Package substrate and semiconductor package including the same
US-2024429153-A1 · Dec 26, 2024 · US
Method for fabricating two substrates connected by at least one mechanical and electrically conductive connection and structure obtained
US8928141B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8928141-B2 |
| Application number | US-201213983201-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jan 31, 2012 |
| Priority date | Feb 2, 2011 |
| Publication date | Jan 6, 2015 |
| Grant date | Jan 6, 2015 |
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- Title
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Abstract
Official abstract text for this publication.
A first substrate provided with a receiving area made from a first metallic material is supplied. A second substrate provided with an insertion area comprising a base surface and at least two bumps made from a second metallic material is arranged facing the first substrate. The bumps are salient from the base surface. A pressure is applied between the first substrate and the second substrate so as to make the bumps penetrate into the receiving area. The first metallic material reacts with the second metallic material so as to form a continuous layer of an intermetallic compound having a base formed by the first and second metallic materials along the interface between the bumps and the receiving area.
First claim
Opening claim text (preview).
The invention claimed is: 1. A method for securing two substrates comprising the following steps: providing a first substrate provided with a monoblock receiving area made from a first metallic material and a second substrate provided with an insertion area including a base surface and at least two bumps made from a second metallic material, the at least two bumps being salient from the base surface, applying a pressure between the first substrate and the second substrate so as…
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Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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Frequently asked questions
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- What does patent US8928141B2 cover?
- A first substrate provided with a receiving area made from a first metallic material is supplied. A second substrate provided with an insertion area comprising a base surface and at least two bumps made from a second metallic material is arranged facing the first substrate. The bumps are salient from the base surface. A pressure is applied between the first substrate and the second substrate so…
- Who is the assignee on this patent?
- Souriau Jean-Charles, Commissariat Energie Atomique
- What technology area does this patent fall under?
- Primary CPC classification H10W90/00. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Jan 06 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).