Method for manufacture of wire bondable and solderable surfaces on noble metal electrodes

Patent metadata

Field	Value
Publication number	US-9401466-B2
Application number	US-201314435472-A
Country	US
Kind code	B2
Filing date	Nov 14, 2013
Priority date	Dec 5, 2012
Publication date	Jul 26, 2016
Grant date	Jul 26, 2016

Abstract

The present invention relates to a method for manufacture of wire bondable and solderable surfaces on noble metal electrodes. The noble metal electrodes are activated by depositing a seed layer of palladium or a palladium alloy layer by electroless plating at 60 to 90° C. Next, an intermediate layer is deposited onto the seed layer followed by deposition of the wire bondable and/or solderable surface finish layer(s) onto the intermediate layer. This method is particularly suitable in the production of optoelectronic devices such as light emitting diodes (LEDs).

First claim

The invention claimed is:

1. A method for manufacture of wire bondable and/or solderable surfaces on noble metal electrodes comprising, in this order, the steps of
i. providing a substrate having at least one noble metal electrode attached thereon,
ii. cleaning said at least one noble metal electrode,
iii. depositing onto said at least one noble metal electrode a seed layer selected from palladium and palladium alloys by electroless plating from an aqueous plating bath wherein said plating bath has a temperature in the range of 60 to 90° C. during deposition of said seed layer and wherein said plating bath comprises a source for palladium ions, a reducing agent and a complexing agent for palladium ions,
iv. depositing an intermediate layer selected from nickel alloys and cobalt alloys onto said seed layer by electroless plating,
v. depositing at least one surface finish layer onto the intermediate layer by electroless plating wherein said at least one surface finish layer is selected from the group consisting of palladium, palladium alloys, gold and gold alloys, with the proviso that a single surface layer consisting of gold is deposited by immersion plating and the gold layer of a multilayer surface finish is deposited either by immersion plating or electroless plating onto a palladium or palladium alloy layer.

2. The method for manufacture of wire bondable and solderable surfaces on noble metal electrodes according to claim 1 wherein the at least one electrode comprises one or more of platinum, gold and palladium.

3. The method for manufacture of wire bondable and solderable surfaces on noble metal electrodes according to claim 1 wherein the aqueous plating bath as applied in step iii. further comprises a sulfimide compound.

4. The method for manufacture of wire bondable and solderable surfaces on noble metal electrodes according to claim 3 wherein the sulfimide compound is saccharin.

5. The method for manufacture of wire bondable and solderable surfaces on noble metal electrodes according to claim 3 wherein the concentration of the sulfimide compound ranges from 0.001 to 0.1 mol/l.

6. The method for manufacture of wire bondable and solderable surfaces on noble metal electrodes according to claim 1 wherein the plating bath has a temperature in the range of 60 to 80° C. during deposition of said seed layer.

7. The method for manufacture of wire bondable and solderable surfaces on noble metal electrodes according to claim 1 wherein the seed layer is made of palladium.

8. The method for manufacture of wire bondable and solderable surfaces on noble metal electrodes according to claim 1 wherein the reducing agent in the plating bath for deposition of the seed layer is selected from the group consisting of formic acid, a derivative thereof and a salt thereof.

9. The method for manufacture of wire bondable and solderable surfaces on noble metal electrodes according to claim 1 wherein the substrate comprising at least one electrode is selected from sapphire wafers, silicon wafers and indium tin oxide wafers.

10. The method for manufacture of wire bondable and solderable surfaces on noble metal electrodes according to claim 1 wherein the at least one surface finish layer is a palladium layer.

11. The method for manufacture of wire bondable and solderable surfaces on noble metal electrodes according to claim 1 wherein the at least one surface finish layer is a gold layer.

12. The method for manufacture of wire bondable and solderable surfaces on noble metal electrodes according to claim 1 wherein the surface finish consists of a palladium layer and a gold layer plated on top of the palladium layer.

13. The method for manufacture of wire bondable and solderable surfaces on noble metal electrodes according to claim 3 wherein the at least one surface finish layer is a palladium layer.

14. The method for manufacture of wire bondable and solderable surfaces on noble metal electrodes according to claim 3 wherein the at least one surface finish layer is a gold layer.

15. The method for manufacture of wire bondable and solderable surfaces on noble metal electrodes according to claim 3 wherein the surface finish consists of a palladium layer and a gold layer plated on top of the palladium layer.

Assignees

• Atotech Deutschland Gmbh

Inventors

• Walter Andreas

Classifications

• H10W72/01935

  by plating, e.g. electroless plating or electroplating · CPC title

• H10W72/01933

  in liquid form, e.g. spin coating, spray coating or immersion coating · CPC title

• H10W72/01335

  by plating, e.g. electroless plating or electroplating · CPC title

• H10W72/01315

  Forming coatings · CPC title

• H10W72/952

  comprising metals or metalloids, e.g. PbSn, Ag or Cu · CPC title