Method and device for testing defect using SEM

Patent metadata

Field	Value
Publication number	US-9390490-B2
Application number	US-201013520210-A
Country	US
Kind code	B2
Filing date	Dec 22, 2010
Priority date	Jan 5, 2010
Publication date	Jul 12, 2016
Grant date	Jul 12, 2016

Abstract

In performing a programmed-point inspection of a circuit pattern using a review SEM, stable inspection can be performed while suppressing the generation of a false report even when a variation in a circuit pattern to be inspected is large. SEM images that are obtained by sequentially imaging a predetermined circuit pattern using the review SEM are stored into a storage unit. Images that meet a set condition are selected from the stored SEM images, and averaged to create an average image (GP image). By performing pattern check by GP comparison using this GP image, an inspection can be performed while suppressing the generation of a false report even when a variation in the circuit patterns is large.

First claim

The invention claimed is:

1. A defect check device using a SEM, comprising:
a scanning electron microscope unit with a table that mounts a sample thereon and is movable within a plane, the sample having a plurality of dies formed therein, the dies each having a pattern of a same shape;
a storage unit configured to store a SEM image of the sample that is obtained by imaging the sample mounted on the table by means of the scanning electron microscope unit;
an image processing unit configured to process the SEM image of the sample stored in the storage unit and detect a defect on the sample;
a user interface unit configured to input a condition for the image processing unit to process the SEM image of the sample, and output a result of the processing; and
a control unit configured to control the scanning electron microscope unit, the storage unit, the image processing unit, and the user interface unit, wherein
the control unit controls the scanning electron microscope unit to sequentially image a predetermined region of each of a plurality of dies formed on the sample and sequentially obtain the SEM image of the predetermined region of each of the plurality of dies, and store the sequentially obtained SEM images of the predetermined region into the storage unit, and wherein
the image processing unit creates reference images using an averaging process on the sequentially obtained SEM images of the predetermined region stored in the storage unit, and compares one of the created reference images with the sequentially obtained SEM images of the predetermined region stored in the storage unit to extract a defect, and classifies the extracted defect;
wherein said reference images comprise at least an average image for a center portion of the plurality of dies and an average image for a peripheral portion of the plurality of dies.

2. The defect check device using a SEM according to claim 1 , wherein the acquisition of the SEM image by imaging the sample by means of the scanning electron microscope unit and the detection of a defect on the sample by processing the SEM image of the sample stored in the storage unit by means of the image processing unit are asynchronously performed.

3. The defect check device using a SEM according to claim 1 or 2 , wherein the image processing unit creates reference images using a SEM image selected among a plurality of SEM images of a predetermined region stored in the storage unit.

4. The defect check device using a SEM according to claim 3 , wherein the image processing unit sets a specific one of visual feature quantities of a plurality of SEM images of a predetermined region stored in the storage unit to an index value, selects an image whose index value is within a predetermined range and creates the reference images.

5. The defect check device using a SEM according to claim 4 , wherein the predetermined range of the index value is set on the user interface unit.

Assignees

• Takagi Yuji
• Harada Minoru
• Nakagaki Ryo
• Hosoya Naoki
• Honda Toshifumi
• Hirai Takehiro
• Hitachi High Tech Corp

Inventors

• Takagi Yuji
• Harada Minoru
• Nakagaki Ryo
• Hosoya Naoki
• Honda Toshifumi
• Hirai Takehiro

Classifications

• H10P74/203

  Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects · CPC title

• G06T2207/30148

  Semiconductor; IC; Wafer · CPC title

• G06T2207/20081

  Training; Learning · CPC title

• G06T2207/10061

  from scanning electron microscope · CPC title

• G06T7/001 Primary

  using an image reference approach · CPC title