Polymerized film forming method

Patent metadata

Field	Value
Publication number	US-9422452-B2
Application number	US-201514619375-A
Country	US
Kind code	B2
Filing date	Feb 11, 2015
Priority date	Feb 18, 2014
Publication date	Aug 23, 2016
Grant date	Aug 23, 2016

Abstract

A polymerized film forming method for forming a polymerized film on a target surface of a workpiece using a first raw material gas which contains a first monomer and a second raw material gas which contains a second monomer differing from the first monomer includes: supplying the first raw material gas wherein difunctional non-aromatic amine having a hydrolyzable group is used for the first monomer; and supplying the second raw material gas wherein difunctional acid anhydride is used for the second monomer.

First claim

What is claimed is:

1. A polymerized film forming method for forming a polymerized film on a target surface of a workpiece using a first raw material gas which contains a first monomer and a second raw material gas which contains a second monomer differing from the first monomer, the method comprising:
supplying the first raw material gas wherein difunctional non-aromatic amine having a hydrolyzable group is used as the first monomer; and
supplying the second raw material gas wherein difunctional acid anhydride is used as the second monomer,
wherein the polymerized film is formed by repeating:
( 1 ) a reaction of dehydrating, condensing and polymerizing an amino group contained in the first monomer and acid anhydride contained in the second monomer;
( 2 ) a reaction of hydrolyzing the hydrolyzable group contained in the first monomer; and
( 3 ) a reaction of dehydrating, condensing and polymerizing the first monomer whose hydrolyzable group is hydrolyzed.

2. The method of claim 1 , wherein the first monomer is primary amine.

3. The method of claim 2 , wherein the hydrolyzable group is an alkoxy group.

4. The method of claim 3 , wherein the first monomer comprises alkoxy silane.

5. The method of claim 4 , wherein the first monomer is a silane coupling agent.

6. The method of claim 4 , wherein the polymerized film is a film of polyimide having an imide ring and a siloxane skeleton.

7. The method of claim 1 , wherein a film formation temperature of the polymerized film is a temperature at which a polymerized film formed at room temperature or higher is not pyrolyzed.

8. A polymerized film forming method for forming a polymerized film on a target surface of a workpiece using a first raw material gas which contains a first monomer and a second raw material gas which contains a second monomer differing from the first monomer,
wherein the polymerized film is formed by repeating:
( 1 ) a reaction of dehydrating, condensing and polymerizing the first monomer and the second monomer;
( 2 ) a reaction of hydrolyzing the first monomer; and
( 3 ) a reaction of dehydrating, condensing and polymerizing the hydrolyzed first monomer.

9. The method of claim 8 , wherein the first monomer is difunctional non-aromatic amine having a hydrolyzable group, and the second monomer is difunctional acid anhydride.

10. The method of claim 9 , wherein the polymerized film is a film of polyimide having an imide ring and a siloxane skeleton.

11. The method of claim 8 , wherein the first monomer is a silane coupling agent.

12. The method of claim 11 , wherein, before the reaction ( 1 ) or during the reaction ( 1 ), there are generated:
( 4 ) a reaction of hydrolyzing the first monomer; and
( 5 ) a reaction of bonding the hydrolyzed first monomer to the target surface of the workpiece.

13. The method of claim 8 , wherein a film formation temperature of the polymerized film is a temperature at which a polymerized film formed at room temperature or higher is not pyrolyzed.

Assignees

• Tokyo Electron Ltd

Inventors

• Yamaguchi Tatsuya
• Morisada Yoshinori

Classifications

• B05D1/60

  Deposition of organic layers from vapour phase (vapour phase deposition in general C23C14/00, C23C16/00) · CPC title

• C09D183/14 Primary

  in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms (C09D183/10 takes precedence) · CPC title

• C08G77/54

  Nitrogen-containing linkages · CPC title

• B05D1/34 Primary

  Applying different liquids or other fluent materials simultaneously · CPC title