Semiconductor module including a terminal embedded in casing wall and bent over thick portion of lid

Patent metadata

Field	Value
Publication number	US-9390987-B2
Application number	US-201414452931-A
Country	US
Kind code	B2
Filing date	Aug 6, 2014
Priority date	Sep 5, 2013
Publication date	Jul 12, 2016
Grant date	Jul 12, 2016

Abstract

Aspects of the invention provide a semiconductor module that can be manufactured without using a bending jig for bearing the stress in bending process of the terminal and scarcely generates cracks in the resin parts of the semiconductor module. In some aspects of the invention, a semiconductor module can include a casing made of a resin material accommodating a semiconductor chip, a terminal one end of which is electrically connected to the semiconductor chip and the other end of which is projecting out of the casing and bent and a lid made of a resin material fitted on an opening of the casing, a part of end region of the lid being in contact with the terminal and being a thick part with a thickness thicker than a thickness of other parts of the lid.

First claim

What is claimed is:

1. A semiconductor module comprising:
a casing made of a resin material accommodating a semiconductor chip;
a terminal, one end of which is directly electrically connected to the semiconductor chip, and another end of which is projecting out of the casing and bent; and
a lid made of a resin material fitted on an opening of the casing, a part of an end region of the lid being in contact with the terminal and being a thick part with a thickness thicker than a thickness of another part of the end region of the lid,
wherein a first portion of a horizontal section of the terminal is embedded in a silicone gel, a second portion of the horizontal section part of the terminal is embedded in a wall of the casing, a vertical section of the terminal is embedded in the wall of the casing, and a part of the vertical section of the terminal opposite to the part in contact with the thick part of the lid is covered with a wall of the casing,
wherein the thick part is an edge of the lid.

2. The semiconductor module according to claim 1 , wherein a lateral width of the thick part of the lid is wider than a lateral width of the terminal.

3. The semiconductor module according to claim 1 , wherein the terminal has a through-hole in a side of the other end of the terminal and is bent in a state such that it protrudes out of the casing, and the lid has a nut opposing the through-hole at a location spaced apart from the end region of the lid.

4. The semiconductor module according to claim 3 , wherein a transverse dimension of the through-hole is larger than the diameter of the screw hole of the nut, and the transverse dimension of the through-hole of the terminal is smaller than a longitudinal dimension of the through-hole.

5. The semiconductor module according to claim 3 , wherein the lid has a nut support under the nut for supporting the nut and the lid is provided with a space having a width larger than the diameter of the screw hole of the nut under the screw hole.

6. The semiconductor module according to claim 3 , wherein the thick part is in contact with a side of the terminal facing the nut.

7. The semiconductor module according to claim 1 , further comprising one or more engaging parts for engaging the casing and the lid.

8. The semiconductor module according to claim 1 , wherein a lateral width of a bending place of the terminal is narrower than that of other parts of the terminal.

9. The semiconductor module according to claim 1 , wherein a thickness of a bending place of the terminal is thinner than that of other parts of the terminal.

10. The semiconductor module according to claim 1 , comprising a plurality of the terminals that are connected to different parts of the semiconductor module.

Assignees

• Fuji Electric Co Ltd
• Fuji Electric Co Ltd

Inventors

• Oose Tomofumi

Classifications

• H10W76/47

  Solid or gel fillings · CPC title

• H10W76/136

  having other interconnections perpendicular to the conductive base · CPC title

• H10W72/00

  Interconnections or connectors in packages · CPC title

• H10W76/138 Primary

  having another interconnection being formed by a cover plate parallel to the conductive base, e.g. sandwich type · CPC title

• H01L2924/0002

  Electricity · mapped topic