Integrated circuit test temperature control mechanism

Patent metadata

Field	Value
Publication number	US-9400291-B2
Application number	US-201213600486-A
Country	US
Kind code	B2
Filing date	Aug 31, 2012
Priority date	Aug 31, 2012
Publication date	Jul 26, 2016
Grant date	Jul 26, 2016

Abstract

A thermal controller includes a thermal control interface to receive test data from an automated test equipment (ATE) system and dynamically adjust a target setpoint temperature based on the data and a dynamic thermal controller to receive the target setpoint temperature from the thermal control interface and control a thermal actuator based on the target setpoint temperature.

First claim

What is claimed is:

1. A thermal controller comprising:
a thermal control interface to receive test data from an automated test equipment (ATE) system and dynamically adjust a target setpoint temperature as the test data is received from the ATE system; and
a dynamic thermal controller communicatively coupled to the thermal control interface, wherein the dynamic thermal controller to receive the target setpoint temperature from the thermal control interface and control a thermal actuator based on the target setpoint temperature, wherein the dynamic thermal controller is coupled to the thermal actuator to control temperature of a device under test (DUT) during testing such that the dynamic thermal controller to transmit heating and cooling control signals to the dynamic thermal actuator to maintain the DUT at the target setpoint temperature, wherein the control signals are based on feedback temperatures of a conduction surface, wherein the feedback temperatures are received by the dynamic thermal controller from the thermal actuator.

2. The thermal controller of claim 1 further comprising a digital interface coupled between the thermal control interface and the dynamic thermal controller, wherein the target setpoint temperature is determined and adjusted based on one or more test-related conditions and one or more test program command.

3. The thermal controller of claim 2 wherein the digital serial interface comprises a two-wire interface, wherein the dynamic thermal controller is further to control the thermal actuator using a fast response control loop that accepts a streaming dynamic temperature setpoint value from a thermal control interface, wherein the thermal control interface receives the feedback temperature from the thermal actuator and transmits the streaming temperature setpoint value to a temperature control loop module within the dynamic thermal controller using the digital serial interface.

4. The thermal controller of claim 2 wherein the dynamic thermal controller receives the target setpoint temperature from the thermal control interface via the digital interface as part of a real time data stream.

5. The thermal controller of claim 4 wherein the dynamic thermal controller comprises a temperature control loop module to control the thermal actuator, wherein the temperature control loop module to facilitate fast control response, wherein a control response is faster than a temperature streaming update rate and a time constant of a temperature response of the thermal actuator.

6. The thermal controller of claim 5 wherein the thermal control interface receives feedback from the thermal actuator and transmits the target setpoint temperature to the temperature control loop module.

7. The thermal controller of claim 5 wherein the dynamic thermal controller further comprises a control and mode select module to enable selection of a mode of operation, wherein the mode of operation includes a traditional static mode or a dynamic mode.

8. A test system comprising:
a device under test (DUT);
an automated test equipment (ATE) system;
an integrated circuit (IC) device coupled the ATE system for testing of the DUT;
a thermal actuator coupled to the IC device to change a temperature of the IC device during testing; and
a thermal controller, to control the temperature of the IC device during testing, the thermal controller including:
a thermal control interface coupled to the ATE system to receive test data and dynamically adjust a target setpoint temperature as the test data is received from the ATE system; and
a dynamic thermal controller communicatively coupled to the thermal control interface, wherein the dynamic thermal controller coupled to the thermal control interface and the thermal actuator to receive the target setpoint temperature from the thermal control interface and control the thermal actuator based on the target setpoint temperature, wherein the dynamic thermal controller is coupled to the thermal actuator to control temperature of the DUT during testing such that the dynamic thermal controller to transmit heating and cooling control signals to the dynamic thermal actuator to maintain the DUT at the target setpoint temperature, wherein the control signals are based on feedback temperatures of a conduction surface, wherein the feedback temperatures are received by the dynamic thermal controller from the thermal actuator.

9. The test system of claim 8 wherein the thermal controller further comprises a digital interface coupled between the thermal control interface and the dynamic thermal controller, wherein the target setpoint temperature is determined and adjusted based on one or more test-related conditions and one or more test program command.

10. The test system of claim 9 wherein the digital serial interface comprises a two-wire interface, wherein the dynamic thermal controller is further to control the thermal actuator using a fast response control loop that accepts a streaming dynamic temperature setpoint value from a thermal control interface, wherein the thermal control interface receives the feedback temperature from the thermal actuator and transmits the streaming temperature setpoint value to a temperature control loop module within the dynamic thermal controller using the digital serial interface.

11. The test system of claim 9 wherein the dynamic thermal controller receives the target setpoint temperature from the thermal control interface via the digital interface as part of a real time data stream.

12. The test system of claim 11 wherein the dynamic thermal controller comprises a temperature control loop module to control the thermal actuator wherein the temperature control loop module to facilitate fast control response, wherein a control response is faster than a temperature streaming update rate and a time constant of a temperature response of the thermal actuator.

13. The test system of claim 12 wherein the thermal control interface receives feedback from the thermal actuator and transmits the target setpoint temperature to the temperature control loop module.

14. The test system of claim 12 wherein the dynamic thermal controller further comprises a control and mode select module to enable selection of a mode of operation, wherein the mode of operation includes a traditional static mode or a dynamic mode.

15. A method comprising:
receive test data, by a thermal control interface of a thermal controller, from an automated test equipment (ATE) system during testing of an integrated circuit (IC) device;
dynamically adjusting, by a dynamic thermal controller of the thermal controller, a target setpoint temperature as the data as the test data is received from the ATE system wherein the dynamic thermal controller is communicatively coupled to the thermal control interface;
forwarding, by the dynamic thermal controller, the target setpoint temperature to a thermal controller; and
controlling, by the dynamic thermal controller, a thermal actuator based on the target setpoint temperature, wherein the dynamic thermal controller is coupled to the thermal actuator to control temperature of a device under test (DUT) during testing such that the dynamic thermal controller to transmit heating and cooling control signals to the dynamic thermal actuator to maintain the DUT at the target setpoint temperature, wherein the control signals are based on feedback temperatures of a conduction surface, wherein the feedback temperatures are received by the dynamic thermal controller from the thermal actuator.

16. The method of claim 15 wherein the target setpoint temperature i

Assignees

• Johnson John C
• Maveety James G
• Detofsky Abram M
• Neeb James E
• Intel Corp

Inventors

• Johnson John C
• Maveety James G
• Detofsky Abram M
• Neeb James E

Classifications

• G01R1/06783

  containing liquids · CPC title

• G01R1/06722

  Spring-loaded · CPC title

• G01R31/2874 Primary

  related to temperature · CPC title

• G01R1/44 Primary

  Modifications of instruments for temperature compensation · CPC title

• G01R31/2642

  Testing semiconductor operation lifetime or reliability, e.g. by accelerated life tests · CPC title