Chip-inlaid flooring material using PLA resin

Patent metadata

Field	Value
Publication number	US-9422729-B2
Application number	US-201113978498-A
Country	US
Kind code	B2
Filing date	Jun 13, 2011
Priority date	Jun 13, 2011
Publication date	Aug 23, 2016
Grant date	Aug 23, 2016

Abstract

Disclosed herein is a chip inlaid flooring material using a PLA resin. The chip inlaid flooring material includes a chip inlaid layer, a dimension stabilizing layer, and a base layer, from the top of the flooring material, wherein at least one of the chip inlaid layer and the base layer includes polylactic acid (PLA) resin as a binder.

First claim

The invention claimed is:

1. A chip inlaid flooring material using a PLA resin, comprising:
a chip inlaid layer; and a base layer, from the top of the flooring material,
wherein at least one of the chip inlaid layer and the base layer comprises a polylactic acid (PLA) resin as a binder;
wherein the chip inlaid flooring material further comprises a fabric layer on a rear side of the base layer, wherein the fabric layer comprises at least one of jute, white hemp, cotton, and polyester;
wherein the chip inlaid flooring material further comprises a dimension stabilizing layer between the chip inlaid layer and the base layer, wherein the dimension stabilizing layer comprises glass fiber impregnated into at least one of an acrylic resin, a melamine resin or a PLA resin;
wherein the base layer further comprises a non-phthalate plasticizer, and an acrylic copolymer as a melt strength enhancer;
wherein the PLA resin comprises an amorphous PLA resin or a mixture of crystalline PLA resin and amorphous PLA resin; and
wherein the chip inlaid layer comprises 100 to 200 parts by weight of at least one selected from the group consisting of wood flour and chaff, and 10 to 20 parts by weight of pine resin, based on 100 parts by weight of the PLA resin.

2. The chip inlaid flooring material according to claim 1 , further comprising:
a surface treatment layer on a surface of the chip inlaid layer, the surface treatment layer comprising polyurethane, urethane acrylate, or wax.

3. The chip inlaid flooring material according to claim 1 , further comprising:
a bonding layer between the base layer and the fabric layer.

4. The chip inlaid flooring material according to claim 1 , wherein the chip inlaid layer has a thickness of 0.3 mm to 3.0 mm.

5. The chip inlaid flooring material according to claim 1 , wherein the chip inlaid layer further comprises at least one of a non-phthalate plasticizer, an acrylic copolymer as processing aids in the PLA resin and an anti-hydrolysis agent in addition to the PLA resin.

6. The chip inlaid flooring material according to claim 5 , wherein the acrylic copolymer has a weight average molecular weight (Mw) ranging from 800,000 to 6,000,000.

7. The chip inlaid flooring material according to claim 5 , wherein the anti-hydrolysis agent comprises carbodiimide or oxazoline.

8. The chip inlaid flooring material according to claim 5 , wherein the chip inlaid layer further comprises at least one of 5 to 100 parts by weight of the non-phthalate plasticizer, 0.1 to 20 parts by weight of the acrylic copolymer, 0.01 to 10 parts by weight of at least one of stearic acid and higher fatty acids as lubricants, 0.01 to 10 parts by weight of an acrylic resin, 10 parts by weight or less of the anti-hydrolysis agent, 500 parts by weight or less of calcium carbonate (CaCO 3 ), and 50 parts by weight or less of titanium dioxide (TiO 2 ), based on 100 parts by weight of the PLA resin.

9. The chip inlaid flooring material according to claim 1 , further comprising: a transparent layer on the chip inlaid layer.

10. The chip inlaid flooring material according to claim 9 , further comprising: a surface treatment layer formed on the transparent layer, the surface treatment layer comprising polyurethane, urethane acrylate, or wax.

11. The chip inlaid flooring material according to claim 9 , wherein the transparent layer comprises a PLA resin or an acrylic resin as a binder.

12. The chip inlaid flooring material according to claim 11 , wherein the transparent layer further comprises at least one of ATBC as a non-phthalate plasticizer, an acrylic copolymer as processing aids and an anti-hydrolysis agent in the PLA resin or the acrylic resin.

13. A chip inlaid flooring material using a PLA resin, comprising a chip inlaid layer and a fabric layer from the top of the flooring material,
wherein the chip inlaid layer comprises a PLA resin as a binder and a plurality of chips dispersed therein;
wherein the chip inlaid flooring material further comprises a fabric layer on a rear side of the base layer, wherein the fabric layer comprises at least one of jute, white hemp, cotton, and polyester;
wherein the chip inlaid flooring material further comprises a dimension stabilizing layer between the chip inlaid layer and the base layer, wherein the dimension stabilizing layer comprises glass fiber impregnated into at least one of an acrylic resin, a melamine resin or a PLA resin;
wherein the base layer further comprises a non-phthalate plasticizer, and an acrylic copolymer as a melt strength enhancer;
wherein the PLA resin comprises an amorphous PLA resin or a mixture of crystalline PLA resin and amorphous PLA resin; and
wherein the chip inlaid layer comprises 100 to 200 parts by weight of at least one selected from the group consisting of wood flour and chaff, and 10 to 20 parts by weight of pine resin, based on 100 parts by weight of the PLA resin.

14. The chip inlaid flooring material according to claim 13 , further comprising: a transparent layer formed on the chip inlaid layer.

15. The chip inlaid flooring material according to claim 14 , further comprising: a surface treatment layer formed on the transparent layer or the chip inlaid layer, the surface treatment layer comprising polyurethane, urethane acrylate, or wax.

Assignees

• Kwon Hyun-Jong
• Kim Ji-Young
• Park Ki-Bong
• Kang Chang-Won
• Kwon Jun-Hyuk
• Park Sang-Sun
• Kim Jang-Ki
• Lee Gyeong-Min
• Huang Cheng-Zhe
• Lg Hausys Ltd

Inventors

• Kwon Hyun-Jong
• Kim Ji-Young
• Park Ki-Bong
• Kang Chang-Won
• Kwon Jun-Hyuk
• Park Sang-Sun
• Kim Jang-Ki
• Lee Gyeong-Min
• Huang Cheng-Zhe

Classifications

• B32B2255/10

  on synthetic resin layer or on natural or synthetic rubber layer · CPC title

• B32B7/12

  using interposed adhesives or interposed materials with bonding properties · CPC title

• B32B2471/00

  Floor coverings (B32B2419/04 takes precedence) · CPC title

• B32B2255/26

  Polymeric coating · CPC title

• B32B27/12

  next to a fibrous or filamentary layer · CPC title