Method for connecting inter-layer conductors and components in 3D structures

Patent metadata

Field	Value
Publication number	US-9414501-B2
Application number	US-201313829921-A
Country	US
Kind code	B2
Filing date	Mar 14, 2013
Priority date	Jan 4, 2012
Publication date	Aug 9, 2016
Grant date	Aug 9, 2016

Abstract

The present invention provides systems and methods for creating interlayer mechanical or electrical attachments or connections using filaments within a three-dimensional structure, structural component, or structural electronic, electromagnetic or electromechanical component/device.

First claim

What is claimed is:

1. A method of connecting a first component or conductor to a second component or conductor in a three-dimensional electronic, electromagnetic or electromechanical device comprising the steps of:
providing at least a first layer of a substrate material having the first component or conductor disposed on or within the first layer;
depositing a second layer of the substrate material on the first layer, wherein the second layer includes an elongated cavity having a first end and a second end such that the first end is disposed above a first exposed portion of the first component or conductor;
attaching a first end of a filament to the first exposed portion of the first component or conductor via the first end of the elongated cavity;
placing a second end of the filament within the second end of the elongated cavity such that the filament is disposed within the elongated cavity;
depositing a third layer of the substrate material on the second layer such that a first portion of the elongated cavity proximate to the first end of the elongated cavity is covered by the third layer and a second portion of the elongated cavity is exposed;
depositing the second component or conductor on or within the third layer proximate to the second portion of the elongated cavity;
depositing a fourth layer of the substrate material on the third layer such that a second portion of the second component or conductor is exposed and the second portion of the elongated cavity is exposed; and

removing the second end of the filament from the second portion of the elongated cavity and attaching the second end of the filament to the exposed second portion of the second component or conductor.

2. The method as recited in claim 1 , wherein the second end of the elongated cavity is larger than the first end of the elongated cavity.

3. The method as recited in claim 1 , wherein the elongated cavity comprises a keyhole shaped cavity or a spiral shaped cavity or a relief.

4. The method as recited in claim 1 , further comprising the step of covering the first end of the elongated cavity with the substrate material after the filament is placed within the elongated cavity.

5. The method as recited in claim 1 , wherein the elongated cavity is formed when the second layer of the substrate material is deposited on the first layer.

6. The method as recited in claim 1 , wherein the elongated cavity is created by removing a portion of the substrate material of the second layer.

7. The method as recited in claim 6 , wherein the portion of the substrate material of the second layer is removed using a micro-machining machine, a CNC micro-machining machine, a micro electrical discharge machining machine, an electrochemical machining machine, a direct write proton micro-machining machine, a laser ablation machine, a radiative source, an ultrasonic cutting machine, a hot wire cutting machine, a waterjet machine, an etching machine, a deep reactive ion etching machine, a plasma etching machine, a crystal orientation dependent etching machine, a wet bulk micromachining machine, a UV-lithography or X-ray lithography (LIGA) machine, a hot embossing lithography machine, a precision mechanical sawing machine, a chemically assisted ion milling machine, a sand blasting machine or a cutting machine.

8. The method as recited in claim 1 , wherein the first end of the filament is attached to the first component or conductor and the second end of the filament is attached to the second component or conductor using a laser micro-welding process.

9. The method as recited in claim 1 , wherein the first end of the filament is attached to the first component or conductor and the second end of the filament is attached to the second component or conductor using a wire bonding machine, a resistance welding machine, an ultrasonic welding machine, or a solder machine.

10. The method as recited in claim 1 , further comprising the step of creating one or more additional layers of the three-dimensional substrate by depositing the substrate material on the second layer in a layer-by-layer process.

11. The method as recited in claim 1 , wherein at least a portion of the first layer where the filament is embedded is not flat.

12. The method as recited in claim 1 , wherein the filament comprises a conductive material, a non-conductive material, an optical fiber or a mesh.

13. The method as recited in claim 12 , wherein:
the conductive material comprises a metal, a metal alloy, a conductive polymer or a wire;
the non-conductive material comprises one or more carbon fibers or one or more Kevlar fibers;
the mesh comprises a conductive mesh or a non-conductive mesh;

the conductive mesh comprises a set of filaments made of a metal, a metal alloy, a conductive polymer or a wire; and
the non-conductive mesh comprises a set of carbon fibers or Kevlar fibers.

14. The method as recited in claim 12 , wherein the mesh comprises a stainless steel mesh, an aluminum mesh, a copper mesh, a brass mesh, a steel mesh, a copper chromium mesh, or a copper-nickel alloy mesh.

15. The method as recited in claim 12 , wherein the mesh comprises a geometrical shape.

16. The method as recited in claim 12 , wherein the mesh comprises a heat sink, an antenna, a conductive plane, a mechanical reinforcement, or an electromagnetic shield.

17. The method as recited in claim 12 , wherein the mesh is embedded into the first layer to form a polymer-mesh composite material.

18. The method as recited in claim 12 , wherein the mesh is embedded into the first layer one portion at a time using a multi-step process.

19. The method as recited in claim 12 , wherein the mesh is embedded into the first layer in a single process step.

20. The method as recited in claim 12 , wherein the first layer includes a cavity and a portion of the mesh is disposed within the cavity.

21. The method as recited in claim 12 , wherein the mesh improves a physical characteristic, a thermal characteristic, or an electrical characteristic of the first layer, or the three-dimensional electronic, electromagnetic or electromechanical device.

22. The method as recited in claim 1 , wherein the first layer includes a cavity and a portion of the filament is disposed within the cavity.

23. The method as recited in claim 1 , wherein the filament improves a physical characteristic, a thermal characteristic, or an electrical characteristic of the first layer.

24. The method as recited in claim 1 , wherein the substrate material comprises a thermoplastic material, or a thermoplastic material which is filled with another polymer material, a ceramic material, a metallic material, a mineral material, a glass ceramic material, a semi-conductor material, a nanomaterial, a biomaterial, an organic material, an inorganic material or any combination thereof to enhance mechanical, thermal, dielectric, magnetic, or electromagnetic properties.

25. The method as recited in claim 24 , wherein the thermoplastic material comprises acrylonitrile butadiene styrene (ABS), ABSi, ABSplus, ABS-M30, ABS-M30i, ABS-ESDI, polycarbonate (PC), PC-ABS, PC-ISO, polyphenylsulfone (PPSF/PPSU), ULTEM 9085 or any combination thereof.

26. The method as recited in claim 25 , wherein the another polymer material comprises poly(methyl methacrylate) (PMMA), polypropylene, polyolefin, LL-PE, HDPE, polyvinyl acetate, polyester, polyether, polyamides, nylon, polyi

Assignees

• Univ Texas

Inventors

• Wicker Ryan B
• Medina Francisco
• Macdonald Eric
• Muse Danny W
• Espalin David

Classifications

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W72/07536

  Soldering or alloying · CPC title

• H10W72/07535

  Applying EM radiation, e.g. induction heating or using a laser · CPC title

• H10W72/07533

  Ultrasonic bonding, e.g. thermosonic bonding · CPC title

• H10W72/07532

  Compression bonding, e.g. thermocompression bonding · CPC title