System and method to determine depth for optical wafer inspection

Patent metadata

Field	Value
Publication number	US-9389349-B2
Application number	US-201313840329-A
Country	US
Kind code	B2
Filing date	Mar 15, 2013
Priority date	Mar 15, 2013
Publication date	Jul 12, 2016
Grant date	Jul 12, 2016

Abstract

A computer-based method for inspecting a wafer, including: storing, in a memory element for at least one computer, computer readable instructions; detecting a first light beam rotating in a first spiral about a first central axis; and executing, using a processor for the at least one computer, the computer readable instructions to generate, using the detected first light beam, an image including at least one shape, determine an orientation of the at least one shape or a size of the at least one shape, and calculate a depth of a defect in the wafer according to the orientation or the size.

First claim

What is claimed is:

1. A computer-based method for inspecting a wafer, comprising:
storing, in a memory element for at least one computer, computer readable instructions;
detecting, using a detector, a first light beam rotating in a first spiral about a first central axis; and,
executing, using a processor for the at least one computer, the computer readable instructions to:
generate, using the detected first light beam, an image including at least one shape;
determine an orientation of the at least one shape or a size of the at least one shape; and,
calculate a depth of a defect within the wafer according to the orientation or the size, wherein:
the at least one shape includes a plurality of shapes; and,
determining the orientation of the at least one shape includes determining respective positions of the plurality of shapes with respect to rotation about a point in the image.

2. The computer-based method of claim 1 , further comprising:
illuminating, using a light source, the wafer with a second light beam rotating in a second spiral about a second central axis, wherein:
the first light beam includes the second light beam scattered by or reflected from the wafer.

3. The computer-based method of claim 1 , further comprising:
illuminating, using a light source, the wafer with light free of a spiral wavefront or orbital angular momentum; and,
filtering, using a phase and transmission filter, the light scattered by or reflected from the wafer to generate the first light beam.

4. The computer-based method of claim 1 , wherein:
the first light beam includes orbital angular momentum.

5. The computer-based method of claim 1 , further comprising executing, using the processor, the computer readable instructions to:
deconvolute, prior to determining the orientation, the image according to a predetermined orientation; or,
amplify a signal for the at least one shape when the shape matches the predetermined orientation, or attenuate a signal for the at least one shape when the shape does not match the predetermined orientation.

6. A computer-based apparatus for inspecting a wafer, comprising:
at least one computer including a processor and a memory element configured to store computer readable instructions; and,
a detector arranged to detect a first light beam rotating in a first spiral about a first central axis, wherein:
the processor is configured to execute the computer readable instructions to:
generate, using the detected first light beam, an image including at least one shape;
determine an orientation of the at least one shape or a size of the at least one shape; and,
calculate a depth of a defect within the wafer according to the orientation or the size;
the at least one shape includes a plurality of shapes; and,
determining the orientation of the at least one shape includes determining respective positions of the plurality of shapes with respect to rotation about a point in the image.

7. The computer-based apparatus of claim 6 , further comprising:
a light source arranged to emit light free of a spiral wavefront or orbital angular momentum; and,
a phase and transmission filter arranged to filter the light to generate a second light beam, rotating in a second spiral about a second central axis, to illuminate the wafer, wherein:
the first light beam includes the second light beam scattered by or reflected from the wafer.

8. The computer-based apparatus of claim 5 , further comprising:
a light source arranged to illuminate the wafer with light free of a spiral wavefront or orbital angular momentum; and,
a phase and transmission filter arranged to filter the light scattered by or reflected from the wafer to generate the first light beam.

9. The computer-based apparatus of claim 6 , wherein the processor is configured to execute the computer readable instructions to:
deconvolute, prior to determining the first orientation, the image according to a predetermined orientation; or,
amplify a signal for the at least one shape when the shape matches the predetermined orientation, or attenuate a signal for the at least one shape when the shape does not match the predetermined orientation.

10. The computer-based apparatus for inspecting a wafer, of claim 6 , wherein:
the wafer includes a silicon layer and a layer of silicon dioxide overlaying the silicon layer;
the surface is formed by the silicon dioxide layer; and,
the surface is not in contact with the silicon layer.

11. A computer-based method for inspecting a wafer, comprising:
storing, in a memory element for at least one computer, computer readable instructions;
detecting, using a detector, a first light beam rotating in a first spiral about a first central axis; and,
executing, using a processor for the at least one computer, the computer readable instructions to:
generate, using the detected first light beam, an image including at least one shape;
determine an orientation of the at least one shape or a size of the at least one shape; and,
calculate a depth, from a surface of the wafer, of a defect within the wafer according to the orientation or the size, wherein:
the wafer includes a silicon layer and a layer of silicon dioxide overlaying the silicon layer;
the surface is formed by the silicon dioxide layer;
the surface is not in contact with the silicon layer;
the at least one shape includes a plurality of shapes; and,
determining the orientation of the at least one shape includes determining respective positions of the plurality of shapes with respect to rotation about a point in the image.

12. The computer-based method for inspecting a wafer, of claim 1 , wherein the depth is measured from a surface of the wafer.

13. The computer-based method for inspecting a wafer, of claim 1 , wherein the defect extends to the surface.

14. The computer-based method for inspecting a wafer, of claim 1 , wherein the defect does not extend to the surface.

15. The computer-based method for inspecting a wafer, of claim 1 , wherein:
the wafer includes a silicon layer and a layer of silicon dioxide overlaying the silicon layer;
the surface is formed by the silicon dioxide layer; and,
the surface is not in contact with the silicon layer.

16. The computer-based method for inspecting a wafer, of claim 1 ,
wherein:
the wafer includes a plurality of layers, each layer including a respective material;
the defect is within at least one layer included in the plurality of layers; and,
the surface is formed by a first layer included in the plurality of layers; and,

wherein:
at least one layer in the plurality of layers includes separate segments of the respective material; or,
at least one layer in the plurality of layers includes a second material different from the respective material.

17. The computer-based method for inspecting a wafer, of claim 1 , further comprising:
generating the at least one shape in the at least one image using a phase and transmission filter inserted in the first light beam.

18. The computer-based apparatus of claim 6 , wherein the depth is measured from a surface of the wafer.

19. The computer-based apparatus of claim 6 , wherein the defect extends to the surface.

20. The computer-based apparatus of claim 6 , wherein the defect does not extend to the surface.

21. The computer-based apparatus of claim 6 ,
wherein:
the wafer includes a plurality of layers, each layer including a respective material;
the defect is within at least one layer included in th

Assignees

• Kla Tencor Corp

Inventors

• Kolchin Pavel
• Haurylau Mikhail
• Danen Robert

Classifications

• H04N23/56

  provided with illuminating means · CPC title

• G06T7/50

  Depth or shape recovery · CPC title

• G06T7/70

  Determining position or orientation of objects or cameras (camera calibration G06T7/80) · CPC title

• G06T7/0012

  Biomedical image inspection · CPC title

• G01N2021/8874

  Taking dimensions of defect into account · CPC title