Method of assembling a transducer assembly

Patent metadata

Field	Value
Publication number	US-9401575-B2
Application number	US-201414284621-A
Country	US
Kind code	B2
Filing date	May 22, 2014
Priority date	May 29, 2013
Publication date	Jul 26, 2016
Grant date	Jul 26, 2016

Abstract

A method of assembling a transducer assembly comprising a transducer and a conductor element, where one of the transducer and the conductor element includes holes and conducting parts, each conducting part being exposed in or at a hole and the other of the transducer and the conductor element includes elevated, electrically conducting elements. The method includes aligning the conductor element and the transducer so that each of the elevated elements extends into a separate hole of the holes and fixing the transducer to the conductor element by fixing each elevated element to the conducting parts of the pertaining hole.

First claim

The invention claimed is:

1. A method of assembling a transducer assembly comprising a transducer and a conductor element, the transducer including a print board, wherein:
the conductor element comprises a plurality of holes and conducting parts, each conducting part being exposed in or at a hole and
the transducer comprises a plurality of elevated, electrically conducting elements, the method comprising the steps of:
aligning the conductor element and the transducer so that each of the elevated elements extends into a separate hole of the holes
fixing the transducer to the conductor element by fixing each elevated element to the conducting parts of the pertaining hole
providing the elevated elements, the step of providing comprising:
forming a carrier element comprising therein or thereon electrical conductors, and
forming the elevated elements in a growing step used during the production of the print board.

2. A method according to claim 1 , wherein the fixing step is a press fitting step.

3. A method according to claim 1 , wherein the fixing step is a soldering step.

4. A method according to claim 1 , wherein the fixing step is a spot-welding step.

5. A method according to claim 1 , wherein a height of at least one elevated element is lower than a depth of the pertaining hole.

6. A method according to claim 1 , wherein the fixing step is a soldering step comprising adding solder to at least one of the holes.

7. A method according to claim 6 , wherein, during the soldering step, the elevated elements maintain a shape thereof.

8. The method according to claim 1 , wherein the aliging results in swift registration or auto-alignment of each elevated element within the corresponding hole of the holes.

9. The method according to claim 8 , wherein a thickness of the elevated elements is slightly lower than a height of the print board.

10. The method according to claim 9 , wherein the elevated elements have a flat top surface to yield a generally flat contact surface when fixed to the conducting parts of the pertaining hole of the holes.

11. The method according to claim 10 , wherein capillary forces keep soldering flux in an area between each of the elevated elements and the corresponding hole of the holes, thereby preventing an electrically conductive fluid or liquid or molten metal from flowing into a space between adjacent ones of the elevated elements.

12. The method according to claim 1 , wherein the elevated elements and the electrical conductors formed in or on the carrier element are composed of the same material.

13. The method according to claim 1 , wherein capillary forces keep soldering flux in an area between each of the elevated elements and the corresponding hole of the holes, thereby preventing an electrically conductive fluid or liquid or molten metal from flowing into a space between adjacent ones of the elevated elements.

14. The method according to claim 1 , wherein a thickness of the elevated elements is slightly lower than a height of the print board.

15. The method according to claim 1 , wherein the elevated elements have a flat top surface to yield a generally flat contact surface when fixed to the conducting parts of the pertaining hole of the holes.

16. A connector assembly comprising a connector element and a conductor element, wherein the connector element is part of a transducer, the transducer including a print board,
the conductor element comprising one or more holes and conducting parts, each conducting part being exposed in or at a hole and
the transducer comprising a plurality of elevated, electrically conducting elements, wherein the elevated elements form part of the transducer including the print board and are formed with a carrier element comprising therein or thereon electrical conductors in a growing step used during the production of the print board, and the conductor element and the transducer are aligned so that each of the elevated elements extends into a separate hole of the one or more holes,
each of the one or more holes is one of a positioning or a non-positioning hole.

17. A connector assembly according to claim 16 , wherein the holes are —arranged in an auto-alignment pattern.

Assignees

• Sonion Nederland Bv

Inventors

• Bosch Jozef Johannes Gerardus

Classifications

• H01R43/00 Primary

  Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors (of trolley lines B60M1/28) · CPC title

• H05K2203/168

  Wrong mounting prevention · CPC title

• Y02P70/613

  Cross-Sectional Technologies · mapped topic

• H05K3/303

  with surface mounted components (H05K3/32 takes precedence) · CPC title

• H05K2201/094

  Array of pads or lands differing from one another, e.g. in size, pitch or thickness; Using different connections on the pads · CPC title