Fabricating an optical assembly

Patent metadata

Field	Value
Publication number	US-9274289-B2
Application number	US-201213676351-A
Country	US
Kind code	B2
Filing date	Nov 14, 2012
Priority date	Dec 11, 2009
Publication date	Mar 1, 2016
Grant date	Mar 1, 2016

Abstract

Embodiments provide a horizontally movable stage, with an opening, of a flip-chip bonder, a substrate including at least one flexible portion and a waveguide, the waveguide exposed at one end edge of the substrate positioned upon the stage with the end edge over the opening, a vertically upwardly movable clamp sized to penetrate the stage opening and positioned underneath the stage, a vertically downwardly movable bond head above the stage opening, an optical component positioned in the head, a glue dispenser positioned to provide glue to either a mating surface of the substrate exposed end edge or a mating surface of the optical component, and a controller connected to the stage, clamp, head and dispenser, including a control circuit for positioning the substrate waveguide exposed end edge underneath the optical component while dispensing glue for fixably bonding the mating surfaces of the optical component and the substrate exposed end edge.

First claim

The invention claimed is:

1. A system for fabricating an optical assembly comprising:
a horizontally movable stage of a flip-chip bonder including having an opening;
a substrate including at least one flexible portion and further including a waveguide, the waveguide exposed at one end edge of the substrate positioned upon the stage with the end edge over the opening;
a vertically upwardly movable clamp sized to penetrate the stage opening and positioned underneath the stage;
a vertically downwardly movable bond head above the stage opening;
an optical component positioned in the bond head;
a glue dispenser positioned to provide a glue to either a mating surface of the substrate exposed end edge or a mating surface of the optical component; and
a controller connected to the stage, the clamp, the bond head and the glue dispenser including a control circuit for positioning the substrate waveguide exposed end edge underneath the optical component while dispensing glue for fixably bonding the mating surfaces of the optical component and the substrate exposed end edge.

2. The system according to claim 1 wherein the clamp includes a curved surface to engage the substrate.

3. The system according to claim 1 wherein the substrate includes a reinforcing strip located beneath a substrate portion adjacent to the substrate exposed end edge.

4. The system according to claim 3 wherein the clamp includes a curved surface to engage the substrate and further includes a formation sized to engage the reinforcing strip.

Assignees

• IBM

Inventors

• Oggioni Stefano Sergio
• Weiss Jonas R
• Offrein Bert Jan

Classifications

• H05K13/00

  Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components · CPC title

• G02B6/3885

  Multicore or multichannel optical connectors, i.e. one single ferrule containing more than one fibre, e.g. ribbon type (optical ribbon cable G02B6/4403, G02B6/448) · CPC title

• G02B6/4214

  the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device (G02B6/4246 takes precedence) · CPC title

• G02B6/13

  Integrated optical circuits characterised by the manufacturing method · CPC title

• H05K2203/0195

  Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure · CPC title