherein the frame has one or more bosses extending through the PCB and heat-staked to retain the frame against the surface of the PCB.

7. The optical assembly of claim 1 , wherein the weld seam comprises a continuous weld following the perimeter of the frame.

8. The optical assembly of claim 7 , wherein the weld seam further comprises a plurality of spot welds formed prior the continuous weld following the perimeter of the frame.

9. The optical assembly of claim 1 , wherein the surface of the PCB has one or more optically detectable points of reference and the location of the opto-electronic device on the surface of the PCB is determined by one or more of the optically detectable points of reference.

10. The optical assembly of claim 9 , wherein the alignment of the lens device with the opto-electronic device is determined by one or more of the optically detectable points of reference.

11. The optical assembly of claim 9 , wherein the one or more optically detectable points of reference comprise one or more fiducials on the PCB.

12. An optical assembly, comprising:
a printed circuit board (PCB), the PCB having a surface containing one or more optically detectable points of reference;
a frame disposed on the surface of the PCB, the frame having a generally planar shape, an interior region, and a continuous perimeter with a flat surface extending in a plane around the interior region;
at least one opto-electronic device mounted on the surface of the PCB within the interior region of the frame, the location of the opto-electronic device on the surface of the PCB being based on alignment of the opto-electronic device with said one or more optically detectable points of reference; and
a lens device attached to the frame in alignment with the opto-electronic device, the alignment of the lens device with the opto-electronic device being based on alignment of the lens device with said one or more of the optically detectable points of reference,
wherein, the lens device contains at least one optical element for optically coupling an optical fiber to the opto-electronic device, a weld between the flat surface of the frame and a flat base portion of the lens device fuses the lens device and frame together after the lens device is in alignment such that the flat base portion of the lens device contacts the flat surface of the frame.

13. The optical assembly of claim 12 , wherein said one or more optically detectable points of reference comprise one or more fiducials on the PCB.

14. The optical assembly of claim 12 , wherein the lens device comprises a reflector, a lens, and a fiber port adapted to receive an end of an optical fiber.

15. The optical assembly of claim 14 , wherein the reflector defines a first optical path extending between the opto-electronic device and the reflector, and a second optical path extending between the reflector and the fiber port, the fiber port having an optical axis parallel to the surface of the PCB.

16. The optical assembly of claim 12 , wherein:
a portion of the lens device extending from an exterior surface of the lens device to the flat base portion of the lens device is substantially transparent to laser-welding radiation;
the flat surface of the frame is substantially opaque to laser-welding radiation;
and
the weld is disposed between the flat base portion of the lens device and the flat surface of the frame.

17. The optical assembly of claim 12 , wherein the frame has one or more bosses extending through the PCB and heat-staked to retain the frame against the surface of the PCB.

18. The optical assembly of claim 12 , wherein the weld comprises a continuous weld following the perimeter of the frame.

19. The optical assembly of claim 18 , wherein the weld further comprises a plurality of spot welds formed prior the continuous weld following the perimeter of the frame.

20. An optical assembly, comprising:
a printed circuit board (PCB), a surface of the PCB having one or more optically detectable points of reference;
a frame made of a plastic material disposed on a surface of the PCB, the frame having a generally planar shape, an interior region, and a continuous perimeter with a flat surface extending in a plane around the interior region;
at least one opto-electronic device mounted on the surface of the PCB within the interior region of the frame, the location of the opto-electronic device on the surface of the PCB being determined by one or more of the optically detectable points of reference; and
a lens device made of a plastic material, the lens device having a body portion and a fiber port portion, the fiber port portion being adapted to couple with an end of an optical fiber, the body portion being fused to the frame in alignment with the opto-electronic device, the body portion having an optics system disposed therein for coupling light between the end of the optical fiber and the opto-electronic device, a weld seam existing between the flat surface of the frame and a flat base of the body portion where the plastic material of the flat base of the body portion and the plastic material of the frame are fused together, the flat base of the body portion of the lens device contacting the flat surface of the frame, wherein contact between the flat base of

Assignees

• Meadowcroft David J K
• Yu Paul
• Avago Technologies General Ip

Inventors

• Meadowcroft David J K
• Yu Paul

Classifications

• G02B6/4257

  having a supporting carrier or a mounting substrate or a mounting plate (G02B6/3648 takes precedence) · CPC title

• H05K1/0274 Primary

  Optical details, e.g. printed circuits comprising integral optical means (H05K1/0269 takes precedence; coupling light guides with opto-electronic components G02B6/42) · CPC title

• H05K3/303

  with surface mounted components (H05K3/32 takes precedence) · CPC title

• H05K1/0269

  for visual or optical inspection · CPC title

• Y10T29/4913

  Assembling to base an electrical component, e.g., capacitor, etc. · CPC title