Quaternary phosphonium salt, epoxy resin composition for encapsulating semiconductor device and including the quaternary phosphonium salt, and semiconductor device encapsulated with the epoxy resin composition

Patent metadata

Field	Value
Publication number	US-9428632-B2
Application number	US-201314069564-A
Country	US
Kind code	B2
Filing date	Nov 1, 2013
Priority date	Dec 24, 2012
Publication date	Aug 30, 2016
Grant date	Aug 30, 2016

Abstract

A quaternary phosphonium salt, an epoxy resin composition including the quaternary phosphonium salt, and a semiconductor device encapsulated with the epoxy resin composition, the quaternary phosphonium salt being represented by Formula 1:

First claim

What is claimed is:

1. A salt that is a solid and consisting of a quaternary phosphonium salt represented by Formula 1:

wherein:
R 1 , R 2 , R 3 , and R 4 are each independently a substituted or unsubstituted C 1 -C 30 hydrocarbon group or a substituted or unsubstituted C 1 -C 30 hydrocarbon group including at least one heteroatom;
X is a substituted or unsubstituted C 1 -C 30 hydrocarbon group or a substituted or unsubstituted C 1 -C 30 hydrocarbon group including at least one heteroatom;
Y is a substituted or unsubstituted C 1 -C 30 hydrocarbon group or Si substituted with one to three substituted or unsubstituted C 1 -C 30 hydrocarbon groups, the substituted C 1 to C 30 hydrocarbon groups being each independently substituted with a halogen atom, a hydroxyl group, a C 1 -C 10 alkyl group, a C 1 -C 10 haloalkyl group, a C 6 -C 10 aryl group, a C 1 -C 10 alkoxy group, or a combination thereof;
n and m are each independently an integer of 1 to 6, provided that when Y is Si, a sum of m and a number of substituents on the Si is a maximum of 4; and
1 is a number greater than 0 and up to 6.

2. The salt as claimed in claim 1 , wherein R 1 , R 2 , R 3 , and R 4 are each independently a substituted or unsubstituted benzene group.

3. The salt as claimed in claim 1 , wherein X is a substituted or unsubstituted benzene group.

4. The salt as claimed in claim 1 , wherein Y is a substituted or unsubstituted benzene group, a substituted or unsubstituted naphthalene group, or Si substituted with one to three substituted or unsubstituted benzene groups.

5. The salt as claimed in claim 1 , wherein n is 2.

6. The salt as claimed in 1 , wherein m is 2 or 3.

7. The salt as claimed in claim 1 , wherein 1 is 2, 3, or 4.

8. A quaternary phosphonium salt represented by one of Formulae 1a to 1k:

9. An epoxy resin composition, comprising:
an epoxy resin,
a curing agent,
a curing accelerator, and
an inorganic filler,
wherein the curing accelerator includes a quaternary phosphonium salt represented by one of Formulae 1a to 1k:

10. The epoxy resin composition as claimed in claim 9 , wherein the epoxy resin composition includes:
about 1% to about 20% by weight of the epoxy resin,
about 1% to about 20% by weight of the curing agent,
about 0.001% to about 2% by weight of the curing accelerator, and
about 70% to about 95% by weight of the inorganic filler.

11. The epoxy resin composition as claimed in claim 9 , wherein the epoxy resin includes at least one of an epoxy resin obtained by epoxidation of condensation products of phenol or alkyl phenols and hydroxybenzaldehyde, a phenol novolac type epoxy resin, a cresol novolac type epoxy resin, a polyfunctional epoxy resin, a naphthol novolac type epoxy resin, a novolac type epoxy resin of bisphenol A/bisphenol F/bisphenol AD, a glycidyl ether of bisphenol A/bisphenol F/bisphenol AD, a bishydroxybiphenyl-based epoxy resin, a dicyclopentadiene-based epoxy resin, a biphenyl type epoxy resin, a polycyclic aromatic-modified epoxy resin, a bisphenol A type epoxy resin, an ortho-cresol novolac type epoxy resin, a phenol aralkyl type epoxy resin, or a naphthalene-based epoxy resin.

12. The epoxy resin composition as claimed in claim 9 , wherein the curing agent includes at least one of a phenol aralkyl type phenolic resin, a xyloc type phenolic resin, a phenol novolac type phenolic resin, a cresol novolac type phenolic resin, a naphthol type phenolic resin, a terpene type phenolic resin, a polyfunctional phenolic resin, a polycyclic aromatic phenolic resin, a dicyclopentadiene-based phenolic resin, a terpene-modified phenolic resin, a dicyclopentadiene-modified phenolic resin, a novolac type phenolic resin synthesized from bisphenol A and resorcinol, a polyhydric phenolic compound, an acid anhydride, a metaphenylenediamine, a diaminodiphenylmethane, or a diaminodiphenylsulfone.

13. The epoxy resin composition as claimed in claim 9 , wherein the epoxy resin and the curing agent are present in amounts such that a ratio of an epoxy equivalent weight of the epoxy resin to a phenolic hydroxyl equivalent weight or an amine equivalent weight of the curing agent is about 0.5:1 to about 2:1.

Assignees

• Kim Min Gyum
• Han Seung
• Cheon Hwan Sung
• Cheil Ind Inc

Inventors

• Kim Min Gyum
• Han Seung
• Cheon Hwan Sung

Classifications

• H10W74/473

  containing a filler · CPC title

• C08K5/50 Primary

  Phosphorus bound to carbon only · CPC title

• C07F9/5442

  Aromatic phosphonium compounds (P-C aromatic linkage) · CPC title

• C08L63/00

  Compositions of epoxy resins; Compositions of derivatives of epoxy resins · CPC title

• C08G59/688

  containing phosphorus · CPC title