Photoresist composition

US9417526B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9417526-B2
Application numberUS-201414573624-A
CountryUS
Kind codeB2
Filing dateDec 17, 2014
Priority dateJan 20, 2014
Publication dateAug 16, 2016
Grant dateAug 16, 2016

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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Abstract

Official abstract text for this publication.

A photoresist composition includes an acid-labile polymer that is decomposable by reaction with an acid, a photoacid generator, an organic base having a pK a value of 9 or less and a solvent. Based on 100 parts by weight of the acid-labile polymer, the photoacid generator is about 1 to about 30 parts by weight, and the organic base is about 0.1 to about 5 parts by weight. The solvent is about 50 to about 90 wt % based on the total weight of the composition.

First claim

Opening claim text (preview).

What is claimed is: 1. A photoresist composition, comprising: an acid-labile polymer that is decomposable by reaction with an acid, wherein the acid-labile polymer includes a copolymer represented by Chemical Formula 6 below: wherein 0.1≦x/(x+y+x)≦0.9, 0≦y/(x+y+x)≦0.3, 0.1≦z/(x+y+x)≦0.9, and R 5 is at least one of an acetal group, a ketal group and a t-butyl group, and a molecular weight of the copolymer is about 1,000 to about 500,000; a photoacid generator; an organic base having a pK a value of 9 or less; and a solvent, wherein, based on 100 parts by weight of the acid-labile polymer, the photoacid generator is about 1 to about 30 parts by weight, and the organic base is about 0.1 to about 5 parts by weight, and the solvent is about 50 to about 90 wt % based on the total weight of the composition. 2. The photoresist composition as claimed in claim 1 , wherein the organic base includes at least one selected from the group of aniline, triethanolamine, p-toluidine, and diethanolamine. 3. The photoresist composition as claimed in claim 1 , wherein the acid-labile polymer further includes at least one of repeating units represented by Chemical Formulas 2 and 3 below: wherein R1 is at least one selected from the group of an acetal group, a linear or branched alkyl group, an alkyl silicon group, a silicon alkoxy group, a 2-tetrahydropyranyl group, a vinyl ether group, a 2-tetrahydrofuranyl group, a 2,3-propylenecarbonate group, a methoxy ethoxy ethyl group, and an acetoxy ethoxy ethyl group, and R2 is at least one selected from the group of a linear or branched alkyl group, an alkyl silicon group, a silicon alkoxy group, a 2-tetrahydropyranyl group, a vinyl ether group, a 2-tetrahydrofuranyl group, a 2,3-propylenecarbonate group, a methoxy ethoxy ethyl group, and an acetoxy ethoxy ethyl group. 4. The photoresist composition as claimed in claim 1 , wherein the acid-labile polymer further includes a copolymer portion represented by any one of Chemical Formulas 4a to 4c below: wherein m and n are an integer of 0 to about 100, and the case where both m and n are 0 is excluded, and R1 is selected from the group of hydrogen (H), a linear or branched alkyl group, an acetal group, a 2-tetrahydropyranyl group, a vinyl ether group, a 2-tetrahydrofuranyl group, a 2,3-propylenecarbonate group, a methoxy ethoxy ethyl group, and an acetoxy ethoxy ethyl group, and R2 is selected from the group of hydrogen (H), a linear or branched alkyl group, a 2-tetrahydropyranyl group, a vinyl ether group, a 2-tetrahydrofuranyl group, a 2,3-propylenecarbonate group, a methoxy ethoxy ethyl group, and an acetoxy ethoxy ethyl group. 5. The photoresist composition as claimed in claim 1 , wherein the photoacid generator includes one or more selected from the group of a sulfonium salt-based compound, an iodonium salt-based compound, a sulfonyldiazomethane-based compound, an N-sulfonyloxyimide-based compound, and a sulfonate-based compound. 6. The photoresist composition as claimed in claim 1 , further comprising at least one of a melamine-based crosslinking agent and a silane coupling agent. 7. The photoresist composition as claimed in claim 1 , wherein R 5 is t-butyl. 8. A method of forming a device pattern for a display, the method comprising: forming an etching target material layer on a substrate; coating the photoresist composition as claimed in claim 1 on the etching target material layer to form a photoresist layer; and subjecting the photoresist layer to exposure and development. 9. The method as claimed in claim 8 , wherein the display is any one of an organic light-emitting display, a liquid crystal display and an electrophoretic display. 10. The method as claimed in claim 8 , wherein the device pattern is a wiring pattern or an electrode pattern.

Assignees

Inventors

Classifications

  • Photolithographic processes · CPC title

  • by chemical means · CPC title

  • the elements being connectible magnetically · CPC title

  • of phenols or of alcohols containing two or more carbon atoms · CPC title

  • A63H33/046Primary

    comprising magnetic interaction means, e.g. holding together by magnetic attraction · CPC title

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What does patent US9417526B2 cover?
A photoresist composition includes an acid-labile polymer that is decomposable by reaction with an acid, a photoacid generator, an organic base having a pK a value of 9 or less and a solvent. Based on 100 parts by weight of the acid-labile polymer, the photoacid generator is about 1 to about 30 parts by weight, and the organic base is about 0.1 to about 5 parts by weight. The solvent is about …
Who is the assignee on this patent?
Samsung Display Co Ltd
What technology area does this patent fall under?
Primary CPC classification A63H33/046. Mapped technology areas include Human Necessities.
When was this patent published?
Publication date Tue Aug 16 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).