Image sensor module and method for producing such a module

Patent metadata

Field	Value
Publication number	US-9401379-B2
Application number	US-201214004632-A
Country	US
Kind code	B2
Filing date	Jan 16, 2012
Priority date	Mar 16, 2011
Publication date	Jul 26, 2016
Grant date	Jul 26, 2016

Abstract

An image sensor module includes an image sensor bearer and an image sensor, the image sensor bearer being fashioned as an injection-molded circuit bearer, and the image sensor being situated on the image sensor bearer, and the image sensor bearer including at least one holding device that is integrally formed on the image sensor bearer.

First claim

What is claimed is:

1. An image sensor module, comprising:
an image sensor bearer configured as an injection-molded circuit bearer;
an image sensor situated on the image sensor bearer; and
an imaging optical system that includes at least two lenses,
wherein the image sensor bearer has a stepped interior surface to bear each of the at least two lenses and:
includes at least two holding devices for the imaging optical system,
is provided as respective mounts that supports the corresponding lenses in two directions parallel to a major plane of the image sensor, and

wherein the at least two holding devices are provided as respective mounts that support the corresponding lenses in two directions, each direction perpendicular to the major plane of the image sensor, are integrally formed on the image sensor bearer, and are situated one over the other in stepped fashion via the stepped interior surface of the image sensor bearer.

2. The image sensor module as recited in claim 1 , wherein the image sensor bearer includes conductive regions for electrical contacting of electrical components.

3. The image sensor module as recited in claim 2 , wherein the image sensor is connected to the conductive regions of the image sensor bearer via at least one electrically conductive connection for the electrical contacting.

4. The image sensor module as recited in claim 2 , further comprising:
at least one seal for protection against external particles.

5. The image sensor module as recited in claim 3 , wherein at least one region of the image sensor module is configured as an adjustment aid in the form of a pin.

6. The image sensor module as recited in claim 3 , wherein at least one heating device in the form of a thermoelectric layer is situated for tempering of the image sensor module.

7. A method for producing an image sensor module, comprising:
providing an imaging optical system that includes at least two lenses;
producing an image sensor bearer by injection molding, at least two holding devices being integrally formed on the image sensor bearer, wherein the at least two holding devices are configured to hold the imaging optical system; and
providing an image sensor on the image sensor bearer,
wherein the image sensor bearer supports the corresponding lenses in two directions parallel to a major plane of the image sensor,
wherein the image sensor bearer has a stepped interior surface to bear each of the at least two lenses, and
wherein the at least two holding devices are provided as respective mounts that supports the corresponding lenses in two directions perpendicular to the major plane of the image sensor, and situated one over the other in stepped fashion via the stepped interior surface of the image sensor bearer.

8. The method as recited in claim 7 , wherein the image sensor bearer is produced in one piece.

9. An image sensor module, comprising:
an image sensor bearer configured as an injection-molded circuit bearer;
an image sensor situated on the image sensor bearer; and
an imaging optical system that includes at least two lenses;
wherein the image sensor bearer includes at least two holding devices for the imaging optical system, and wherein the at least two holding devices are integrally formed on the image sensor bearer,
wherein the at least two holding devices are provided as respective mounts that are in contact with corresponding lenses,
wherein the image sensor bearer has a stepped interior surface to bear each of the at least two lenses, and
wherein the at least two holding devices are situated one over the other in stepped fashion via the stepped interior surface of the image sensor bearer, and
wherein spacing elements are placed between the lenses.

10. An image sensor module, comprising:
an image sensor bearer configured as an injection-molded circuit bearer;
an image sensor situated on the image sensor bearer; and
an imaging optical system that includes at least two lenses; and
at least one seal for protection against external particles;
wherein the image sensor bearer:
includes at least two holding devices for the imaging optical system,
is provided as respective mounts that supports the corresponding lenses in two directions parallel to a major plane of the image sensor, and

wherein the at least two holding devices are provided as respective mounts that support the corresponding lenses in two directions, each direction perpendicular to the major plane of the image sensor, are integrally formed on the image sensor bearer, and are situated one over the other in stepped fashion,
wherein the image sensor bearer includes conductive regions for electrical contacting of electrical components, and
wherein the holding device is configured as a plastic deformation of the image sensor bearer.

11. An image sensor module, comprising:
an image sensor bearer configured as an injection-molded circuit bearer;
an image sensor situated on the image sensor bearer;
an imaging optical system that includes at least two lenses; and
at least one light source located between the imaging optical system and the image sensor;
wherein the image sensor bearer includes at least two holding devices for the imaging optical system, and wherein the at least two holding devices are integrally formed on the image sensor bearer,
wherein the at least two holding devices are provided as respective mounts that are in contact with corresponding lenses, and
wherein the at least two holding devices are situated one over the other in stepped fashion.

12. The image sensor module as recited in claim 11 , wherein the image sensor bearer includes conductive regions for electrical contacting of electrical components.

13. The image sensor module as recited in claim 12 , wherein the image sensor is connected to the conductive regions of the image sensor bearer via at least one electrically conductive connection for the electrical contacting.

14. The image sensor module as recited in claim 12 , further comprising:
at least one seal for protection against external particles.

15. The image sensor module as recited in claim 14 , wherein the holding device is configured as a plastic deformation of the image sensor bearer.

16. The image sensor module as recited in claim 13 , wherein at least one region of the image sensor module is configured as an adjustment aid in the form of a pin.

17. The image sensor module as recited in claim 13 , wherein at least one heating device in the form of a thermoelectric layer is situated for tempering of the image sensor module.

Assignees

• Rohde Hartmut
• Seger Ulrich
• Kurzweil Thomas
• Apel Uwe
• Zimmermann Marc
• Beckerle Anja
• Zeh Klaus
• Brinks Gerald
• Bosch Gmbh Robert

Inventors

• Rohde Hartmut
• Seger Ulrich
• Kurzweil Thomas
• Apel Uwe
• Zimmermann Marc
• Beckerle Anja
• Zeh Klaus
• Brinks Gerald

Classifications

• H10W72/07251

  characterised by changes in properties of the bump connectors during connecting · CPC title

• H10W72/20

  Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps · CPC title

• H04N23/55

  Optical parts specially adapted for electronic image sensors; Mounting thereof · CPC title

• H04N23/57

  Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices · CPC title

• B60R11/04 Primary

  Mounting of cameras operative during drive; Arrangement of controls thereof relative to the vehicle · CPC title