Process for producing a group-III nitride crystal and process for producing a light-emitting semiconductor element or a semiconductor device comprising a group-III nitride crystal

US9428386B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9428386-B2
Application numberUS-201414229316-A
CountryUS
Kind codeB2
Filing dateMar 28, 2014
Priority dateJan 15, 2010
Publication dateAug 30, 2016
Grant dateAug 30, 2016

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Abstract

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Provided is a base substrate with which a Group-III nitride crystal having a large area and a large thickness can be grown while inhibiting crack generation. A single-crystal substrate for use in growing a Group-III nitride crystal thereon, which satisfies the following Z1>0 expression (1), wherein Z1 (μm) is an amount of warpage of physical shape in a growth surface of the single-crystal substrate and Z2<0 expression (2), wherein Z2 (μm) is an amount of warpage calculated from a radius of curvature of crystallographic-plane shape in a growth surface of the single-crystal substrate.

First claim

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The invention claimed is: 1. A method for producing a light-emitting semiconductor element or a semiconductor device, which comprises growing a Group-III nitride crystal on a growth surface of a single-crystal substrate, wherein the single-crystal substrate satisfies the following expressions (1) and (2) and has a back surface of concave shape, wherein Z1 (μm) is an amount of warpage of physical shape in a growth surface of the single-crystal substrate and Z2 (μm) is an amount of warpage calculated from a radius of curvature of crystallographic-plane shape in a growth surface of the single crystal substrate: Z 1>0  Expression (1) Z 2<0  Expression (2). 2. The method according to claim 1 , wherein the single-crystal substrate is a hexagonal crystal, and a crystallographic plane of the growth surface thereof is any one of a {0001} plane, a {10-10} plane, a {11-20} plane, a {11-22} plane, and a {20-21} plane. 3. The method according to claim 1 , wherein the single-crystal substrate comprises a Group-III nitride crystal. 4. The method according to claim 1 , wherein the single-crystal substrate has an area of 20 cm 2 or more. 5. The method according to claim 1 , wherein a thickness of the single-crystal substrate is 100 μm to 1,000 μm. 6. The method according to claim 1 , wherein the growth surface is a polished surface. 7. The method according to claim 1 , wherein in the step of growing a Group-III nitride crystal, the Group-III nitride crystal is vapor-phase grown. 8. The method according to claim 7 , wherein a method of vapor-phase growth is at least one method selected from the group consisting of an HVPE method, a MOCVD method, a MBE method or a sublimation method. 9. A method for producing a Group-III nitride crystal, which comprises growing a Group-III nitride crystal on a growth surface of a single-crystal substrate, wherein the single-crystal substrate satisfies the following expressions (1) and (2) and has a back surface of concave shape, wherein Z1 (μm) is an amount of warpage of physical shape in a growth surface of the single-crystal substrate and Z2 (μm) is an amount of warpage calculated from a radius of curvature of crystallographic-plane shape in a growth surface of the single crystal substrate: Z 1>0  Expression (1) Z 2<0  Expression (2). 10. The method according to claim 9 , wherein the single-crystal substrate is a hexagonal crystal, and a crystallographic plane of the growth surface thereof is any one of a {0001} plane, a {10-10} plane, a {11-20} plane, a {11-22} plane, and a {20-21} plane. 11. The method according to claim 9 , wherein the single-crystal substrate comprises a Group-III nitride crystal. 12. The method according to claim 9 , wherein the single-crystal substrate has an area of 20 cm 2 or more. 13. The method according to claim 9 , wherein a thickness of the single-crystal substrate is 100 μm to 1,000 μm. 14. The method according to claim 9 , wherein the growth surface is a polished surface. 15. The method according to claim 9 , wherein in the step of growing a Group-III nitride crystal, the Group-III nitride crystal is vapor-phase grown. 16. The method according to claim 15 , wherein a method of vapor-phase growth is at least one method selected from the group consisting of an HVPE method, a MOCVD method, a MBE method or a sublimation method. 17. The method according to claim 9 , which, after the step of growing the Group-III nitride crystal, further comprises removing the single-crystal substrate from the grown Group-III nitride crystal. 18. The method according to claim 9 , wherein the Group-III nitride crystal to be grown in the step of growing is a GaN crystal.

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What does patent US9428386B2 cover?
Provided is a base substrate with which a Group-III nitride crystal having a large area and a large thickness can be grown while inhibiting crack generation. A single-crystal substrate for use in growing a Group-III nitride crystal thereon, which satisfies the following Z1>0 expression (1), wherein Z1 (μm) is an amount of warpage of physical shape in a growth surface of the single-crystal subst…
Who is the assignee on this patent?
Mitsubishi Chem Corp
What technology area does this patent fall under?
Primary CPC classification C01B21/0632. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Aug 30 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).