Printed circuit board and magnetic field or current sensor

Patent metadata

Field	Value
Publication number	US-9410985-B2
Application number	US-201214343438-A
Country	US
Kind code	B2
Filing date	Sep 6, 2012
Priority date	Sep 7, 2011
Publication date	Aug 9, 2016
Grant date	Aug 9, 2016

Abstract

A printed circuit has a creep suppressor and a stack of metallization layers separated by electrically insulating layers. A metallization layer arranged above the insulating layer at least partially covers a cavity formed in the latter's top face. Prepreg arranged directly on the insulating layer below the metallization layer bonds the layers together. A magnetic core is housed in the cavity leaves at least a five micrometer gap between the cavity's vertical walls and roof and the core's facing vertical and top faces. During stack assembly, the creep suppressor prevents prepreg from flowing, by creep, into the cavity until it contacts more than 20% of the core's top face.

First claim

The invention claimed is:

1. An apparatus comprising a printed circuit, said printed circuit comprising a creep suppressor, a magnetic core, and a stack, wherein said stack comprises an insulating layer, metallization layers, and prepreg, wherein said metallization layers are stacked in a vertical direction, wherein said metallization layers are separated from each other by said electrically insulating layer, wherein said electrically insulating layer comprises a hollowed-out cavity formed in a top face thereof, wherein one of said metallization layers is arranged above said electrically insulating layer, wherein said metallization layer at least partially covers said cavity, wherein said prepreg is arranged directly on said electrically insulating layer, wherein said prepreg is arranged below said metallization layer, wherein said prepreg bonds said electrically insulating layer and said metallization layer together with no degree of freedom during assembly thereof, wherein said magnetic core has a length and a width, wherein said length is greater than said width, wherein said magnetic core is housed inside said cavity, wherein said magnetic core has transversal dimensions that are smaller than corresponding transversal dimensions of said cavity, wherein a gap of at least five micrometers exists between vertical walls and a roof of said cavity and facing vertical and top faces of said magnetic core, and wherein said creep suppressor prevents said prepreg from flowing, by creep, during assembly of said insulating and metallization layers, into said cavity until said prepreg comes into direct contact with said magnetic core over more than twenty percent of a surface of said top face of said magnetic core;
wherein said creep suppressor comprises a cap arranged between said prepreg and a top face of said magnetic core, wherein said top face faces toward said metallization layer, and wherein said cap covers said top face of said magnetic core over more than eighty percent of said length thereof; and
wherein said electrically insulating layer comprises two shoulders, wherein each shoulder has a shoulder depth in a vertical direction, wherein said two shoulders are hollowed out at an intersection between said cavity and said top face of said electrically insulating layer, wherein said cap comprises a plate, wherein said plate comprises edges, wherein said edges rest on said two shoulders, wherein said cavity has a cavity depth measured from said top face in the vertical direction, wherein said core has a vertical core thickness, and wherein said shoulder depth is less than an extent to which said cavity depth exceeds said vertical core thickness.

2. The apparatus of claim 1 , wherein said printed circuit further comprises at least one coil, and a bump contact, wherein said at least one coil is wound around said magnetic core, wherein said at least one coil comprises turns, wherein said turns are formed by conductive tracks produced in said metallization layers situated above and below said magnetic core, wherein said bump contact passes through said electrically insulating layer, and wherein said bump contact electrically connects said conductive tracks.

3. The apparatus of claim 1 , wherein said creep suppressor comprises a thermosetting resin incorporated in said prepreg, wherein, during a temperature rise, when said thermosetting reaches a glass transition temperature thereof, said resin has a viscosity of at least ten thousand pascal-seconds.

4. The apparatus of claim 1 , further comprising at least one of a magnetic field or a current sensor, said at least one of a magnetic field sensor or a current sensor being operatively coupled to said printed circuit and to said magnetic core thereof.

5. An apparatus comprising a printed circuit, said printed circuit comprising a creep suppressor, a magnetic core, and a stack, wherein said stack comprises an insulating layer, a metallization layers, and prepreg, wherein said metallization layers are stacked in a vertical direction, wherein said metallization layers are separated from each other by said electrically insulating layer, wherein said electrically insulating layer comprises a hollowed-out cavity formed in a top face thereof, wherein one of said metallization layers is arranged above said electrically insulating layer, wherein said metallization layer at least partially covers said cavity, wherein said prepreg is arranged directly on said electrically insulating layer, wherein said prepreg is arranged below said metallization layer, wherein said prepreg bonds said electrically insulating layer and said metallization layer together with no degree of freedom during assembly thereof, wherein said magnetic core has a length and a width, wherein said length is greater than said width, wherein said magnetic core is housed inside said cavity, wherein said magnetic core has transversal dimensions that are smaller than corresponding transversal dimensions of said cavity, wherein a gap of at least five micrometers exists between vertical walls and a roof of said cavity and facing vertical and top faces of said magnetic core, and wherein said creep suppressor prevents said prepreg from flowing, by creep, during assembly of said insulating and metallization layers, into said cavity until said prepreg comes into direct contact with said magnetic core over more than twenty percent of a surface of said top face of said magnetic core, and wherein said creep suppressor prevents said prepreg from flowing, by creep, during assembly of said insulating and metallization layers, into said cavity until said prepreg comes into direct contact with said magnetic core over more than twenty percent of a surface of said top face of said magnetic core; and
wherein said creep suppressor comprise a cap arranged between said prepreg and a top face of said magnetic core, wherein said top face faces toward said metallization layer, and wherein said cap covers said top face of said magnetic core over more than eighty percent of said length thereof;
wherein said cap comprises a soft material, wherein said soft material has a Young's modulus less than one tenth of a gigapascal, wherein said soft material is poured into said gap, and wherein said soft material covers more than eighty percent of said top face of said magnetic core.

6. An apparatus comprising a printed circuit, said printed circuit comprising a creep suppressor, a magnetic core, and a stack, wherein said stack comprises an insulating layer, a metallization layers, and prepreg, wherein said metallization layers are stacked in a vertical direction, wherein said metallization layers are separated from each other by said electrically insulating layer, wherein said electrically insulating layer comprises a hollowed-out cavity formed in a top face thereof, wherein one of said metallization layers is arranged above said electrically insulating layer, wherein said metallization layer at least partially covers said cavity, wherein said prepreg is arranged directly on said electrically insulating layer, wherein said prepreg is arranged below said metallization layer, wherein said prepreg bonds said electrically insulating layer and said metallization layer together with no degree of freedom during assembly thereof, wherein said magnetic core has a length and a width, wherein said length is greater than said width, wherein said magnetic core is housed inside said cavity, wherein said magnetic core has transversal dimensions that are smaller than corresponding transversal dimensions of said cavity, wherein a gap of at least five micrometers exists between vertical walls and a roof of said cavity and facing vertical and top faces of said magnetic core, and wherein said creep suppressor prevents said prepreg from flowing, by creep, during assembly of said insulat

Assignees

• Klein Philippe
• Commissariat L Energie Atomique Et Aux Energies Alternatives

Inventors

• Klein Philippe

Classifications

• H05K1/0201

  Thermal arrangements, e.g. for cooling, heating or preventing overheating · CPC title

• H05K1/165

  incorporating printed inductors · CPC title

• G01R1/04 Primary

  Housings; Supporting members; Arrangements of terminals · CPC title

• H05K3/4697

  having cavities, e.g. for mounting components (H05K3/4691 takes precedence) · CPC title

• G01R33/05

  in thin-film element · CPC title