Pattern forming method and pattern forming apparatus

Patent metadata

Field	Value
Publication number	US-9403316-B2
Application number	US-201414311404-A
Country	US
Kind code	B2
Filing date	Jun 23, 2014
Priority date	Jan 26, 2007
Publication date	Aug 2, 2016
Grant date	Aug 2, 2016

Abstract

According to an aspect of the present invention, there is provided a pattern forming apparatus in which a mold having a pattern is brought into contact with an imprinting material on a substrate to transfer the pattern, the apparatus including: a holding part configured to hold the mold; a moving part configured to move the holding part so that the mold is brought into contact with the imprinting material on the substrate and that the mold is removed therefrom; and a control part configured to control so that at least one of conditions of removing the mold can be changed based on conditions of the pattern formed in the mold, the conditions including a rate and an angle of removing the mold.

First claim

What is claimed is:

1. A device manufacturing method, comprising:
preparing a mold having a pattern formed thereon and a substrate on a surface of which an imprinting material is applied;
performing a first shot of imprinting by bringing the mold into contact with the imprinting material on the substrate at a first portion to transfer the pattern thereto, and removing the mold therefrom at a first rate as a mold removal rate; and
performing a second shot of imprinting by bringing the mold into contact with the imprinting material on the substrate at a second portion to transfer the pattern thereto, and removing the mold therefrom at a second rate as the mold removal rate,
wherein the second portion on the substrate is different from the first portion on the substrate, and the second rate is different from the first rate.

2. The device manufacturing method according to claim 1 , further comprising:
checking a defect on the imprinting material after performing the first shot of imprinting.

3. The device manufacturing method according to claim 2 , wherein checking the defect on the imprinting material includes checking the number of the defects on the imprinting material.

4. The device manufacturing method according to claim 1 , wherein the mold removal rate for the first shot of imprinting is set based on a size of the pattern.

5. The device manufacturing method according to claim 1 , wherein the mold removal rate for the first shot of imprinting is set based on a density of the pattern.

6. The device manufacturing method according to claim 1 , wherein the mold removal rate for the first shot of imprinting is set based on at least one of a depth and a height of the pattern.

7. The device manufacturing method according to claim 2 , further comprising performing a third shot of imprinting based on a result of checking the defect.

Assignees

• Toshiba Kk

Inventors

• Yoneda Ikuo

Classifications

• B29L2031/34

  Electrical apparatus, e.g. sparking plugs or parts thereof · CPC title

• B29C59/002

  Component parts, details or accessories; Auxiliary operations · CPC title

• H10P76/4085

  characterised by the processes involved to create the masks · CPC title

• H10P74/203

  Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects · CPC title

• G03F7/0002

  Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping · CPC title