Optical module

Patent metadata

Field	Value
Publication number	US-9429726-B2
Application number	US-201514936782-A
Country	US
Kind code	B2
Filing date	Nov 10, 2015
Priority date	Dec 20, 2011
Publication date	Aug 30, 2016
Grant date	Aug 30, 2016

Abstract

An optical module includes a circuit board, a photoelectric conversion element mounted on the circuit board, an optical connector for optically connecting the photoelectric conversion element and an optical fiber, a semiconductor circuit element mounted on the circuit board and electrically connected to the photoelectric conversion element, a pressing member for pressing and fixing the optical connector to the circuit board, and a supporting member for supporting the pressing member. The supporting member includes a heat-absorbing surface and a heat-dissipating surface. The heat-absorbing surface is thermally connected to the semiconductor circuit element. The heat-dissipating surface dissipates heat of the semiconductor circuit element to be absorbed through the heat-absorbing surface.

First claim

What is claimed is:

1. An optical module, comprising:
a circuit board;
a photoelectric conversion element mounted on the circuit board;
an optical connector for optically connecting the photoelectric conversion element and an optical fiber;
a semiconductor circuit element mounted on the circuit board and electrically connected to the photoelectric conversion element;
a pressing member for pressing and fixing the optical connector to the circuit board; and
a supporting member for supporting the pressing member,
wherein the circuit board comprises a plurality of electrodes on a non-mounting surface that is opposite to a mounting surface with the semiconductor circuit element mounted thereon,
wherein the supporting member comprises an attaching portion to be fixed to a counterpart board that has a plurality of counterpart electrodes electrically connected to the plurality of electrodes,
wherein the supporting member integrally comprises a main body extending in a direction and a pair of arm portions extending in a second direction from both ends of the main body in the first direction so as to sandwich the optical connector,
wherein the first direction intersects with an extending direction of the optical fiber held by the optical connector and the second direction is orthogonal to the first direction,
wherein protrusions are formed on the pair of arm portions,
wherein the pressing member is an elastic plate and comprises a plate-shaped pressing-down portion and a pair of locked portions formed on both ends of the pressing member so as to sandwich the pressing-down portion,
wherein through-holes to be fitted to the protrusions are formed on the pair of locked portions,
wherein the supporting member comprises a heat-absorbing surface and a heat-dissipating surface,
wherein the heat-absorbing surface is thermally connected to the semiconductor circuit element, and
wherein the heat-dissipating surface dissipates heat of the semiconductor circuit element to be absorbed through the heat-absorbing surface.

2. The optical module according to claim 1 , wherein the pair of arm portions each comprise a fitting portion for fitting the circuit board thereto.

3. The optical module according to claim 1 , wherein the heat-absorbing surface is formed parallel to the circuit board while sandwiching the semiconductor circuit element in between,
wherein a gap between the heat-absorbing surface and the circuit board corresponds to a thickness of the semiconductor circuit element, and
wherein a heat transfer member for conducting heat from the semiconductor circuit element to the heat-absorbing surface is disposed between the heat-absorbing surface and the semiconductor circuit element.

4. The optical module according to claim 1 , wherein the optical connector is restricted from moving in a direction parallel to the circuit board by fitting a protrusion provided upright on the circuit board.

Assignees

• Hitachi Metals Ltd

Inventors

• Ishigami Yoshiaki
• Yamazaki Kinya
• Sunaga Yoshinori

Classifications

• G02B6/4219

  Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor · CPC title

• G02B6/4292

  the light guide being disconnectable from the opto-electronic element, e.g. mutually self aligning arrangements · CPC title

• G02B6/423

  using guiding surfaces for the alignment · CPC title

• G02B6/4269

  with heat sinks or radiation fins · CPC title

• G02B6/4268 Primary

  Cooling (of instruments G12B15/00; of electric apparatus H05K7/20; of semiconductor devices H10W76/47) · CPC title