Methods and apparatus for temperature control of devices and mechanical resonating structures

Patent metadata

Field	Value
Publication number	US-9401693-B2
Application number	US-201313779416-A
Country	US
Kind code	B2
Filing date	Feb 27, 2013
Priority date	Jun 4, 2009
Publication date	Jul 26, 2016
Grant date	Jul 26, 2016

Abstract

Methods and apparatus for temperature control of devices and mechanical resonating structures are described. A mechanical resonating structure may include a heating element and a temperature sensor. The temperature sensor may sense the temperature of the mechanical resonating structure, and the heating element may be adjusted to provide a desired level of heating. Optionally, additional heating elements and/or temperature sensors may be included.

First claim

What is claimed is:

1. A device, comprising:
a substrate;
a piezoelectric mechanical resonating structure suspended above the substrate by first and second anchors and having
a first surface proximate the substrate;
a second surface substantially opposite the first surface and distal the substrate, the piezoelectric mechanical resonating structure comprising a first layer of material adjacent the second surface; and
two free ends substantially opposite each other;

an electrode configured to excite vibrations in the piezoelectric mechanical resonating structure;
a heating element, comprising a metal or a doped semiconductor, directly contacting the mechanical resonating structure and disposed between the substrate and the first layer of material adjacent the second surface, the heating element configured to alter a temperature of the piezoelectric mechanical resonating structure; and
a temperature sensor configured to detect the temperature of the mechanical resonating structure.

2. The device of claim 1 , wherein the heating element comprises the metal.

3. The device of claim 1 , wherein the heating element comprises the doped semiconductor.

4. The device of claim 1 , wherein the heating element is disposed within the mechanical resonating structure.

5. The device of claim 1 , wherein the heating element is disposed on the first surface of the mechanical resonating structure.

6. The device of claim 1 , wherein the heating element and temperature sensor are configured in a feedback loop.

7. The device of claim 6 , further comprising temperature control circuitry coupled to the temperature sensor and the heating element, and configured to receive an output signal of the temperature sensor indicative of the temperature of the piezoelectric mechanical resonating structure and to provide a control signal to the heating element to adjust an amount of heat produced by the heating element to set the temperature of the piezoelectric mechanical resonating structure to a target value.

8. The device of claim 1 , wherein the temperature sensor is a first temperature sensor, and wherein the device further comprises a second temperature sensor.

9. The device of claim 1 , wherein the two free ends are separated by a distance that is an integer multiple of one-half an acoustic wavelength of a Lamb wave supported by the piezoelectric mechanical resonating structure.

10. A method of operating a device having a piezoelectric mechanical resonating structure suspended above a substrate, the piezoelectric mechanical resonating structure having a first surface proximate the substrate and a second surface substantially opposite the first surface and distal the substrate, the piezoelectric mechanical resonating structure comprising a first layer of material adjacent the second surface, the method comprising:
exciting a Lamb wave in the piezoelectric mechanical resonating structure;
heating the piezoelectric mechanical resonating structure while exciting the Lamb wave by generating heat from a heating element disposed between the substrate and the first layer of material adjacent the second surface; and
sensing a temperature of the piezoelectric mechanical resonating structure using a temperature sensor.

11. The method of claim 10 , further comprising establishing a feedback loop by providing an indication of the temperature from the temperature sensor to temperature control circuitry and using a control signal from the temperature control circuitry to control the heating of the piezoelectric mechanical resonating structure.

12. The method of claim 10 , wherein heating the piezoelectric mechanical resonating structure comprises heating the piezoelectric mechanical resonating structure from within the piezoelectric mechanical resonating structure.

13. The method of claim 10 , wherein the heating element is disposed on the first surface, and wherein heating the piezoelectric mechanical resonating structure comprises heating the piezoelectric mechanical resonating structure from the first surface.

14. The method of claim 10 , wherein the heating element is a first heating element, and wherein the method further comprises heating the piezoelectric mechanical resonating structure with a second heating element disposed on the substrate.

15. A device, comprising:
a piezoelectric mechanical resonating structure suspended above a substrate by anchors coupled to first and second sides of the piezoelectric mechanical resonating structure;
a plurality of electrodes configured to excite a Lamb wave in the piezoelectric mechanical resonating structure;
a heating element disposed proximate a surface of the piezoelectric mechanical resonating structure facing the substrate; and
a temperature sensor configured to detect a temperature of the mechanical resonating structure.

16. The device of claim 15 , wherein the heating element is disposed within the mechanical resonating structure.

17. The device of claim 15 , wherein the heating element and temperature sensor are configured in a feedback loop.

18. The device of claim 15 , wherein the heating element is disposed on the surface of the mechanical resonating structure facing the substrate.

19. The device of claim 15 , wherein the heating element comprises a doped semiconductor.

20. The device of claim 15 , further comprising temperature control circuitry coupled to the temperature sensor and the heating element, and configured to receive an output signal of the temperature sensor indicative of the temperature of the piezoelectric mechanical resonating structure and to provide a control signal to the heating element to adjust an amount of heat produced by the heating element to set the temperature of the piezoelectric mechanical resonating structure to a target value.

Assignees

• Analog Devices Inc

Inventors

• Schoepf Klaus Juergen
• Rebel Reimund

Classifications

• H10W72/884

  Die-attach connectors and bond wires · CPC title

• H03H9/08 Primary

  Holders with means for regulating temperature · CPC title

• H03H9/2405

  of microelectro-mechanical resonators · CPC title

• H03H9/1057

  for microelectro-mechanical devices · CPC title

• H03H2009/241

  Bulk-mode MEMS resonators · CPC title