Solder Alloy, Solder Paste, Solder Ball, Solder Preform, Solder Joint, Vehicle-Mounted Electronic Circuit, ECU Electronic Circuit, Vehicle-Mounted Electronic Circuit Device, and ECU Electronic Circuit Device
US-2024238914-A1 · Jul 18, 2024 · US
US9427829B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9427829-B2 |
| Application number | US-201414199179-A |
| Country | US |
| Kind code | B2 |
| Filing date | Mar 6, 2014 |
| Priority date | Sep 6, 2011 |
| Publication date | Aug 30, 2016 |
| Grant date | Aug 30, 2016 |
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The present invention relates to cured products of di- or poly-functional electron deficient olefins coated onto at least a portion of a surface of metal powders, such as metal powders used as appropriate in the formation of solder alloys, spheres and pastes.
Opening claim text (preview).
What is claimed is: 1. A metal particle having di- or poly-functional electron deficient olefin coated on at least a portion of a surface thereof, wherein the di- or poly-functional electron deficient olefin is embraced by the following structure wherein R 1 is C 1 -C 40 alkyl, C 2 -C 40 alkenyl, or C 3 -C 40 cycloalkyl group, with hydroxyl or alkoxy functionality and/or ether linkages being optional, and n is 2-4. 2. A metal particle according to claim 1 wherein the di- or poly-functional electron deficient olefin has a ceiling temperature below or equal to a melting point of the metal particle. 3. A metal particle according to claim 1 wherein the di- or poly-functional electron deficient olefin further comprises cyanoacrylate monomers embraced by the following structure: wherein R 1 is C 1 -C 40 alkyl, C 2 -C 40 alkenyl, or C 3 -C 40 cycloalkyl group, with hydroxyl or alkoxy functionality and/or ether linkages being optional, and n is 1. 4. A metal particle according to claim 1 wherein the cyanoacrylate is selected from the group consisting of 1,5-pentanediol bis-cyanoacrylate, 1,6-hexanediol bis-cyanoacrylate, 1,8-octanediol bis-cyanoacrylate, 1,9-nonanediol bis-cyanoacrylate, 1,10-decanediol bis-cyanoacrylate and 1,12-dodecanediol bis-cyanoacrylate. 5. A metal particle according to claim 1 wherein the metal particle is solder. 6. A metal particle according to claim 1 wherein the metal particle is made from elemental metals. 7. A metal particle according to claim 1 wherein the metal particle is made from an alloy. 8. A metal particle according to claim 1 wherein the metal particle is made from an elemental metal selected from the group consisting of tin, silver, copper, lead, zinc, indium, bismuth, and rare earth metals. 9. A metal particle according to claim 1 wherein the metal particle is made from an alloy selected from the group consisting of tin/silver/copper, tin/bismuth, tin/lead, tin/zinc and tin/indium/bismuth alloys. 10. A metal particle according to claim 1 wherein the polymer coating on the metal particle is less than about 5 μm in thickness. 11. A metal particle according to claim 1 wherein the polymer coating on the metal particle is in the range from about 0.0001 to about 3.0 μm in thickness. 12. A metal particle according to claim 1 wherein the polymer coating on the metal particle is in the range from about from 0.001 to about 1 μm in thickness. 13. A solder paste composition comprising the coated metal particle according to claim 1 . 14. A solder paste composition claim 13 wherein the coated metal particles are present in amount of from about 5 to about 98% by weight with respect to the total component. 15. A method of forming a polymer coated metal particle according to claim 1 which includes the steps of: a) providing a plurality of metal particles; b) applying a di- or poly-functional electron deficient olefin to substantially coat at least a portion of the surface of the metal particles; and c) permitting di- or poly-functional electron deficient olefin to cure as a polymer coating on the metal particles. 16. A method of forming a solder paste composition according to claim 13 which includes the steps of: a) providing solder powder comprising the coated metal particle; b) providing solder paste components; and c) blending the polymer coated solder powder with the solder paste components to form a solder paste.
Metallic powder coated with organic material · CPC title
Homopolymers or copolymers of acrylonitrile (C08L55/02 takes precedence) · CPC title
containing cyano groups and carboxyl groups, other than cyano groups, bound to the same unsaturated acyclic carbon skeleton · CPC title
Sn as the principal constituent · CPC title
Pastes, creams or slurries · CPC title
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