Semiconductor device

Patent metadata

Field	Value
Publication number	US-9504154-B2
Application number	US-201414288825-A
Country	US
Kind code	B2
Filing date	May 28, 2014
Priority date	Jun 4, 2013
Publication date	Nov 22, 2016
Grant date	Nov 22, 2016

Abstract

A semiconductor device composed of a plurality of semiconductor modules exhibiting a large current carrying capacity for a semiconductor device as a whole is disclosed. The connection between the plurality of semiconductor modules is conducted by means of optimum construction suited to the semiconductor device. The device comprises a semiconductor module having externally connecting terminals protruding out of a casing, bus bars electrically connecting the specific externally connecting terminals of the plurality of semiconductor modules arranged in parallel with each other, and a semiconductor module case covering and fastening the plurality of semiconductor modules connected with the bus bars. The bus bars and the externally connecting terminals of the semiconductor modules are joined by means of laser welding.

First claim

What is claimed is:

1. A semiconductor device comprising:
a plurality of semiconductor modules, each having one or more semiconductor chips mounted on an insulated circuit board and contained in a casing, with externally connecting terminals connected to the semiconductor chips or the insulated circuit board protruding from the casing;
bus bars electrically connecting specific externally connecting terminals of the plurality of semiconductor modules arranged in parallel; and
a semiconductor module case having through-holes for protruding external terminals that are portions of the bus bars, and covering and fastening the plurality of semiconductor modules that are connected by the bus bars;
wherein the bus bars and the externally connecting terminals of the semiconductor modules are connected by means of laser welding.

2. The semiconductor device according to claim 1 , wherein the bus bar has through-holes capable of passing the externally connecting terminals through the through-holes, or recessed parts for making the terminals contact the recessed parts or grips for holding the terminals.

3. The semiconductor device according to claim 2 , wherein the bus bar is plated at least on a place at which the laser welding is conducted.

4. The semiconductor device according to claim 1 , wherein the bus bar is plated at least on a place at which the laser welding is conducted.

5. A semiconductor device comprising:
a plurality of semiconductor modules, each having one or more semiconductor chips mounted on an insulated circuit board and contained in a casing, with externally connecting terminals connected to the semiconductor chips or the insulated circuit board protruding from the casing;
bus bars electrically connecting specific externally connecting terminals of the plurality of semiconductor modules arranged in parallel;
a printed circuit board electrically connecting specific externally connecting terminals of the plurality of semiconductor modules, the specific externally connecting terminals being different from the externally connecting terminals connected to the bus bars; and
a semiconductor module case having through-holes for protruding external terminals that are portions of the bus bars, and covering and fastening the plurality of semiconductor modules that are connected by the bus bars;
wherein the printed circuit board and the externally connecting terminals of the semiconductor modules are connected by means of laser welding.

6. The semiconductor device according to claim 5 , wherein the printed circuit board has through-holes that allow the externally connecting terminals passing through the through-holes, or intermediate pins that are inserted into the through-holes and capable of passing the terminals through the intermediate pins or capable of making the terminals in contact with the intermediate pins.

7. The semiconductor device according to claim 6 , wherein the printed circuit board is plated at least on a place at which the laser welding is conducted.

8. The semiconductor device according to claim 5 , wherein the printed circuit board is plated at least on a place at which the laser welding is conducted.

Assignees

• Fuji Electric Co Ltd

Inventors

• Tada Shinji
• Mochizuki Eiji
• Nakamura Hideyo
• Horio Masafumi

Classifications

• H05K1/181

  associated with surface mounted components · CPC title

• H05K2201/10303

  Pin-in-hole mounted pins · CPC title

• H05K3/328

  by welding · CPC title

• H05K1/117 Primary

  Pads along the edge of rigid circuit boards, e.g. for pluggable connectors · CPC title

• H05K2201/10272

  Busbars, i.e. thick metal bars mounted on the printed circuit board [PCB] as high-current conductors · CPC title