Package, resonation device, oscillator, electronic device, and moving object

Patent metadata

Field	Value
Publication number	US-9264015-B2
Application number	US-201414527190-A
Country	US
Kind code	B2
Filing date	Oct 29, 2014
Priority date	Oct 30, 2013
Publication date	Feb 16, 2016
Grant date	Feb 16, 2016

Abstract

A quartz crystal resonator includes a quartz crystal resonator element, a thermistor, a second layer including a first principal surface and a second principal surface, and a third layer having a through hole. internal terminals are provided on the first principal surface side, and electrode pads are provided in a portion exposed from the through hole on the second principal surface side. The quartz crystal resonator element is attached to the internal terminals, and the thermistor is attached to the electrode pads. Two mounting terminals are provided on a first diagonal line on the third principal surface side of the third layer, and two mounting terminals are provided on a second diagonal line. At least one of the two electrode pads is connected to any one of the two mounting terminals on the second diagonal line through a first conductive film provided on an inner wall of the through hole.

First claim

What is claimed is:

1. A package comprising:
a first substrate that includes a first principal surface and a second principal surface which serve as front and back sides, respectively; and
a second substrate that is laminated on the second principal surface side of the first substrate and has a through hole,
wherein a first electrode pad and a second electrode pad are provided on the first principal surface side of the first substrate,
wherein a third electrode pad and a fourth electrode pad are provided on the second principal surface side of the first substrate, and the third electrode pad and the fourth electrode pad are in the through hole in a plan view,
wherein a first mounting terminal and a second mounting terminal are provided on a first diagonal line on a third principal surface side of the second substrate which is opposite to the first substrate side, and a third mounting terminal and a fourth mounting terminal are provided on a second diagonal line intersecting the first diagonal line,
wherein the first electrode pad is connected to the first mounting terminal through a first wiring pattern provided on the second principal surface side of the first substrate,
wherein the second electrode pad is connected to the second mounting terminal through a second wiring pattern provided on the second principal surface side of the first substrate, and
wherein at least one of the third electrode pad and the fourth electrode pad is connected to any one of the third mounting terminal and the fourth mounting terminal through a first conductive film provided on an inner wall of the through hole.

2. A resonation device comprising:
a resonator element;
an electronic element;
a first substrate that includes a first principal surface and a second principal surface which serve as front and back sides, respectively; and
a second substrate that is laminated on the second principal surface side of the first substrate and has a through hole,
wherein a first electrode pad and a second electrode pad are provided on the first principal surface side of the first substrate,
wherein a third electrode pad and a fourth electrode pad are provided in a portion exposed from the through hole on the second principal surface side of the first substrate,
wherein the resonator element is attached to the first electrode pad and the second electrode pad,
wherein the electronic element is attached to the third electrode pad and the fourth electrode pad,
wherein a first mounting terminal and a second mounting terminal are provided on a first diagonal line on a third principal surface side of the second substrate which is opposite to the first substrate side, and a third mounting terminal and a fourth mounting terminal are provided on a second diagonal line intersecting the first diagonal line,
wherein the first electrode pad is connected to the first mounting terminal through a first wiring pattern provided on the second principal surface side of the first substrate,
wherein the second electrode pad is connected to the second mounting terminal through a second wiring pattern provided on the second principal surface side of the first substrate, and
wherein at least one of the third electrode pad and the fourth electrode pad is connected to any one of the third mounting terminal and the fourth mounting terminal through a first conductive film provided on an inner wall of the through hole.

3. The resonation device according to claim 2 , wherein a second conductive film is provided on the third principal surface side of the second substrate along an outer edge of the through hole.

4. The resonation device according to claim 3 , wherein the second conductive film is connected to the first conductive film.

5. The resonation device according to claim 2 , wherein a groove portion is provided between the third electrode pad and the fourth electrode pad.

6. The resonation device according to claim 3 , wherein a groove portion is provided between the third electrode pad and the fourth electrode pad.

7. The resonation device according to claim 4 , wherein a groove portion is provided between the third electrode pad and the fourth electrode pad.

8. The resonation device according to claim 2 , wherein a stepped portion recessed to the second principal surface side is provided in the third principal surface of the second substrate, and the through hole is provided in the stepped portion.

9. The resonation device according to claim 3 , wherein a stepped portion recessed to the second principal surface side is provided in the third principal surface of the second substrate, and the through hole is provided in the stepped portion.

10. The resonation device according to claim 4 , wherein a stepped portion recessed to the second principal surface side is provided in the third principal surface of the second substrate, and the through hole is provided in the stepped portion.

11. The resonation device according to claim 2 , wherein each of areas of the third electrode pad and the fourth electrode pad accounts for equal to or higher than 15% and equal to or less than 30%, when seen in a plan view, with respect to an area of an opening of the through hole.

12. The resonation device according to claim 11 , wherein each of areas of the third electrode pad and the fourth electrode pad accounts for equal to or higher than 19.5% and equal to or less than 23.5%, when seen in a plan view, with respect to the area of the opening of the through hole.

13. The resonation device according to claim 2 , wherein each of areas of the third electrode pad and the fourth electrode pad accounts for equal to or higher than 70% and equal to or less than 150%, when seen in a plan view, with respect to an area of the electronic element.

14. The resonation device according to claim 13 , wherein each of areas of the third electrode pad and the fourth electrode pad accounts for equal to or higher than 75% and equal to or less than 145%, when seen in a plan view, with respect to an area of the electronic element.

15. The resonation device according to claim 2 , wherein an outline of the through hole includes a curved line when seen in a plan view.

16. The resonation device according to claim 2 , wherein an outline of each of the mounting terminals on the through hole side includes a curved line when seen in a plan view.

17. The resonation device according to claim 2 , wherein the electronic element is a thermosensitive element.

18. An oscillator comprising:
the resonation device according to claim 2 ; and
a circuit.

19. An electronic device comprising the resonation device according to claim 2 .

20. A moving object comprising the resonation device according to claim 2 .

Assignees

• Seiko Epson Corp

Inventors

• Kikushima Masayuki
• Sato Toshiaki

Classifications

• H01L41/0472

  Electricity · mapped topic

• H03H9/08

  Holders with means for regulating temperature · CPC title

• H03H9/10

  Mounting in enclosures {(constructional combinations of enclosure with electromechanical and other electronic elements H03H9/0538)} · CPC title

• H03B5/32

  being a piezoelectric resonator (selection of piezoelectric material H10N30/00) · CPC title

• H03H9/172

  Means for mounting on a substrate, i.e. means constituting the material interface confining the waves to a volume · CPC title