Optical waveguide structure with waveguide coupler to facilitate off-chip coupling
US-9103972-B2 · Aug 11, 2015 · US
Integrated photodetector waveguide structure with alignment tolerance
US9423582B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9423582-B2 |
| Application number | US-201514833639-A |
| Country | US |
| Kind code | B2 |
| Filing date | Aug 24, 2015 |
| Priority date | Jan 7, 2014 |
| Publication date | Aug 23, 2016 |
| Grant date | Aug 23, 2016 |
How to read this patent
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
- Title
What the patent document calls the invention.
- Abstract
A short plain-language summary of the technical disclosure.
- Assignees and inventors
Who owns or filed the patent and who is credited as inventor.
- Key dates
Filing, priority, publication, and grant dates set the timeline.
- First independent claim
The legal scope of protection — read this for what is actually claimed.
- CPC / IPC classifications
Technology tags used to group this patent with similar filings.
- Citations and related patents
Prior art links and similar publications in this corpus.
Abstract
Official abstract text for this publication.
An encapsulated integrated photodetector waveguide structures with alignment tolerance and methods of manufacture are disclosed. The method includes forming a waveguide structure bounded by one or more shallow trench isolation (STI) structure(s). The method further includes forming a photodetector fully landed on the waveguide structure.
First claim
Opening claim text (preview).
What is claimed is: 1. A sensor structure, comprising: a waveguide structure bounded by one or more shallow trench isolation (STI) structures; and a photodetector fully landed on the waveguide structure, adjacent to the one or more STI structures wherein the photodetector has a bottom and lateral sides, and the sensor structure further comprising an encapsulating material encapsulating the bottom and lateral sides of the photodetector, at least a portion of the encapsulating material encapsulating the lateral sides of the photodetector landing on the waveguide structure, the photodetector contacting the waveguide structure through a hole in the encapsulating material. 2. The sensor structure of claim 1 , wherein the waveguide structure is tapered. 3. The sensor structure of claim 1 , wherein the waveguide structure is continuously tapered. 4. The sensor structure of claim 3 , wherein the photodetector is continuously tapered. 5. The sensor structure of claim 4 , wherein the continuously tapered photodetector is fully landed on a planar surface of the continuously tapered waveguide structure. 6. The sensor structure of claim 4 , wherein the continuously tapered photodetector is formed as a double tapered photodetector. 7. The sensor structure of claim 6 , wherein the double tapered photodetector includes a taper at its input end portion. 8. The sensor structure of claim 6 , wherein the continuously tapered waveguide structure is formed from silicon material or silicon on insulator material.
Assignees
Inventors
Classifications
Circuit design · CPC title
Combinations of two or more optical elements · CPC title
by etching · CPC title
Coupling light guides with opto-electronic elements · CPC title
Optical features · CPC title
Patent family
Related publications grouped by family.
External sources
Frequently asked questions
Answers are generated from the same data shown on this page.
- What does patent US9423582B2 cover?
- An encapsulated integrated photodetector waveguide structures with alignment tolerance and methods of manufacture are disclosed. The method includes forming a waveguide structure bounded by one or more shallow trench isolation (STI) structure(s). The method further includes forming a photodetector fully landed on the waveguide structure.
- Who is the assignee on this patent?
- IBM
- What technology area does this patent fall under?
- Primary CPC classification G02B6/1228. Mapped technology areas include Physics.
- When was this patent published?
- Publication date Tue Aug 23 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).