Apparatus and method for laser cutting with a laser implementing gas pulses, the frequency or pressure of which is controlled

US9427823B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9427823-B2
Application numberUS-201214350859-A
CountryUS
Kind codeB2
Filing dateOct 11, 2012
Priority dateOct 13, 2011
Publication dateAug 30, 2016
Grant dateAug 30, 2016

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

The head ( 9 ) of the cutting apparatus ( 4 ) of the laser comprises a gas supply through a device such as a barrel dispenser which chops the blowing flow rate, which produces a better discharge of the liquid slag melt by the laser beam ( 16, 18 ) out of the plate ( 19 ) to be cut. A measurement ( 36 ) of backscattered light is made in order to check the good quality of cutting, the amount measured being smaller if the cutting actually passes through the plate ( 19 ), and the frequency or the pressure of the blowing pulses is adjusted by a controlling device ( 39 ) to keep the measure to a minimum by optimizing the slag discharge conditions.

First claim

Opening claim text (preview).

The invention claimed is: 1. An automatic cutting method, comprising blowing a gas flow rate to a cutting location in order to sweep slag and gases produced by cutting, the blowing being performed through pulses, characterised in that it consists in continuously measuring a laser light backscatter intensity and modifying either a frequency, a pressure or both a frequency and a pressure of the pulses so as to keep said intensity to a minimum. 2. The automatic laser cutting method according to claim 1 , characterised in that the frequency or pressure is modified through steps. 3. The automatic laser cutting method according to claim 2 , characterised in that the frequency steps have a value between 1 Hz and 3 Hz. 4. The automatic laser cutting method according to claim 2 , characterised in that the pressure steps have a value lower than 1 bar. 5. The automatic laser cutting method according to claim 1 , characterised in that the frequency or pressure is comprised between limits, and when the limits are reached, an increase in the laser power is imposed. 6. The automatic laser cutting method according to claim 3 , characterised in that the frequency limits are 2 Hz and 20 Hz. 7. The automatic laser cutting method according to claim 4 , characterised in that the pressure limits are 1 bar and 15 bars. 8. The automatic laser cutting method according to claim 5 , characterised in that the increase in power is temporary. 9. A cutting apparatus, comprising a laser head ( 9 ) and a gas blowing auxiliary, the auxiliary comprising a gas supplying duct ( 13 , 15 ) and a gas blowing nozzle ( 11 , 29 ), downstream of the supplying duct, the nozzle being directed to the cutting location, the auxiliary comprising a device ( 12 , 24 ; 141 , 142 , 143 ) for splitting blowing into discontinuous repeated pulses, characterised in that the laser is a continuous beam laser having a power higher than 1 kW and the apparatus comprises a detector ( 36 ) having a light power backscattered by the cutting location and a device ( 39 ) for controlling either frequency or pressure, or frequency and pressure of the pulses in response to measurements of the detector.

Assignees

Inventors

Classifications

  • B23K26/032Primary

    using optical means · CPC title

  • taking account of the properties of the material involved · CPC title

  • by boring or cutting · CPC title

  • for the removal of by-products · CPC title

  • Inorganic materials other than metals or composite materials · CPC title

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What does patent US9427823B2 cover?
The head ( 9 ) of the cutting apparatus ( 4 ) of the laser comprises a gas supply through a device such as a barrel dispenser which chops the blowing flow rate, which produces a better discharge of the liquid slag melt by the laser beam ( 16, 18 ) out of the plate ( 19 ) to be cut. A measurement ( 36 ) of backscattered light is made in order to check the good quality of cutting, the amount meas…
Who is the assignee on this patent?
Commissariat L Energie Atomique Et Aux Energies Alternatives, Commissariat Energie Atomique
What technology area does this patent fall under?
Primary CPC classification B23K26/032. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Aug 30 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).