Automatic power disconnect method
US-2016316571-A1 · Oct 27, 2016 · US
US9407015B1 · US · B1
| Field | Value |
|---|---|
| Publication number | US-9407015-B1 |
| Application number | US-201414585111-A |
| Country | US |
| Kind code | B1 |
| Filing date | Dec 29, 2014 |
| Priority date | Dec 29, 2014 |
| Publication date | Aug 2, 2016 |
| Grant date | Aug 2, 2016 |
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
What the patent document calls the invention.
A short plain-language summary of the technical disclosure.
Who owns or filed the patent and who is credited as inventor.
Filing, priority, publication, and grant dates set the timeline.
The legal scope of protection — read this for what is actually claimed.
Technology tags used to group this patent with similar filings.
Prior art links and similar publications in this corpus.
Official abstract text for this publication.
Systems and methods are disclosed for automatically disconnecting a power source in an electronic device. A data storage device is disclosed comprising a printed circuit board (PCB) and an electrical connector secured to the PCB, the electrical connector including a power pin having a power input contact portion configured to receive power from a communication interface connector, a substantially straight portion connected between the power input contact portion and a bend in the power pin, and an output arm connected between the bend at a first end and a power output contact portion at a second end, the power output contact portion being configured to be electrically coupled to the PCB via an electrical connection medium. The bend causes the output arm to lift away from the PCB when a bond between the power output contact portion and the electrical connection medium is broken.
Opening claim text (preview).
What is claimed is: 1. A data storage device comprising: a printed circuit board (PCB); an electrical connector at least partially secured to the PCB, the electrical connector comprising: a housing; and a power pin disposed at least partially within the housing, the power pin comprising: a power input contact portion configured to receive power from a communication interface connector; a substantially straight portion lying in a plane substantially parallel to a top surface of the PCB, the straight portion being connected between the power input contact portion and a bend in the power pin; and an output arm connected between the bend at a first end and an at least partially curved power output contact portion at a second end, the power output contact portion being configured to be electrically coupled to the PCB via an electrical connection medium; and an integrated circuit (IC) chip mounted on the PCB; wherein the data storage device is configured to transmit power received through the power pin to the IC chip via the electrical connection medium and one or more conductive traces of the PCB; and wherein the bend causes the output arm to lift away from the PCB when a bond between the power output contact portion and the electrical connection medium is broken. 2. The data storage device of claim 1 , wherein when the output arm lifts away from the PCB, the data storage device is further configured to cease transmitting power to the IC chip through the power pin. 3. The data storage device of claim 1 , wherein the output arm is substantially straight in a portion connected between the bend and the power output contact portion. 4. The data storage device of claim 1 , wherein the power output contact portion is substantially hook-shaped. 5. The data storage device of claim 1 , wherein the output arm is curved away from the surface of the PCB. 6. The data storage device of claim 1 , wherein the power pin includes one or more additional bends configured to cause the bond between the power output contact portion and the electrical connection medium to be broken when the electrical connection medium becomes at least partially melted. 7. The data storage device of claim 1 , wherein the electrical connection medium comprises solder, wherein electrical current in the power pin that is greater than a threshold level causes the connection medium to at least partially melt. 8. The data storage device of claim 7 , wherein the electrical connection medium comprises low-fusion solder having a melting point below approximately 180° C. 9. The data storage device of claim 1 , wherein the output arm is shaped to produce potential energy in a direction substantially away from the PCB when the output arm is pressed in a direction towards the top surface of the PCB, such that when the connection medium melts, the output arm has a tendency to lift away from the PCB, thereby breaking an electrical connection with the PCB.
Non-printed connector · CPC title
associated with surface mounted components · CPC title
High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board (H05K1/0293 takes precedence) · CPC title
Edge mounted components, e.g. terminals · CPC title
with a panel or printed circuit board · CPC title
Related publications grouped by family.
Answers are generated from the same data shown on this page.