Optical module

Patent metadata

Field	Value
Publication number	US-9229182-B2
Application number	US-201213722062-A
Country	US
Kind code	B2
Filing date	Dec 20, 2012
Priority date	Dec 20, 2011
Publication date	Jan 5, 2016
Grant date	Jan 5, 2016

Abstract

An optical module includes a circuit board, a photoelectric conversion element mounted on the circuit board, an optical connector for optically connecting the photoelectric conversion element and an optical fiber, a semiconductor circuit element mounted on the circuit board and electrically connected to the photoelectric conversion element, a pressing member for pressing and fixing the optical connector to the circuit board, and a supporting member for supporting the pressing member. The supporting member includes a heat-absorbing surface and a heat-dissipating surface. The heat-absorbing surface is thermally connected to the semiconductor circuit element. The heat-dissipating surface dissipates heat of the semiconductor circuit element to be absorbed through the heat-absorbing surface.

First claim

What is claimed is:

1. An optical module, comprising:
a circuit board;
a photoelectric conversion element mounted on the circuit board;
an optical connector for optically connecting the photoelectric conversion element and an optical fiber;
a semiconductor circuit element mounted on the circuit board and electrically connected to the photoelectric conversion element;
a rod-shaped elastic pressing member for pressing and fixing the optical connector to the circuit board; and
a supporting member for supporting the rod-shaped elastic pressing member,
wherein the circuit board comprises a plurality of electrodes on a non-mounting surface that is opposite to a mounting surface with the semiconductor circuit element mounted thereon,
wherein the supporting member comprises an attaching portion to be fixed to a counterpart board that has a plurality of counterpart electrodes electrically connected to the plurality of electrodes,
wherein the rod-shaped elastic pressing member comprises a supported portion to be supported by the supporting member so as to pivot about the supported portion,
wherein the supporting member comprises a fixing portion for fixing the rod-shaped elastic pressing member in a state that the optical connector is pressed by the rod-shaped elastic pressing member,
wherein the supporting member comprises a heat-absorbing surface and a heat-dissipating surface,
wherein the heat-absorbing surface is thermally connected to the semiconductor circuit element, and
wherein the heat-dissipating surface dissipates heat of the semiconductor circuit element to be absorbed through the heat-absorbing surface.

2. The optical module according to claim 1 , wherein the heat-absorbing surface is formed parallel to the circuit board while sandwiching the semiconductor circuit element in between,
wherein a gap between the heat-absorbing surface and the circuit board corresponds to a thickness of the semiconductor circuit element, and
wherein a heat transfer member for conducting heat from the semiconductor circuit element to the heat-absorbing surface is disposed between the heat-absorbing surface and the semiconductor circuit element.

3. The optical module according to claim 1 , wherein the optical connector is restricted from moving in a direction parallel to the circuit board by fitting a protrusion provided upright on the circuit board.

4. The optical module according to claim 1 , wherein the rod-shaped elastic member comprises at least one pressing portion and a handling portion, the at least one pressing portion pressing the optical connector in the pressed state, the handling portion being bent so that a space is formed between the handling portion and the optical connector in the pressed state.

Assignees

• Hitachi Cable
• Hitachi Metals Ltd

Inventors

• Ishigami Yoshiaki
• Yamazaki Kinya
• Sunaga Yoshinori

Classifications

• G02B6/4214

  the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device (G02B6/4246 takes precedence) · CPC title

• G02B6/4268 Primary

  Cooling (of instruments G12B15/00; of electric apparatus H05K7/20; of semiconductor devices H10W76/47) · CPC title

• G02B6/4292

  the light guide being disconnectable from the opto-electronic element, e.g. mutually self aligning arrangements · CPC title

• G02B6/423

  using guiding surfaces for the alignment · CPC title

• G02B6/4236

  Fixing or mounting methods of the aligned elements · CPC title