Alkaline pretreatment for electroplating

Patent metadata

Field	Value
Publication number	US-9435049-B2
Application number	US-201314085262-A
Country	US
Kind code	B2
Filing date	Nov 20, 2013
Priority date	Nov 20, 2013
Publication date	Sep 6, 2016
Grant date	Sep 6, 2016

Abstract

Prior to electrodeposition, a semiconductor wafer having one or more recessed features, such as through silicon vias (TSVs), is pretreated by contacting the wafer with a pre-wetting liquid comprising a buffer (such as a borate buffer) and having a pH of between about 7 and about 13. This pre-treatment is particularly useful for wafers having acid-sensitive nickel-containing seed layers, such as NiB and NiP. The pre-wetting liquid is preferably degassed prior to contact with the wafer substrate. The pretreatment is preferably performed under subatmospheric pressure to prevent bubble formation within the recessed features. After the wafer is pretreated, a metal, such as copper, is electrodeposited from an acidic electroplating solution to fill the recessed features on the wafer. The described pretreatment minimizes corrosion of seed layer during electroplating and reduces plating defects.

First claim

The invention claimed is:

1. A method of electroplating a metal on a wafer substrate comprising one or more recessed features, the method comprising:
(a) providing a wafer substrate having an exposed nickel-containing layer on at least a portion of its surface;
(b) contacting the wafer substrate with a pre-wetting liquid, the liquid comprising a buffer and having a pH in a range of between about 7 and about 13 to pre-wet the nickel-containing layer on the wafer substrate, wherein the wafer substrate retains the buffer-containing pre-wetting liquid after the pre-wetting; and
(c) electrodepositing the metal onto the pre-wetted nickel-containing layer using an acidic plating solution, such that the acidic plating solution contacts the pre-wetting liquid retained on the wafer substrate, wherein the electrodeposited metal at least partially fills the one or more recessed features.

2. The method of claim 1 , wherein the pre-wetting liquid comprises a borate and has a pH of between about 9 and about 11.

3. The method of claim 1 , wherein the pre-wetting liquid comprises a phosphate.

4. The method of claim 1 , wherein the pre-wetting liquid comprises a carbonate.

5. The method of claim 1 , wherein the pre-wetting liquid comprises a pH adjustor selected from the group consisting of tetraalkylammonium hydroxide and an alkali metal hydroxide.

6. The method of claim 1 , wherein the pre-wetting liquid comprises a pH adjustor, wherein the pH adjustor comprises ammonia.

7. The method of claim 1 , wherein the pre-wetting liquid comprises a compound from the class of polyalkylene glycols.

8. The method of claim 1 , further comprising degassing the pre-wetting liquid prior to contacting the wafer substrate.

9. The method of claim 1 , further comprising reducing pressure in a pre-wetting process chamber to a subatmospheric pressure prior to contacting the wafer substrate with the pre-wetting liquid.

10. The method of claim 1 , wherein the nickel-containing layer is a NiB layer.

11. The method of claim 1 , wherein the nickel-containing layer is a NiP layer.

12. The method of claim 1 , wherein the metal electrodeposited in (c) is copper.

13. The method of claim 1 , wherein the one or more recessed features are through silicon vias (TSVs).

14. The method of claim 1 , wherein the pre-wetting liquid comprises a borate, KOH, and a compound from the class of polyalkylene glycols and has a pH of about 11.

15. The method of claim 1 , wherein the contacting comprises spraying the pre-wetting liquid onto the wafer substrate.

16. The method of claim 1 , wherein the wafer substrate is positioned in a substantially horizontal orientation during the contacting.

17. The method of claim 1 , wherein the buffer comprises a borate at a concentration of between about 10 mM to about 1 M.

18. The method of claim 1 , further comprising:
applying photoresist to the wafer substrate;
exposing the photoresist to light;
patterning the photoresist and transferring the pattern to the wafer substrate;
and selectively removing the photoresist from the wafer substrate.

19. A pre-wetting liquid comprising:
(a) a borate buffer comprising borate and a pH adjustor selected from the group consisting of a tetraalkylammonium hydroxide and an alkaline metal hydroxide; and
(b) a compound from the class of polyalkylene glycols, wherein the pH of the pre-wetting liquid is between about 8 and about 13.

Assignees

• Lam Res Corp

Inventors

• Thorum Matthew

Classifications

• H10W20/0245

  comprising use of blind vias during the manufacture · CPC title

• H10W20/0261

  characterised by the filling method or the material of the conductive fill · CPC title

• H10P72/0414

  using mainly spraying means, e.g. nozzles · CPC title

• H10P14/47

  Electrolytic deposition, i.e. electroplating; Electroless plating · CPC title

• H10W20/052

  by treatments not introducing additional elements therein · CPC title