Flip-chip assembly process comprising pre-coating interconnect elements

Patent metadata

Field	Value
Publication number	US-9406662-B2
Application number	US-201414763095-A
Country	US
Kind code	B2
Filing date	Mar 21, 2014
Priority date	Mar 22, 2013
Publication date	Aug 2, 2016
Grant date	Aug 2, 2016

Abstract

A method of assembling a first and a second electronic components includes forming connection elements on an assembly surface of the first component and forming connection elements on an assembly surface of the second component. The method also includes depositing a liquid layer of electrically-insulating curable material on the assembly surface of the first and/or of the second component and arranging the first and second components on each other to place the connection elements of the second component in front of the connection elements of the first component. The method further includes applying a force along a predetermined direction and the first and/or the second components to create electric interconnects each formed of a connection element of the first component and of a connection element of the second component and curing the curable material.

First claim

The invention claimed is:

1. A method of assembling a first and a second electronic components, comprising:
forming connection elements on an assembly surface of the first component and forming connection elements on an assembly surface of the second component;
depositing a liquid layer of electrically-insulating curable material on the surface of assembly of the first and/or of the second component to coat at least the connection elements formed on said surface;
arranging the first and second components on each other to place the connection elements of the second component in front of the connection elements of the first component; applying a force along a predetermined direction on the first and/or the second components to create electric interconnects each formed of a connection element of the first component and of a connection element of the second component; and
curing the curable material,
wherein the connection elements of the first component are hollow inserts having an open end and the connection elements of the second component are solid element, having a smaller hardness than the inserts, the application of the force resulting in the hollow elements being inserted into the solid elements;
wherein each insert comprises:
a metal core, non-oxidized over at least a portion of its surface, and having a greater hardness than the solid elements; and
a metal layer covering at least said non-oxidized portion of the core, the first layer having a greater plasticity than the core and/or being made of a non-oxidizable metal;

wherein the geometry of the hollow inserts and the geometry of the solid elements, and/or the relative positioning thereof during insertion, are selected to leave a portion of the open end of the hollow inserts free during the insertion; wherein the curable material comprises no deoxidizing flux, and
wherein the open end of the hollow inserts has a plurality of branches partially arranged outside of the solid elements during the insertion.

2. The method of assembling a first and a second electronic components of claim 1 , wherein a length of the hollow inserts along an axis perpendicular to the assembly direction is greater than a length of the solid elements along said axis.

3. The method of assembling a first and a second electronic components of claim 1 , wherein the hollow inserts are inserted on one edge of the solid elements.

4. The method of assembling a first and a second electronic components of claim 1 , wherein the curable material has an electric resistivity greater than 10 12 ohms/cm.

5. A method of assembling a first and a second electronic components, comprising:
forming connection elements on an assembly surface of the first component and forming connection elements on an assembly surface of the second component;
depositing a liquid layer of electrically-insulating curable material on the surface of assembly of the first and/or of the second component to coat at least the connection elements formed on said surface;
arranging the first and second components on each other to place the connection elements of the second component in front of the connection elements of the first component; applying a force along a predetermined direction on the first and/or the second components to create electric interconnects each formed of a connection element of the first component and of a connection element of the second component; and
curing the curable material,
wherein the connection elements of the first component are hollow inserts having an open end and the connection elements of the second component are solid element, having a smaller hardness than the inserts, the application of the force resulting in the hollow elements being inserted into the solid elements;
wherein each insert comprises:
a metal core, non-oxidized over at least a portion of its surface, and having a greater hardness than the solid elements; and
a metal layer covering at least said non-oxidized portion of the core, the first layer having a greater plasticity than the core and/or being made of a non-oxidizable metal;

wherein the geometry of the hollow inserts and the geometry of the solid elements, and/or the relative positioning thereof during insertion, are selected to leave a portion of the open end of the hollow inserts free during the insertion;
wherein the curable material comprises no deoxidizing flux,
wherein the layer of curable material is deposited on a predetermined portion of the assembly surface, wherein the curable material is a negative photoresist capable of becoming insoluble in a predetermined developer consecutively to the application of a predetermined radiation, and wherein consecutively to the insertion of the hollow inserts into the solid elements:
said radiation is applied to the resin layer, except for the resin layer portion covering said portion of the assembly surface; and
the photoresist covering said area is removed by applying the developer.

6. The method of assembling a first and a second electronic components of claim 5 , wherein a length of the hollow inserts along an axis perpendicular to the assembly direction is greater than a length of the solid elements along said axis.

7. The method of assembling a first and a second electronic components of claim 5 , wherein the hollow inserts are inserted on one edge of the solid elements.

8. The method of assembling a first and a second electronic components of claim 5 , wherein the curable material has an electric resistivity greater than 10 12 ohms/cm.

Assignees

• Commissariat Energie Atomique
• Commisariat A L'Energie Atomique Et Aux Energies Alternatives

Inventors

• Marion François
• Bedoin Alexis
• Berger Frédéric
• Gueugnot Alain

Classifications

• H10W99/00

  Subject matter not provided for in other groups of this subclass · CPC title

• H10W72/0198

  batch processes · CPC title

• H10W74/15

  on active surfaces of flip-chip devices, e.g. underfills · CPC title

• H10W72/30

  Die-attach connectors · CPC title

• H10W72/07331

  Connecting techniques · CPC title